アイテス List of Products and Services

The "ESD (HBM・MM) Testing Service" evaluates the resistance to damage caused by ESD (Electrostatic Discharge) using the Human Body Model and Machine Model, which are important for the reliability of semiconductor products and electronic components that include them. We support products such as IC modules, semiconductor products, and subsystems with up to 512 pins. We conduct tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. Additionally, if there are issues with resistance, we assist in problem-solving, including failure analysis and root cause investigation. 【Features】 ■ Supports products such as IC modules, semiconductor products, and subsystems with up to 512 pins ■ Partial support for products with more than 512 pins (consultation required) ■ Conducts tests in accordance with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC ■ Proposes and conducts tests based on customer requests and objectives ■ Assists in problem-solving, including failure analysis and root cause investigation, if there are issues with resistance *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

The "ESD (CDM) Testing Contract Service" evaluates the resistance of semiconductor products and electronic components, which are crucial for reliability, to damage caused by ESD in device charging models. It supports both Direct Charge Method (Direct CDM) and Field Induced Method (Field Induced CDM). Additionally, it is possible to determine damage through diode characteristic evaluation methods and other characteristic assessments (using separate equipment). 【Features】 ■ Compatible with various standard conditions such as JEDEC, JEITA (EIAJ also acceptable), and AEC through unit replacement. ■ Supports both Direct Charge Method (Direct CDM) and Field Induced Method (Field Induced CDM). ■ Also complies with AEC-Q100-011 for Direct Charge Method and Field Induced Method. ■ Damage determination is also possible through diode characteristic evaluation methods and other characteristic assessments. ■ Ensures reliable application through contact confirmation functions for applied pins. *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment

In this document, we introduce the microtome and knives, along with examples of cross-sectional observations. The "microtome" is a device used to prepare cross-sectional observation samples for TEM, SEM, and OM, utilizing glass knives or diamond knives for sample cutting. Glass knives are mainly used for sample preparation (trimming), while diamond knives are used for finishing. For the cross-sectional observation, the preparation of the cross-section was carried out on the gold-plated terminal part of a flexible cable. We encourage you to read it. [Contents] ■ Equipment and knives ■ Examples of cross-sectional observations *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

One of the features of EPMA is the guide network mapping method. In SEM-EDX, the measurement range is narrow, and surface analysis may not be accurately measured on curved samples. However, by using the guide network mapping method of EPMA, extensive analysis becomes possible. This method automatically measures adjacent continuous areas and displays them collectively, making it useful for measuring surfaces with uneven height differences or for measuring large surfaces. 【Features of the Guide Network Mapping Method】 ■ A method for automatically measuring adjacent continuous areas and displaying them collectively. ■ Used for measuring surfaces with uneven height differences or for measuring large surfaces. *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

Are you struggling with LCD analysis? We, at Aites, are here to help you find a solution! Structural Analysis: We evaluate and report on potential issues related to characteristics and structure in FPD products and advanced technologies that are constantly evolving. Failure Analysis: We approach and investigate the causes of manufacturing defects in increasing overseas products through the shortest route. Reliability Testing: Based on your objectives and needs, we propose the optimal reliability testing methods and conditions using our extensive know-how. [Contents] ■ Did you know? What is a display? ■ Panel analysis case studies ■ Tell me more! Aites' LCD analysis ■ Aites can perform these types of analyses!

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• Other PCs and OA equipment

We would like to introduce a case of foreign matter analysis conducted on laminated film. Upon inspecting the back side of the laminated film, a black foreign object was identified, prompting us to determine the source of this black foreign object and analyze its composition. First, we will consider the methods based on the objectives of the analysis. This time, we focused on the position of the foreign object and its composition, and decided to create a cross-section of the foreign object for elemental analysis. 【Case Overview】 ■ A black foreign object was identified upon inspecting the back side of the laminated film. ■ We determined the source and analyzed the composition of the black foreign object. ■ A cross-section of the foreign object was created, and elemental analysis was conducted. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system
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We will introduce a case study of fish-eye analysis of laminate film. In the multi-layer laminate film used for containers such as refillable shampoos, parts resembling foreign substances were observed. Upon magnified observation, they appeared to be several tens of micrometers in diameter and looked like fish eyes. To clarify the cause, cross-sectional observation was conducted. There are various methods for preparing cross-sections, but we implemented a mechanical polishing method that allows for extensive observation. 【Case Overview】 ■ Background: Discovered parts that appear to be foreign substances in the multi-layer laminate film ■ Purpose: Conducted cross-sectional observation to clarify the cause ■ Cross-section preparation method: Implemented a mechanical polishing method that allows for extensive observation *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system
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Our company is capable of conducting performance verification through good characteristic measurements, defective characteristic measurements, and reliability evaluations for specific TFTs in LCD panels. In the "Electrical Characteristic Measurement of TFTs at Various Temperatures," we can disassemble the monitor in display mode and perform electrical characteristic measurements on the pixel TFTs within the panel. In the "DC Bias Stress Test," we apply an arbitrary DC bias to the Gate and Drain and measure the Vth shift when stress is applied to the TFT, thereby confirming reliability. 【Features】 <Electrical Characteristic Measurement of TFTs at Various Temperatures> ■ Electrical characteristic measurements can be performed on the pixel TFTs within the panel. ■ Measurements can be conducted before and after annealing, under light exposure, heating, or cooling conditions. ■ From the measurement results, indicators such as Ion, Ioff, Vth, and mobility can be calculated. ■ Confirmation of actual values in good product analysis and clarification of defect causes can be performed. *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection

This document introduces a mass spectrometry guide. In the analysis of organic compounds, information is obtained and analyzed using various analytical methods based on the functional groups, skeletal structures, and masses of the compounds. There are various methods for analyzing the mass of compounds, each with its own strengths in terms of the type of analysis and targets. Additionally, these methods can be selectively used according to the application or combined with other analytical techniques to obtain the necessary information. [Contents] ■ Methods mainly used in mass spectrometry - GC-MS - LC-MS - MALDI-TOFMS - GPC *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system
• Other analytical equipment
• Measurement and Analysis Equipment

This document introduces a colorimeter that quantifies the color of objects. When light is irradiated onto an object, optical phenomena occur on the surface and inside the object, allowing for the quantification of the object's color by detecting the scattered light. As an example, we present test results that quantify the color differences between conditions where water-based paint was irradiated with ultraviolet (UV) light and conditions without UV treatment. We encourage you to download and take a look. [Contents] ■ Colorimeter (Device Structure) ■ L*a*b* Color Space ■ Visual Inspection of Water-Based Paint and Conversion to L*a*b* Color Space *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce examples of observation and analysis of coating films used in various products such as automobiles and mobile phones. The "Triple Ion Polisher (CP)" can process samples containing both hard and soft materials without causing damage, while the "Microtome" is capable of not only producing cross-sections but also performing planar inclined cutting. Additionally, the "Desktop Oblique Cutting Machine" can extract sample surfaces that are 6 to 300 times the original thickness as surface information, and the "Desktop SEM (Scanning Electron Microscope)" has a mode for observation under low vacuum (charge reduction), allowing for the observation and elemental analysis of samples that release volatile components. [Observation of Plastic Coating (Mobile Phone Case)] - Triple Ion Polisher (CP) - Microtome - Desktop Oblique Cutting Machine - Desktop SEM (Scanning Electron Microscope) *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Plastic molded products made by injection molding undergo processes such as resin melting, filling into molds, cooling, and pressure holding. If these conditions are not appropriate, internal stress (residual stress) may remain, leading to molding defects. The two-dimensional birefringence measurement system can visualize birefringent phase differences (strain) and flow direction/stress direction (principal axis orientation), which are indicators of that stress. As an example, we will introduce a birefringence evaluation comparing polystyrene (PS) molded products under different heating conditions. 【Device Principle】 ■ When light is applied to a transparent body with birefringence, its polarized state changes. ■ By using a birefringence measurement device, it is possible to visualize the polarization information with a dedicated polarization image sensor. ■ By using wavelengths of 523nm, 543nm, and 575nm, birefringence can be evaluated by comparing the polarized states before and after passing through the transparent body. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

There are many types of thermoplastic resins, among which ABS is widely used in various products due to its unique molecular structure. As an engineering plastic, ABS resin is utilized in a wide range of fields, including electronic products, automobiles, home appliances, and IT-related products. We examined the characteristic IR spectrum of ABS resin using FT-IR analysis. [Shapes] ■Head to tail ■Head to head ■Tail to tail *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We would like to introduce a case study of ion chromatography analysis conducted by our company (solid surfaces). Solid surfaces can also be measured using ion chromatography by extracting them into a solution. Additionally, average data can be obtained for sample surfaces larger than a few centimeters, making it suitable for relative comparisons of flat samples such as printed circuit boards. You can view the analysis flow for liquid samples and solid surfaces by downloading the PDF below. 【Overview of Liquid Sample Analysis】 ■ Liquid samples are introduced into the device for measurement after solution preparation such as dilution or filtration. ■ Measurement results are reported in solution concentration [mg/L]. *For more details, please refer to the PDF document or feel free to contact us.

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• Other services and technologies

In our evaluation of the properties of various materials, it can be said that glass plates with less indentation are harder, while plastic cases with more indentation are softer. Additionally, glass plates and plastic cases with a high recovery amount have a higher proportion of elasticity, whereas metals with a low recovery amount have a higher proportion of plasticity. Furthermore, we also evaluate material properties that can be understood from the diagrams. Please feel free to contact us if you have any inquiries. 【Overview】 ■ Evaluation of the properties of each material ■ Material properties discernible from diagrams *For more details, please refer to the PDF document or feel free to contact us.

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• Other services and technologies

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
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The biggest advantage of angled CT is that it allows for non-destructive CT observation. It is suitable for obtaining planar information and can provide information for each layer in a multilayer substrate. Additionally, by using a length measurement tool, it is also possible to measure lengths. In our measurements, we observed a difference of about 7-14% compared to the results from optical microscopy, but it seems effective for those who want to understand internal structures non-destructively. Please feel free to contact us when needed. 【Features】 ■ Non-destructive CT observation ■ Suitable for obtaining planar information ■ Capable of obtaining information for each layer in multilayer substrates *For more details, please refer to the PDF document or feel free to contact us.

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Polyethylene resin is a versatile plastic that is commonly found and used in many applications. Depending on the application, the reaction processes (synthesis/polymerization) differ, such as soft types and hard types. Due to the differences in synthesis/polymerization, it is divided into low-density polyethylene (LDPE) and high-density polyethylene (HDPE). Our company has analyzed the subtle spectral differences using FT-IR. For more details, please refer to the PDF download below. 【Overview】 ■Polyethylene polymerization process ■IR measurement results ■Spectral overlay and spectral analysis ■Testing and evaluation analysis services *For more details, please refer to the PDF document or feel free to contact us.

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• Other services and technologies

The materials that make up the product vary, but if there is significant or uneven internal stress during the manufacturing process, it can lead to issues such as deformation, cracking, and reduced properties during use and in the operating environment. By using 'WPA (Wide Polarization Analysis)', it is possible to understand internal stress and strain conditions by evaluating the orientation, strain, and birefringence of the material. Please feel free to consult with us. 【Features】 ■ Ability to understand internal stress and strain conditions ■ Clarification of material strain and birefringence from a molecular perspective ■ Analysis of defects and theories using multiple methods in a matrix - Raman spectroscopy (qualitative/strain/crystallinity), XRD (X-ray diffraction), AFM/SEM/TEM (crystal structure observation), DSC (degree of crystallization), etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment

The quality of diamonds is determined by the 4Cs (Cut, Color, Carat, Clarity). Clarity refers to the degree of inclusions and blemishes. I took a look at the clarity using a microscope, and I would like to share my findings. Even items that appear clean at first glance may have inclusions or cracks when magnified. The microscope allows us to observe tiny defects that cannot be seen with the naked eye. Additionally, we also conduct inspections and observations of semiconductor electronic components and silicon chips using the microscope. Please feel free to contact us if you need our services. 【Features】 ■ Capable of observing tiny defects that cannot be seen with the naked eye using a microscope ■ Inspections and observations of semiconductor electronic components and silicon chips are also conducted *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Measurement and Analysis Equipment

We would like to introduce the internal condition of aluminum electrolytic capacitors that have malfunctioned due to aging degradation, which was confirmed using X-ray CT. In degraded products, the internal pressure rises due to gas generated from the decomposition of the electrolyte, and as degradation progresses, there is a risk that the electrolyte may spout out due to the opening of the pressure relief valve. Additionally, it is believed that the gradual volatilization of the electrolyte occurs due to the deformation of the rubber cap, leading to eventual capacity loss and open failure. 【Overview】 ■Appearance Comparison - Conducted visual inspection of normal and degraded products. ■Internal Comparison using X-ray CT - Conducted internal observation of normal and degraded products using X-ray CT. *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case comparing the analysis of lithium (Li) using TOF-SIMS and SEM-EDX. While SEM-EDX is used for the analysis of contamination and foreign substances, detecting Li with general EDX, excluding windowless EDX, is difficult. On the other hand, TOF-SIMS can detect Li with high sensitivity. Please feel free to contact us if you need assistance. 【Overview】 ■ Analysis of stains on copper plates ■ SEM-EDX analysis → Difficult to detect Li ■ TOF-SIMS analysis → Li detectable *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment

Thermal analysis is a method for identifying defective areas by detecting the heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting the heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and analyzing electronic components that are difficult to analyze with OBIRCH or emission methods is also possible ■ By using the lock-in function to obtain phase information, it is possible to accurately identify the heat generation points *For more details, please refer to the PDF document or feel free to contact us.

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At AITES, we are conducting a structural analysis of Nylon 6.10. Nylon possesses flexibility and a texture similar to silk, while also having high strength and durability that natural fibers lack, being "stronger than steel and finer than spider silk." We will elucidate these characteristics at the molecular level using our FT-IR and pyrolysis GC-MS. 【Nylon 6.10 Interfacial Polymerization Reaction Mechanism】 1. Electron withdrawal by chlorine leads to a deficiency of electrons in adjacent carbon. 2. Non-bonding electrons from amine attack the carbon nucleophilically. 3. An oxygen atom is activated to form an unstable intermediate. 4. Hydrogen chloride is eliminated, forming an amide bond. 5. Interfacial polymerization progresses, resulting in polymerization. *For more details, please refer to the PDF document or feel free to contact us.

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We conduct "pigment and polymer analysis using MALDI-TOFMS." With "MALDI-TOFMS," it is possible to obtain molecular weight information for insoluble substances such as pigments and large molecules, molecular weight information for synthetic polymers, and information on terminal groups. Please feel free to contact us for mass confirmation of synthetic compounds or for structural analysis in combination with other analytical methods. 【Features】 ■ Adoption of Matrix-Assisted Laser Desorption Ionization Mass Spectrometry (MALDI) ■ Ability to obtain information regarding the composition of compounds ■ Suitable for analyzing polymers that are small compared to GPC and large compared to LCMS ■ Mass numbers are detected as absolute values *For more details, please refer to the PDF document or feel free to contact us.

• Non-destructive testing

Various defects such as cracks, discoloration, delamination, deformation, and reduced material strength can occur in products and components. Many of these issues are often caused by the materials that make up the products, and analyzing these materials can sometimes lead to solutions. This document introduces methods to approach what is happening through chemistry and reaction mechanisms. [Contents] ■ Cracks (breaks), delamination ■ Discoloration, deformation ■ Chemical reaction mechanisms (example of epoxy resin curing) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

At AITES, we conduct "Simple Measurement of Band Gap Using XPS." It is possible to simply measure the band gaps of materials and thin films with relatively wide band gaps among semiconductors and insulators using XPS. When measuring the band gap of β-Ga2O3 using the O1s peak, the band gap of β-Ga2O3 was measured to be approximately 4.9 eV, based on the difference between the O1s peak position and the energy loss edge due to the band gap. 【Features】 ■ Simple measurement can be performed using XPS ■ Simple measurement of thin films with wide band gaps, such as SiON, is also possible ■ Compatible with semiconductors other than oxide-based materials *For more details, please refer to the PDF materials or feel free to contact us.

• Other measuring instruments

There are many types of vinyl polymers, and they exhibit various properties depending on the molecular structure of their side chains. Additionally, differences in crystallinity arise from the bonding configuration of these side chains (stereoisomers). In this document, we present the results of IR analysis of representative vinyl polymers, including polyethylene, polypropylene, polystyrene, and polyvinyl chloride (PVC). Aites conducts advanced data analysis based on chemical theory, ensuring that even subtle differences are not overlooked. Please feel free to consult us at any time. [Contents] ■ Analysis Sample: Vinyl Polymers ■ IR Spectrum (ATR Method) ■ IR Spectrum Comparison (Overlay) *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

At AITES, we conduct "Authenticity Investigations (Comparative Observations)." We compare the item under investigation with genuine or standard products to examine differences in structure and to check for any silent changes. We support various observations, including visual inspections, unboxing observations, electrical property measurements, destructive and non-destructive observations, reliability testing, and material investigations. 【Features】 ■ Comparison of the item under investigation with genuine or standard products ■ Investigation of differences in structure and checks for any silent changes *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Polarizing films and light diffusion films are used in LCD products and design applications. They may deteriorate due to environmental conditions such as temperature and humidity, which can lead to a decline in their polarizing and diffusion properties, affecting LCD screens and designs. This document presents case studies analyzing the deterioration caused by temperature and humidity stress using FT-IR. [Contents] - Sample used and its properties - Deterioration analysis results of polarizing films (Comparison of IR spectra before and after testing at 70°C and 85% humidity for 1 week) - Deterioration analysis results of light diffusion films (Comparison of IR spectra before and after testing at 70°C and 85% humidity for 1 week) - Other available analytical methods *For more details, please refer to the PDF document or feel free to contact us.

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• Other services and technologies

PMMA (acrylic), PET (polyethylene terephthalate), and PC (polycarbonate) are utilized in many applications, taking advantage of their characteristic transparency. They are essential materials for industrial products such as peripheral components of liquid crystal displays, protective films for mobile device screens, headlight covers, optical fibers, and textiles. This document presents the results of IR analysis of these raw materials (pellets). [Contents] ■ Analysis samples: Characteristics of ester/carbonate-based polymers ■ IR spectra (ATR method) ■ Spectral comparison (overlay) ■ Other related analysis services *For more details, please refer to the PDF document or feel free to contact us.

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• Other services and technologies

Aites analyzed photopolymerization initiators in UV-curable resins using GCMS and detected Irgacure 184, a type of photoinitiator (light radical polymerization initiator). There are various structures of photoinitiators, and the wavelength of light they absorb and their reaction mechanisms differ depending on their structure. Such substances cannot be identified through main component analysis like IR, making thermal desorption GCMS analysis effective. Our company conducts characterization of various materials by analyzing and identifying trace components in materials using thermal desorption GCMS. Please feel free to contact us when needed. [Examples of photoinitiators] ■ Light radical polymerization initiators ■ Photoinitiators for positive photoresists ■ Light crosslinking agents for negative photoresists *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray tomography to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

EPMA has superior detection resolution compared to EDX. Even in cases where the detection positions of elements are close in EDX, making peak separation difficult, it may be possible to achieve peak separation with EPMA. This document introduces the peak separation of 47Ag and 17Cl. It includes cross-sectional observations of chip resistors, X-ray spectra of 47Ag, and mapping comparisons. [Contents] - Peak separation of 47Ag and 17Cl - X-ray spectrum of 47Ag - Mapping comparison *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Our company utilizes various surface analysis techniques to assist in resolving issues such as foreign substances, discoloration, and contamination. We conduct a wide range of analyses, from micro-regions to bulk samples, including "EDX," which is energy-dispersive X-ray analysis, "AES," which detects Auger electrons using electron beams, and "XPS," which allows for the analysis of insulators and chemical bonding states. Please feel free to contact us when you need our services. 【Analysis Methods】 ■EDX (EDS): Energy Dispersive X-ray Analysis ■AES: Auger Electron Spectroscopy ■XPS (ESCA): X-ray Photoelectron Spectroscopy ■TOF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Materials often undergo changes and discoloration depending on the usage environment. These changes and discoloration can lead to issues with the product's performance and design, but by understanding and clarifying the changes in molecular structure through chemical analysis, it becomes possible to address or avoid these problems. This document presents case studies that have been compared and verified through elemental and bonding state analysis using surface analysis. [Contents] ■ Analysis Samples ■ Elemental Analysis Results via XPS (ESCA) ■ Bonding State Analysis Results via XPS (ESCA) for Polycarbonate ■ Bonding State Analysis Results via XPS (ESCA) for Polyvinyl Chloride *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Here is a case study of a silicon wafer analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50 μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

• Other analytical equipment
• Electrical Equipment Testing

The ZEISS "FE-SEM ULTRA55" is equipped with a GEMINI column, allowing for high-resolution observation at extremely low acceleration voltages. It also features multiple detectors, enabling the observation of various samples. Composition information can be obtained using two types of backscattered electron detectors, and high-resolution EDX analysis is possible even at low acceleration voltages. 【Features】 ■ High-resolution SEM images with a high-brightness electron gun ■ Ultra-surface analysis at extremely low acceleration voltages ■ In-lens SE detector sensitive to surface information ■ Composition information obtained using two types of backscattered electron detectors ■ High-resolution EDX analysis even at low acceleration voltages ■ Observation without coating *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

In the evaluation of BGA and CSP solder, the area ratio of voids within the solder can be measured from transmitted X-ray image data. Furthermore, by combining mechanical polishing, a comprehensive evaluation is possible. Please feel free to consult us when needed. 【Features】 ■ Non-destructive evaluation of BGA (Ball Grid Array) solder - The area ratio (%) of voids within the solder can be measured non-destructively from images obtained through X-ray transmission observation. ■ Cross-sectional observation of CSP (Chip Size Package) and BGA (Ball Grid Array) - Cross-sectional observation through mechanical polishing allows for the observation of defects such as shrinkage cavities that are difficult to see with X-ray observation. *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

The materials that make up a product are diverse, but the performance of the product is often closely tied to the characteristics of those materials. At Aites, we provide comprehensive support from reliability testing of materials to observation and physical/chemical analysis. This document presents a case study comparing the molecular structure and thermal property changes of plastic materials before and after exposure to ultraviolet light and constant temperature and humidity conditions. [Contents] ■ Constant temperature and humidity testing, and ultraviolet irradiation (Sample: Polyethylene (PE) pellets) ■ Results of IR, Raman, and EGA analysis *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Plastic extrusion/injection molding processing is set according to the heat resistance temperature (melting point Tm) of the raw materials; however, due to the degradation and alteration of the materials, there are cases where molding becomes difficult at the specified setting temperature. By checking the melt flow rate (MFR) of plastic raw materials in pellet or powder form, it is possible to determine whether there are any changes compared to conventional products. We present a case where untreated (no load), temperature and humidity load (constant temperature and humidity test), and UV-irradiated PP (polypropylene) were injected and evaluated at a temperature of 230°C and a load of 5kg, so please take a look at the PDF download. [Evaluation Case] ■PP: Polypropylene ■8585: 85°C 85% × 336 hours ■UV: UV irradiation 253.7nm × 336 hours ■Injection time: 10 minutes (converted from 3 minutes) *For more details, please refer to the PDF document or feel free to contact us.

• Other services and technologies
• Measurement and Inspection

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections, but since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener, but when embedding large samples such as printed circuit boards or touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we checked how much heat is actually generated during the curing process. For more details, please refer to the PDF download below. [Overview] ■ Temperature profile acquisition - Without heat generation prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat generation prevention treatment for a large amount of resin (large container) ■ Even with larger printed circuit boards, resin embedding is possible without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

• Other services and technologies

We would like to introduce a case study on cross-sectional observation of connector plating. We observed the cross-section to see how the plating condition of the connector terminals has changed due to usage. This time, we prepared cross-sectional samples from two locations with different degrees of streaks, one without streaks and one with streaks, to confirm the plating condition. As a result, it was found that compared to the area without streaks, Streak A and Streak B had uneven plating thickness. This is believed to be due to the plating being dragged during the insertion and removal of the connector, causing variations in thickness. 【Overview of Connector Plating Cross-Section】 ■ Cross-section preparation was done using a triple ion milling polisher (commonly known as CP) ■ The plating condition at the streaked locations was observed using SEM ■ Results - No streaks: Surface Au plating thickness is uniform (approximately 350nm) - Streak A: Surface Au plating thickness is uneven (approximately 490nm / approximately 350nm) - Streak B: Surface Au plating thickness is uneven (approximately 130nm / approximately 650nm) *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
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Resins are used in many products because they are easy to mold and color. It is also true that they can easily discolor depending on the environment in which they are used, and evaluating the color system and transmittance before and after reliability testing is essential. This document presents the results of changes in the color system and transmittance of transparent resins before and after constant temperature and humidity testing. [Contents] ■ About (xyY) and L*a*b* color systems ■ Measurements before and after constant temperature and humidity testing (85°C, 85%, 168 hours) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system