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  6. Surface Analysis Guide

Surface Analysis Guide

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last updated:Aug 24, 2021

アイテス
アイテス
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Various surface analysis techniques! We will assist you in solving problems such as foreign substances, discoloration, and contamination.

Our company utilizes various surface analysis techniques to assist in resolving issues such as foreign substances, discoloration, and contamination. We conduct a wide range of analyses, from micro-regions to bulk samples, including "EDX," which is energy-dispersive X-ray analysis, "AES," which detects Auger electrons using electron beams, and "XPS," which allows for the analysis of insulators and chemical bonding states. Please feel free to contact us when you need our services. 【Analysis Methods】 ■EDX (EDS): Energy Dispersive X-ray Analysis ■AES: Auger Electron Spectroscopy ■XPS (ESCA): X-ray Photoelectron Spectroscopy ■TOF-SIMS: Time-of-Flight Secondary Ion Mass Spectrometry *For more details, please refer to the PDF document or feel free to contact us.

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Surface Analysis Guide

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  • Related Link - https://www.ites.co.jp/chemistry/index/surface_ana…

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basic information

【Features of EDX (EDS)】 ■ Element analysis of small areas ■ Analysis of bulk samples ■ Can be used in conjunction with SEM ■ Element mapping *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Application Examples】 ■EDX: Analysis of microscopic foreign substances, migration observation ■AES: Analysis of pad discoloration, measurement of oxide film thickness, analysis of bonding defects ■XPS: Contamination analysis of substrate surfaces, evaluation of surface oxidation ■TOF-SIMS: Analysis of organic and inorganic contamination, analysis of film-rejecting foreign substances *For more details, please refer to the PDF document or feel free to contact us.

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Surface Analysis Guide

Surface Analysis Guide

PRODUCT
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TOF-SIMS analysis

TOF-SIMS analysis

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Total support service for chemical analysis

Total support service for chemical analysis

OTHER
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TOF-SIMS analysis of organic matter

TOF-SIMS analysis of organic matter

TECHNICAL
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TOF-SIMS analysis of trace contaminants

TOF-SIMS analysis of trace contaminants

TECHNICAL
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Depth profile analysis of thin film layers using XPS angle-resolved method.

Depth profile analysis of thin film layers using XPS angle-resolved method.

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Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

OTHER
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Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

OTHER
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Changes due to differences in acceleration voltage during EDX analysis.

Changes due to differences in acceleration voltage during EDX analysis.

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Flow of Chemical Analysis

Flow of Chemical Analysis

DOCUMENT
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Surface analysis of discolored and altered materials using XPS (ESCA).

Surface analysis of discolored and altered materials using XPS (ESCA).

OTHER
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Simple measurement of band gap using XPS.

Simple measurement of band gap using XPS.

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Structural analysis of Nylon 6.10

Structural analysis of Nylon 6.10

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[Example of TOF-SIMS] Analysis of Li

[Example of TOF-SIMS] Analysis of Li

TECHNICAL
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Chemical Analysis Trust Service

Chemical Analysis Trust Service

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Chemical Analysis Trusted Service

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We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analytical instrument is capable of measuring different targets, it is necessary to choose the method that fits the purpose based on the information available.

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アイテス

アイテス

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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