It is possible to perform non-destructive testing from fault location identification to internal observation! High-precision identification of heat generation areas can be achieved.
Thermal analysis is a method for identifying defective areas by detecting the heat generated at leak points due to applied voltage using a high-sensitivity InSb camera. By detecting the weak heat generated from shorts and leaks with a high-sensitivity InSb camera, it is possible to non-destructively identify the failure points of electronic components such as semiconductors. Furthermore, non-destructive observation can also be performed using X-ray inspection equipment. 【Features】 ■ Identifying defective areas by detecting the heat generated at leak points with a high-sensitivity InSb camera ■ Analyzing samples in a non-destructive state, and analyzing electronic components that are difficult to analyze with OBIRCH or emission methods is also possible ■ By using the lock-in function to obtain phase information, it is possible to accurately identify the heat generation points *For more details, please refer to the PDF document or feel free to contact us.
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【Device Specifications】 ■Observation field size: 9.5x7.5mm to 1.2x0.96mm ■Detection wavelength range: 3.7um to 5.1um ■Maximum applied voltage, current: 1.5kV/120mA 3kV/20mA ■Lock-in frequency: 0.1Hz to 83Hz *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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