アイテス Company Profile

We conducted a "moisture and heat resistance test for adhesives" to investigate the changes in adhesive strength due to the effects of moisture and heat. The test specimens were placed in a constant temperature and humidity testing machine, and after 500 hours, they were removed to measure the tensile shear adhesive strength. It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high-temperature and high-humidity environment. We can conduct various environmental tests and strength tests on a variety of materials, not limited to adhesives. Additionally, we also provide chemical analysis to elucidate degradation mechanisms.

NMC (Li(NixMnyCoz)O2) is used as a positive electrode active material in lithium-ion batteries. Regarding the NMC reagent, an evaluation of the valence of metal oxides was conducted through state analysis using XPS. As a result of the analysis, the NiMnCo ratio obtained is close to the specifications of the reagent. Additionally, F and C, which are thought to originate from the binder components, have been detected.

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, raising suspicions that the undercoat layer may be exposed. Next, cross-sectional samples were prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which revealed that the protective film and resistive material appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface. It is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive material to melt and resulting in a change in resistance value (leading to an open circuit).