アイテス List of Products and Services

At AITES Co., Ltd., we offer "Module Prototyping and Thermal Resistance Evaluation." In the evaluation of power devices and the materials used in power devices, measuring thermal resistance by actually assembling the device is an effective method for understanding its performance. We can handle everything from prototyping to evaluation. If you are interested, please feel free to consult with us. 【Features】 <Prototyping of Power Modules> ■ We provide a consistent, flexible, and cost-effective service from chip procurement to module assembly. ■ Suitable for evaluating die attach and TIM materials. <Transient Thermal Resistance Measurement> ■ We conduct transient thermal resistance measurements using the T3Ster (power cycle testing device built-in) for power devices, obtaining structural functions and performing thermal analysis. ■ Using this data, we can compare materials, calculate thermal resistance, and estimate defective areas. *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments
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At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for testing. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for testing. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments
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At AITES Co., Ltd., we offer "environmental testing in a high-power constant temperature and humidity chamber." It is capable of a constant temperature change of up to 15°C/min (-45 to ±155°C). Temperature cycle testing can be conducted by controlling the temperature gradient. Additionally, the temperature control range is wider than that of typical constant temperature and humidity chambers, with control possible at 95°C. 【Features】 ■ Two high-power constant temperature and humidity chambers introduced ■ Constant temperature change of up to 15°C/min (-45 to ±155°C) is possible ■ Temperature cycle testing can be conducted by controlling the temperature gradient ■ Temperature control range is wider than that of typical constant temperature and humidity chambers ■ Control possible at 95°C *For more details, please refer to the PDF materials or feel free to contact us.

• Other measuring instruments
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This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. [Contents] ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

• Wire
• others

This document explains the bonding interface of Cu wire bonding in semiconductor packages. It details the purpose and wire bonding, the characteristics of Cu wire bonding, the Cu-Al compounds at the bonding center, micro voids, and the growth (diffusion) of Cu-Al compounds, accompanied by diagrams and photographs. [Contents (excerpt)] ■ Purpose and wire bonding ■ Samples and methods ■ Procedures and flow ■ Characteristics of Cu wire bonding ■ Selection of cross-sectional preparation methods *For more details, please refer to the PDF document or feel free to contact us.

• Wire
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At Aites Co., Ltd., we conduct analysis of semiconductor diffusion layers using sMIM. The Scanning Microwave Impedance Microscopy (sMIM) is characterized by signals that have a linear correlation with dopant concentration. sMIM scans the sample by irradiating microwaves from the tip of a metal probe attached to an SPM and measures the reflected waves to obtain sMIM-C images that have a linear correlation with the concentration of the diffusion layer. The C component of Zs obtained from the reflectivity consists of the oxide film capacitance and the depletion layer capacitance. By utilizing the fact that the depletion layer width changes depending on impurity concentration, we detect changes in concentration as changes in C. [Application Examples] ■ sMIM-C: Visualization of diffusion layers and semi-quantitative evaluation of dopant concentration for various semiconductor devices such as Si, SiC, GaN, InP, and GaAs. ■ dC/dV: Evaluation of diffusion layer shape, determination of p/n polarity, visualization of the depletion layer. *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system

We would like to introduce the products handled by Aites Co., Ltd.: "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors." The "Evaluation Pattern Wafers" are created as test pattern wafers with various structures for evaluating CMP, deposition equipment, cleaning equipment, and various materials. We accept even a few prototype evaluations without any issues and are well-known for our very flexible responses, from mask design to cross-sectional dimension measurement. 【Features】 <Evaluation Pattern Wafers> - Various structures of test pattern wafers are created for evaluating CMP, deposition equipment, cleaning equipment, and various materials. - We accept even a few prototype evaluations without any issues. <Silicon Wafer Sales> - We handle a wide range of products from particle-free items for semiconductor front-end processes to inexpensive coin roll wafers for back-end processes. - We can also perform film deposition processing, BG thinning processing, dicing processing, as well as complex recess processing and through-hole processing on silicon wafers. *For more details, please refer to the PDF document or feel free to contact us.

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This document introduces the defects of solar cell modules and presents cases where various cross-sectional analyses were conducted for observation and analysis, along with the factors contributing to degradation. It includes an introduction to the "basic structure of solar cells" as well as "non-destructive analysis and destructive analysis," using diagrams and photographs. We encourage you to read it. 【Contents】 ■ Introduction ■ Basic Structure of Solar Cells ■ Non-Destructive Analysis and Destructive Analysis ■ Various Defect Modes ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

One of the reliability evaluation methods, the ion migration evaluation test, has become increasingly important as a pre-evaluation due to the transition of products towards being lighter, shorter, and smaller. This document provides an overview of ion migration evaluation and the details of the test implementation using an example of our evaluation tests. We will also introduce the usefulness of the continuously measuring (In-Situ) equipment used in the evaluation tests. [Contents] ■ Introduction ■ Ion Migration ■ Ion Migration Evaluation Test ■ Evaluation Method ■ Evaluation Test Case ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.

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We have introduced the "GC-MS Gas Chromatograph Mass Spectrometer" manufactured by Shimadzu Corporation. This is one of the analytical methods aimed at qualitative and quantitative analysis of components contained in samples, used for the qualitative and quantitative analysis of volatile organic compounds such as parts, materials, residual solvents, and additives. It is necessary for the measurement target to be gasified (with a boiling point below 300°C), but it is suitable for component analysis of mixtures due to its higher sensitivity compared to IR and RAMAN, as well as the ability to separate components in the GC section. 【Overview of GC-MS Equipment】 ■ GC-MS Main Unit: GC-2030, GCMS-QP2020 NX ■ Headspace Sampler: HS-20 ■ Pyrolysis Analyzer: Multi-Shot Pyrolyzer Py-3030 ■ Specifications ・Detection Limit: Several ppm (varies depending on the measurement target) ・Headspace: 40–300°C, sample size 13mm x 40mm or smaller ・Pyrolysis Analyzer: 50–1050°C (EGA measurement compatible), sample size up to 4mm *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system
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The "Cheetah EVO" is an X-ray imaging and CT inspection device equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering. It can be utilized for setting reflow conditions and selecting solder. Our company has examples of using this product for "observation of inductor coils," as well as "BGA solder crack analysis" and "observation of IC-type coils." 【Device Specifications (Excerpt)】 ■ X-ray Generator: Multi-focus transmission type ■ Tube Voltage: 25–160 kV ■ Tube Current: 0.01–1.0 mA ■ Tube Power: 64 W *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Aites utilizes its 40 years of experience in repairing computer system boards to identify and repair faults in electronic devices that are no longer supported, guaranteed, or maintained by the manufacturer. In cases where "the control computer has failed and urgent recovery is needed," there may be a possibility of extending its life through repairs. Please feel free to contact us if you have any requests. 【We address issues such as the following】 ■ The power does not turn on ■ The OS does not boot ■ Display abnormalities ■ Unusual noises ■ Fails to read floppy disks, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Aites utilizes its 40 years of experience in repairing computer system boards to identify and repair faults in electronic devices that are no longer supported, guaranteed, or maintained by the manufacturer. In cases such as "the servo motor is not moving," there is a possibility of extending the lifespan through repairs. Please feel free to contact us if you have any requests. [We address issues such as the following] ■ Power does not turn on ■ Motor control error ■ Stops with "E9" error ■ Motor does not rotate, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

At AITES, we use environmental testing equipment that complies with standard specifications such as JIS, JEDEC, and MIL to conduct reliability evaluation testing for various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

At AITES, we propose and conduct contract analysis menus suitable for the purpose and sample, including the analysis of organic and inorganic substances, foreign matter, and surface analysis. In this department, we perform component analysis of micro foreign substances using advanced sampling techniques, as well as impurity analysis in samples, conducting both qualitative and quantitative analysis of organic and inorganic components. Additionally, we analyze the surface of samples for contamination and oxidation states. 【Service List】 ■ Component analysis of epoxy resin hardeners using Pyrolysis GC/MS ■ Analysis of micro organic foreign substances using Imaging FT-IR ■ Analysis of micro foreign substances using Micro Raman Spectroscopy ■ Ion Chromatography (IC) analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

The hassle of removing PV cables for inspection of CIS thin-film panels has been eliminated. High-speed checks from the panel surface during power generation significantly improve the efficiency of CIS inspections. By simply replacing the sensor unit of the Solamente-iS SI-200, the Solamente CiS Adapter (optional) SC-200 can be attached to the widely used Solamente-iS (SI-200) at solar panel inspection sites, enabling high-speed inspections of CIS thin-film panels. By utilizing the iS panel checker function, which detects power generation current from the panel surface, for CIS panels, economical inspections of CIS panels have become possible. Without removing the PV cables, it is now easy to efficiently identify failures in CIS thin-film panels (such as bypass diode short circuits) in a short amount of time.

• Solar power generation equipment

A new feature of Solamente that detects faulty panels during pre-power transmission inspections and power outage inspections. A new inspection method that links SZ-200 and SI-200. Inspection Method By linking Solamente-Z (SZ-200) and Solamente-iS (SI-200), sensors (SR-200) check the panels along the string circuit. There are faulty panels at the locations where the sensor's response is interrupted.

• Solar power generation equipment

The Solar Panel Checker Solamente-iS SI-200 is an inspection device that detects cluster failures* by placing a sensor on the surface of panels during power generation. It senses the generated current flowing through the interconnector and displays it in musical notes and LED levels, allowing for instant identification of clusters that are not generating power. (*Cluster failures can occur due to initial defects, aging deterioration, lightning damage, etc.) With just a press of a button, the built-in light sensor automatically adjusts sensitivity. The measurement speed is approximately 5 seconds per panel, making it high-speed. With the super long extension pole (optional), it can reach panels up to 3.6 meters away.

• Solar power generation equipment

The String Checker Solamente-Z SZ-200 is an inspection device that probes each string P/N terminal of the connection box to detect strings with fault panels. It applies a special detection signal to the string circuit, measures the open circuit voltage and series resistance (impedance), and identifies strings with abnormalities. The SZ-200 achieves fast inspection, is resistant to changes in sunlight, and offers high operability, ensuring reliable results and significantly improving the efficiency of inspection work.

• Solar power generation equipment

At Aites Co., Ltd., we assist our customers in solving various challenges related to bare wafers and their processing. In response to the increasingly diverse semiconductor needs, we provide expertise and excellent support in the areas of wafer, film deposition processing, and regeneration processing in the front-end field. Additionally, we have started accepting orders for MEMS prototype processing using silicon and fine electroforming. 【Service Contents (Partial)】 ■ Wafer film deposition processing ■ Wafer patterning processing ■ Wafer regeneration processing ■ Sale of bare wafers *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

The PVX1000+POPLI-Octa can evaluate wafers during the solar cell manufacturing process using photoluminescence. It is capable of assessing the passivation effects of the PN junction layer after thermal diffusion, the AR layer deposition, surface contamination, as well as the protective effects of the rear insulation layer and the evaluation of Local-BSF. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the locations of defects. By applying reverse bias to the module and observing LEAK points, defects that have caused PID can be easily identified.

• Measurement and Inspection

Free sample evaluation demo now available. POPLI is an advanced PL imaging device that adds a PL imaging unit as an option to the EL image inspection device PVX, achieving clear PL imaging and cost-effectiveness by utilizing the detection capabilities and software of the PVX.

• Batteries and Capacitors
• Solar power generation equipment

We provide repair and maintenance services for computers used in production equipment, industrial devices, and panel computers (panecons) through our years of experience in computer repair and unique methods. Additionally, we also offer circuit board repair, power supply repair, monitor repair, touch panel repair, and overhauls.

• Other Software

Unreliable LCD displays are causing problems in the market. At Aites, we solve our customers' reliability issues by conducting reliability testing design and visual inspections before and after testing, leveraging our extensive experience and state-of-the-art equipment. Furthermore, we provide support from failure mode classification to failure analysis and material analysis.

• Other analytical equipment

■TOF-SIMS Three Analysis Modes - High-resolution mass spectrum - Depth profiling - Surface mapping

• Other analytical equipment
• Analysis and prediction system

■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer thin films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis

• Other analytical equipment

■Service Overview 1. Micro ATR Method IR data acquisition of foreign substances is possible if they are approximately 5um or larger. 2. Surface Distribution Image Observation of the in-plane distribution of organic substances is possible. 3. Temporal Changes Measurement of the state of organic substances that change on a second-by-second basis is possible.

• Other analytical equipment

Some overseas manufactured parts and products may initially function without issues, but can cause malfunctions and lead to failures and breakdowns in a short period. Before adopting or using overseas products, please consider AIT's component and product quality evaluation services. ■ Examples of Overseas Component Evaluations - Reliability evaluation during the parts procurement and selection stage - Comparative evaluation between component and product manufacturers - Reliability evaluation when replacing current components with alternative components (cost reduction) ■ Examples of Supported Components - Active components (transistors, diodes, thyristors, etc.) - Passive components (capacitors, resistors, etc.) - LCDs - Circuit boards - Power supplies - Etc.

• Other analytical equipment
• Analysis and prediction system

■ We will support each specification waveform for JEDEC, JEITA (EIAJ), and AEC through unit replacement. ■ We support both Direct Charge Method (Direct CDM) and Field Induced Method (Field Induced CDM). ■ The contact state confirmation function of the applied pins ensures reliable application. ■ Destruction judgment support is also possible using diode characteristic judgment methods (consultation required).

• Other analytical equipment
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■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and problem resolution.

• Other analytical equipment

■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as JEDEC, JEITA, and AEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and root cause investigation to resolve the problem.

• Analysis and prediction system

■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High-Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-Section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation

• Other analytical equipment

A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.

• Other analytical equipment
• Analysis and prediction system

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

• Other analytical equipment

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

• Other analytical equipment

Aites is a solution-oriented company that sincerely addresses customer challenges in cutting-edge industrial fields. We utilize various owned devices to provide optimal solutions. ■ Product Analysis / Defect Analysis / Failure Analysis Morphological observation, electrical characteristic measurement, defect analysis, failure analysis, sample processing ■ Reliability Evaluation Testing Reliability evaluation testing, ESD/latch-up testing, strength testing, optical characteristics ■ Physical Analysis / Chemical Analysis Physical analysis, surface analysis, chemical analysis

• Analysis and prediction system

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.

• Garden lighting/lights (LED/solar)

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• Analysis and prediction system
• Other analytical equipment

We provide testing services to evaluate the resistance to ESD damage and latch-up damage, which are important for the reliability of semiconductor devices and electronic components that include them. ■ We accommodate products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We offer tests in accordance with standards such as JEDEC, EIAJ, and ESDA. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with resistance, we assist with failure analysis and problem resolution.

• Electrical Equipment Testing
• Other analytical equipment

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Material Analysis (FT-IR)

• Other analytical equipment

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a readout method where samples are taken out from a stress environment at fixed times, failure can only be understood at the timing of the readout, making it impossible to know the exact time of failure occurrence. In-situ measurement allows for accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, these recoverable failures cannot be detected using the readout method, but in-situ measurement allows for the detection of recoverable failures, enabling accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application conditions and measurement data can be confirmed in real-time.

• Other analytical equipment
• Analysis and prediction system

● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback on failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects in reliability testing, we support accurate and timely identification and analysis of causes through a rich and efficient analysis menu. ● Use only the services you need as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.

• Other analytical equipment