アイテス List of Products and Services

We offer contract analysis using the shape measurement laser microscope "VK-X200." Various measurements can be performed, including flatness measurement, width measurement, height measurement, and film thickness measurement. Depending on the size of the subject and the required precision, we select the appropriate objective lens for observation and measurement. The range varies depending on the lens, but due to its coupling function, it is also possible to observe and measure over a wide area. 【Features】 - Various measurements can be performed, including flatness measurement, width measurement, height measurement, and film thickness measurement. - The appropriate objective lens is selected based on the size of the subject and the required precision. - The coupling function allows for observation and measurement over a wide area. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system

We offer contract analysis using the shape measurement laser microscope "VK-X200." Observations and measurements are conducted using a 408nm laser. The measurement results are based on a traceability system that connects to national standards, allowing the measurement equipment to be used for non-destructive testing. With the laser microscope, 3D measurements of the surface roughness of samples can be performed, as well as measurements of the thickness of transparent materials and surface shapes through transparent materials. 【Features】 ■ Capable of 3D measurement of the surface roughness of samples ■ Capable of measuring the thickness of transparent materials and surface shapes through transparent materials ■ Observations and measurements conducted using a 408nm laser ■ Measurement results are based on a traceability system that connects to national standards ■ Can be utilized as non-destructive measurement equipment *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system

The CP method allows for the observation of cross-sections without damage from polishing, compared to mechanical polishing methods. Our triple ion milling device with cooling function achieves high processing precision and a wide processing area through ion beams irradiated from three directions. For materials sensitive to heat, processing can be done while reducing damage with the cooling function. 【Features】 - Processing width of approximately 4mm and processing depth of approximately 1mm, allowing for extensive processing. - High flatness in both hard and soft materials, enabling the production of cross-sections without physical damage. - Capable of producing cross-sections with good positional accuracy. - Processing can be done while cooling (cryogenic). *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the backscattered electron diffraction patterns generated by electron beam irradiation and maps it. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. For example, when the sample is tilted significantly in an SEM and the electron beam is irradiated, if the sample is crystalline, electron beam diffraction occurs within the sample. By indexing that pattern, it becomes possible to determine the crystal orientation at that point. By observing the differences in crystal orientation, it is possible to infer the residual stress within the crystal grains. **Features** - Obtains and maps orientation information of individual crystals - Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain - Allows inference of residual stress within crystal grains by observing differences in crystal orientation *For more details, please refer to the PDF document or feel free to contact us.*

• Electrical Equipment Testing
• Other analytical equipment

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as crystal grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a Cu plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the half-life of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, crystal grain distribution, and stress-strain *For more details, please refer to the PDF materials or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials such as metals and ceramics, which are crystalline, are thought to be composed of numerous crystal lattices like cubes, and this analysis method examines the orientation of these lattices (crystal orientation). Various maps are used, including the IQ map (Image Quality Map), IPF map, GROD map, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

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SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the grain boundary rotation angles, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown through histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the grain boundary rotation angles) *For more details, please refer to the PDF document or feel free to contact us.

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• Other analytical equipment

Here is an example of BGA (Ball Grid Array) analysis. For observation using a microscope, both optical microscopy and SEM are employed. In crystal analysis using the EBSD method, we utilize Phase maps, Sn Grain maps, Sn IPF maps, and Sn GROD maps, which allow for the inference of crystal states and residual stresses. [Overview] ■ Crystal analysis using the EBSD method - Phase map - Sn Grain map - Sn IPF map - Sn GROD map *For more details, please refer to the PDF document or feel free to contact us.

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• Other analytical equipment

We will introduce an example of analysis using EBSD for steel (Fe). Using histograms of gradients and corresponding crystal grain distribution maps, IPF maps, and crystal grain distributions, we observe the crystal structure with EBSD. The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal directions, and by highlighting on the map, we can visualize the features that appear in the graphs. [Overview] ■ Observation of crystal structure using EBSD - IPF map - Crystal grain distribution map - Crystal grain distribution *For more details, please refer to the PDF document or feel free to contact us.

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• Other analytical equipment

We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). The EBSD method allows for the estimation of grain distribution and residual stress. Additionally, there are methods that can simultaneously analyze metals with different crystal structures, enabling data acquisition for each metal. 【Features】 ■ Ability to estimate grain distribution and residual stress ■ Methods available for simultaneous analysis of metals with different crystal structures, allowing for data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.

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• Other analytical equipment

We will introduce an example of analysis using EBSD for vias (Cu) formed in laminated substrates. The EBSD method allows for the estimation of crystal size distribution and residual stress. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■Observation of crystal structure using EBSD ・IPF map ・GROD map ・Crystal grain distribution map *For more details, please refer to the PDF document or feel free to contact us.

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Aites Co., Ltd. conducts analysis of pipes using EBSD. With the EBSD method, it is possible to confirm the distribution of crystal sizes and the orientation. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■ Confirmation of crystal size distribution and orientation ■ Visualization of features that appear in the graph *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal orientations. In this case, it was found that there is a significant orientation difference in the valleys of the screw, suggesting that there is a high level of residual stress. Additionally, it was observed that small crystal grains are distributed on the surface of the screw. [Summary] ■ Analysis Method - Observation of crystal structure using EBSD ■ Results - It was found that there is a significant orientation difference in the valleys of the screw. - It is inferred that there is a high level of residual stress. - It was also observed that small crystal grains are distributed on the surface of the screw. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

We will introduce an example of analysis of chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, suggesting the presence of many crystals. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

During reliability testing, the samples change moment by moment. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining it with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical corrosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Analysis and prediction system

At Aites Co., Ltd., we conduct depth-direction analysis of thin film layers using angle-resolved XPS. By changing the angle between the sample and the XPS photoelectron detector, it is possible to alter the detection depth of the photoelectrons. The data obtained from this is numerically analyzed through simulation and converted into a depth profile. We achieve depth-direction analysis of uniform thin films in the nanometer order near the surface, which is difficult to measure using conventional ion etching methods. We also have examples of analyzing the depth direction of HDD magnetic surfaces. 【Features】 ■ Non-destructive depth-direction analysis of thin films in the nanometer order is possible ■ Achieves depth-direction analysis of uniform thin films *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• Measurement and Analysis Equipment

Many defects occur during the manufacturing process of products and during their use. Among these, there are challenges related to material properties, and for those who are wondering, "It’s probably due to the material, but what should I do about it?", we propose suitable solutions from the perspectives of electronics, atoms, molecules, and chemical reaction mechanisms. ■Examples of Issues - What is causing this discoloration? - Why did it crack so quickly? - What is the reason it tears immediately during a tensile test? *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the pre-treatment for cross-sectional observation (sample cutting and resin embedding) conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw" for sample cutting. With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the cutting process using wire saws at Aites Co., Ltd. With a wire saw, it is possible to create multiple cross-sections from a single sample without cutting through, allowing for further observation and analysis. Additionally, in cutting examples, even small and brittle white rice can be divided without cracking or chipping. If you have any requests regarding cutting processes or observation and analysis, please feel free to contact us. *For more details, please refer to the PDF materials or feel free to reach out to us.

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Aites Co., Ltd. conducts slicing processing using isomet. When you want to observe the cross-section of all connector pins in multiple rows, the usual procedure is to grind down to the next row... However, by performing slicing processing, it is possible to keep the created cross-section as it is. Additionally, we have examples of slicing processing for connector pins with multiple rows. *For more details, please refer to the PDF materials or feel free to contact us.*

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Our "Micro Raman Spectrophotometer" employs a confocal optical system, allowing for the adjustment of the focal position in the depth direction, similar to a microscope, enabling material analysis of each layer from the surface of multilayer films. Using the confocal function of the micro Raman spectrophotometer, the focus of the Raman laser light can be varied in the depth direction. Additionally, by continuously changing the focal position, it is possible to acquire spectra continuously in the depth direction. 【Features】 ■ Adoption of a confocal optical system ■ Enables material analysis of each layer from the surface of multilayer films ■ Capable of varying the focus of the Raman laser light in the depth direction ■ Allows for continuous acquisition of spectra in the depth direction *For more details, please refer to the PDF document or feel free to contact us.

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Our company offers a service to replace CRT monitors, such as those used in machine tools, with LCD displays. Do you have concerns like "the CRT monitor won't turn on" or "I only want to repair the monitor"? If the monitor can be replaced and the machine tool can be used again, it can lead to cost savings compared to purchasing new equipment. Please feel free to contact us regarding the possibility of repairs. 【Process for Replacement】 1. Check the CRT signal line 2. Connect the signal from the CRT to the signal converter 3. Connect the output of the signal converter to the LCD 4. Adjust the settings of the signal converter and check the screen *You can view the flyer for this service by clicking the download button.

• Other PCs and OA equipment

This document introduces a comparison of components in PC monitors and digital clocks using gas chromatography-mass spectrometry (GC-MS). Liquid crystal displays contain small organic substances (liquid crystal molecules). These have evolved into molecular structures suitable for product characteristics due to technological innovations. Our company clarifies these differences at the molecular level using GC-MS, allowing us to confirm that the liquid crystal molecules are appropriate for their intended use and to check for the presence of impurities. [Contents] ■ Comparison of components in PC monitors and digital clocks using GC-MS ■ Case studies of GC-MS analysis of liquid crystal components We compared the number of components and characteristics of segment-type liquid crystal displays (digital clocks) and color TFT liquid crystal displays (PC monitors). *For more details, please refer to the PDF document or feel free to contact us.

• Other services and technologies

At Aites Co., Ltd., we offer analysis and reliability evaluation services for "crystallinity analysis of resin materials using micro-Raman spectroscopy." By analyzing the spectra obtained from a micro-Raman spectrophotometer, it is possible to determine the crystallinity of resin materials in fine detail based on the differences in the half-width of the peaks. We also have case studies analyzing the changes in crystallinity from the mouth of PET bottles to the bottle body. Please leave the analysis, evaluation, and reliability assessment to us. 【Overview】 ■ Crystallinity analysis of resin materials using Raman spectroscopy - The linewidth of the Raman spectrum changes to reflect crystallinity - It is possible to determine the half-width of the C=O stretching band and crystallinity - Relative crystallinity of PET can be determined *For more details, please refer to the PDF document or feel free to contact us.

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Our company scans the sample surface with a micro probe to achieve nano-level structural analysis. In "shape measurement (tapping mode)," the probe, which is periodically vibrated, lightly taps the sample surface to measure its shape. Additionally, "phase imaging" maps the phase delay between the periodic signal that moves the cantilever and the cantilever's vibration, visualizing differences in physical properties that do not appear in the shape. 【Features】 ■ High-resolution imaging with a micro probe ■ Measurement possible for conductors, semiconductors, and insulators ■ Measurement can be conducted almost non-destructively with minimal contact pressure *For more details, please refer to the PDF document or feel free to contact us.

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This is an introduction to a case where water droplet-shaped contaminants were created on a Si wafer through reproducibility experiments. Measurements were conducted at the same location using SEM-EDX and TOF-SIMS, and a comparison of the image maps was made. In the TOF-SIMS image map, organic substances (CH, CN), Na, and K were detected around the watermark. While no contaminants were observed around the watermark in the optical image, SEM image, and EDX analysis, the TOF-SIMS image map revealed that trace amounts of contaminants were present. *For more details, please refer to the PDF document or feel free to contact us.*

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TOF-SIMS can detect elements and organic molecules, as well as fragment ions, making it effective for organic analysis. As an example of organic analysis, we will introduce a case study of polyethylene glycol. Secondary ion mass spectra can provide valuable insights for the qualitative analysis of organic substances. In this case study, we can confirm the characteristic repeating structure of polyethylene glycol (C2H4O) as a group of peaks with a mass difference of 44. Calculating from the mass number, the terminal ends are likely H- and HO-, suggesting they are detected as protonated species. *For more details, please refer to the PDF document or feel free to contact us.*

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TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) being the measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical analysis ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection
• Structural Survey

TG-DTA (Thermogravimetric Differential Thermal Analysis) is an analysis that simultaneously measures the weight of a sample (TG) and the temperature difference between the sample and a reference material (Differential Thermal Analysis) (DTA) as a function of temperature, while changing the sample's temperature according to a specific program. The measurable conditions are a temperature range of room temperature to 1000°C, a required sample amount of 10 to 20 mg, and sample shapes including film, powder, and bulk. 【Features】 - Thermogravimetric Differential Thermal Analysis - Changes the sample's temperature according to a specific program - Simultaneously measures the sample's weight and the temperature difference from the reference material as a function of temperature - Required sample amount: 10 to 20 mg - Sample shapes include film, powder, and bulk *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection
• Structural Survey
• Surveying

DSC (Differential Scanning Calorimetry) is an analytical method that determines the heat difference based on the temperature difference between the sample and a reference material caused by temperature changes in the sample, allowing for the observation of the degree of endothermic/exothermic reactions of the sample. The temperature range is -90°C to 550°C, the required sample amount is 5 to 10 mg, and the sample shapes that can be measured include film, powder, and bulk. 【Features】 ■ Differential Scanning Calorimetry ■ Observation of the degree of endothermic/exothermic reactions of the sample ■ Temperature range: -90°C to 550°C ■ Required sample amount: 5 to 10 mg ■ Sample shapes: film, powder, bulk *For more details, please refer to the PDF document or feel free to contact us.

• Surveying
• Structural Survey
• Measurement and Inspection

"DMA (Dynamic Mechanical Analysis)" is an analysis that applies periodic oscillating loads to polymer materials and measures elasticity and viscosity as a function of temperature from the resulting stress and phase difference. It provides information related to the molecular motion and molecular structure of polymers, such as glass transition and relaxation. 【Features】 ■ Dynamic mechanical analysis ■ Applies periodic oscillating loads to polymer materials ■ Measures elasticity and viscosity as a function of temperature ■ Obtains information related to the molecular motion and molecular structure of polymers ■ Numerous measurement modes *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection
• Measurement and Analysis Equipment

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopy and angled CT observation, as well as observations of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopy observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopy observation & orthogonal CT observation)... ★ Currently, we are offering a free collection of case studies on X-ray fluoroscopy and CT inspection equipment! You can view it immediately via "PDF download." * For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system
• Other analytical equipment

This document introduces an example of an analytical method for molecular structure analysis. It includes structural analysis using IR and Raman for liquid crystal polymers (LCP), TIC data from GC-MS analysis of low molecular weight liquid crystals (for LCD), as well as detected substances, presented with figures and tables. For analysis at the quantum level, please consult the technical group "Aites," known for their extensive expertise. 【Contents (excerpt)】 ■ Liquid Crystal Polymers (LCP) ■ Structural analysis of LCP (fully aromatic polyamide) ■ Structural analysis using IR ■ Structural analysis using Raman ■ Structural analysis using XPS (ESCA) *For more details, please refer to the PDF document or feel free to contact us.

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X-ray observation is a method of non-destructive testing and is the first inspection performed for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented substrates and electronic parts. Additionally, CT inspection can capture structures in three dimensions, allowing for visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, enabling real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmitted X-ray images of normal substrates and defective substrates, the wiring was intricately laid out, making it difficult to identify abnormalities at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon checking the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case of observing wisdom teeth (third molars) using X-ray CT. Over 10 years ago, the wisdom tooth extracted by the photographer was observed using X-ray CT. Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin were clearly observed. [Observation Case of Wisdom Teeth] ■ Compared to X-ray fluoroscopy images, the enamel on the surface of the tooth and the underlying dentin were clearly observable. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the features of the YXLON "Cheetah EVO" that we have implemented. The "Reflow Simulator" allows for real-time observation of phenomena such as void behavior during soldering. It can be utilized for determining reflow conditions and selecting solder. 【Features】 ■ Ceramic heater & lamp heating ■ Target size: 40x40x20mm ■ Maximum set temperature: 350 degrees ■ Real-time observation capability ■ Usable for determining reflow conditions and selecting solder *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounted substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphone] ■ X-ray Fluoroscopic Image - Wire bonding and wiring patterns of the mounted substrate can be observed. ■ Orthogonal CT Image - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case study of observing chip resistors using X-ray imaging and CT scanning. Chip resistors have a structure where a thin film of metal (resistive element) is formed on the surface of ceramics. The L-shaped lines visible in the X-ray image are trimming marks applied to adjust the resistance value. CT observation allows for viewing the desired cross-sectional images and enables three-dimensional observation, making it effective for analysis. If any defects are found during X-ray or CT observation, cross-sectional observation and elemental analysis will be conducted to investigate the cause. [Case Study of Chip Resistor Observation] ■ CT Observation - It is possible to view the desired cross-sectional images. - Effective for analysis due to the ability to observe in three dimensions. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce a case where the moment a surface-mounted LED is damaged due to overload was captured through X-ray observation. In this case, the surface-mounted LED was powered on, and the voltage and current were gradually increased from the rated values until it became non-functional due to overload. This process was recorded. Additionally, you can view the process of it becoming non-functional in a video. 【LED Failure Observation Case】 ■ After becoming non-functional - Melting, disconnection - Change in the loop shape of the wire - Delamination of the phosphor - Changes in the shape and size of voids *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case study of BGA solder crack analysis using X-ray imaging and CT scanning. When observing the BGA connection area of a circuit board that had become electrically open using X-ray imaging, cracks were confirmed to have occurred at the BGA connection. Additionally, we examined the cracks in the solder connection observed through X-ray imaging using oblique CT. Oblique CT provides clear planar information, but spherical shapes like solder balls and voids appear elongated in the vertical direction due to specific factors of oblique CT. While it is difficult to obtain cross-sectional information about the cracks occurring at the solder joint interface, there is the advantage of being able to observe the circuit board non-destructively. [Analysis Cases] ■ X-ray imaging observation ■ Oblique CT observation ■ Orthogonal CT observation ■ Cross-sectional observation *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, making the condition of the abnormal areas clear. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Here are some examples of observations of IC-type coils. Through X-ray observation, we can clearly capture the internal structure by using methods suited to the purpose. In transmission observation, we can quickly detect metal foreign objects, and in CT observation, we can obtain three-dimensional images of any cross-section, making it suitable for observations where positional information and shape are important. Unlike transmission observation, we can also assess the winding condition of the coil wiring. *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

We would like to introduce the products handled by Aites Co., Ltd.: "Evaluation Pattern Wafers," "Silicon Wafer Sales," and "Compound Semiconductors." The "Evaluation Pattern Wafers" are created as test pattern wafers with various structures for evaluation of CMP, deposition equipment, cleaning equipment, and various materials. We accept even a few prototype evaluations without any issues and are well-known for our very flexible responses, from mask design to cross-sectional dimension measurements. 【Features】 <Evaluation Pattern Wafers> ■ Creation of test pattern wafers with various structures for evaluation of CMP, deposition equipment, cleaning equipment, and various materials. ■ Accepting even a few prototype evaluations without any issues. <Silicon Wafer Sales> ■ A wide range of products from particle-free items for semiconductor front-end processes to inexpensive coin roll wafers for back-end processes. ■ Capable of film deposition processing on silicon wafers, BG thinning processing, dicing processing, as well as complex notch processing and through-hole processing. *For more details, please refer to the PDF materials or feel free to contact us.

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At Aites, we provide total solution services for power devices, including reliability testing, analysis, and evaluation. We offer services such as the "Power Cycle Tester," which can simultaneously conduct transient thermal measurements, as well as "Failure Analysis of Compound Semiconductors," "Concentration Analysis of Diffusion Layers," and "Cross-Section Analysis of Modules." We will make proposals based on specific achievements. Keywords: ■General Power Semiconductors (chips, module TIM materials, etc.) ■Reliability Testing/Evaluation ■Structural Analysis (Quality, Competitor RE) ■Failure Analysis (Identification of Failure Locations, Cause Investigation, Improvement Proposals) 【List of Tests】 ■Power Cycle Testing ■Liquid Tank Thermal Shock Testing ■Gate Bias Testing ■Non-destructive Observation of Semiconductor/Package Delamination ■Failure Analysis of Power Chips, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing