TMA (Thermomechanical Analysis)

Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!

TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) being the measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical analysis ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

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