I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
We will introduce an example of analysis of chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, suggesting the presence of many crystals. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.