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We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, raising suspicions that the undercoat layer may be exposed. Next, cross-sectional samples were prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which revealed that the protective film and resistive material appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface. It is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive material to melt and resulting in a change in resistance value (leading to an open circuit).

To prevent shock and vibration, low-rebound and vibration-absorbing materials are used in various situations. The indicator of these properties is viscoelasticity. This document presents examples of evaluating the rebound and vibration-absorbing properties of rubber materials through dynamic mechanical analysis (DMA). From the dynamic viscoelasticity concerning temperature, it is possible to predict the vibration-absorbing and rebound properties of materials in their usage environment. From the dynamic viscoelasticity concerning frequency, it can be utilized to predict damping performance against seismic motion, braking performance of tires, and in the low-frequency range, it can be used to predict long-term deformation behavior such as creep.

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM