Substrate Product List and Ranking from 105 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 三和電子サーキット Osaka//others
  3. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//others
  5. 5 河村産業 Mie//others
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Substrate Product ranking

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Noise Cut Transformer NCT-I3 電研精機研究所
  3. Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate' 河村産業
  4. 4 Noise Cut Transformer NCT-R5-J2 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

Substrate Product List

271～300 item / All 379 items

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various interlayer connections through laser or drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and a variety of substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various interlayer connections through laser or drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Accommodates various substrate materials for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

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IVH substrate

IVH substrate

By using various VIA structures, we provide circuit boards tailored to your needs!

We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Accommodates various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

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End face through-hole substrate

End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole PCB" that we handle. It enables high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored to various applications that require heat dissipation, with aluminum thicknesses of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications that require heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole configurations as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole configurations *For more details, please refer to the PDF document or feel free to contact us.

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High-heat dissipation substrate "Bending Aluminum Base Substrate"

High-heat dissipation substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." Its features include flexibility similar to that of a flexible circuit, while also being able to maintain a bent shape, which is a significant advantage. It also possesses thermal conductivity as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Possesses thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate 'IVH substrate'

High-speed signal, high-density substrate 'IVH substrate'

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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Bonded substrate

Bonded substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Resistor hole filling board

Resistor hole filling board

By embedding solder resist ink in the through-hole section, it is possible to cover it!

We would like to introduce our "Solder Mask Plugging Board." By embedding solder mask ink into the through-hole sections, it is possible to cover them. This prevents flux and solder from wicking up to the surface during assembly. Please feel free to contact us if you have any inquiries. 【Applications】 ■ Device boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Silicone printed circuit board

Silicone printed circuit board

Support for metal-based substrates is also possible! Suitable for applications such as heat resistance and UV equipment.

We would like to introduce our "Silicone Printed Circuit Board." Our silicone ink has high weather resistance against heat and the recently noted UV-C, as well as a high reflectivity. Due to its tendency to bleed, it is necessary to maintain a larger clearance with the circuit. However, thanks to our unique technology, we can provide silicone ink-coated boards with a minimum clearance of 0.2mm from the edges of the mounted circuit. 【Applications】 ■ Heat-resistant, UV equipment-related, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Flexible substrate

Flexible substrate

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide them in small quantities. They are used in a wide variety of electronic devices and precision instruments, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided, double-sided ■ Board thickness: Base thickness 25μm, 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

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CAD design and prototype implementation

CAD design and prototype implementation

We provide support from CAD design of printed circuit boards and various analyses to prototype implementation.

We would like to introduce our "Pattern Design (CAD Design) and Prototype Implementation." By conducting transmission line analysis, it is possible to implement countermeasures from the design stage. Additionally, "Prototype Implementation" allows for the direct output of the bill of materials from CAD, enabling the arrangement of components and other tasks in parallel with PCB design and manufacturing, thereby reducing the total lead time. 【CAD Software】 Zuken: CR-8000/Design Force, CR-5000/Board Designer, CR-5000/PWS Cadence: Allegro X Designer, OrCAD(R) PCB Designer Professional 【Analysis Software Used】 ■ SI Analysis - Siemens: Hyper Lynx SI - Cadence: Allegro PCB SI ■ EMI Countermeasures and PI Analysis - NEC: DEMITASNX *For more details, please refer to the PDF document or feel free to contact us.

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Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates.

Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates.

In the IoT era, we propose the use of copper inlay boards and metal-based substrates for heat dissipation solutions, as well as ultra-thin boards to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related problems with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the amount of heat generated by components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate various shapes. 【Products We Handle】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for the attachment of heat dissipation sheets to create double-sided boards. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be bent into shape. - The use of flexible resin and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process. - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments And more are also included. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our company website.

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Overseas manufactured printed circuit boards / domestically inspected products

Overseas manufactured printed circuit boards / domestically inspected products

Leave the printed circuit boards from Chinese manufacturers to us! We also handle re-inspections at domestic inspection companies.

Sasu Sanwa Co., Ltd. is engaged in the sale of printed circuit boards from Chinese manufacturers. Our company mainly handles manufacturers from Jiangxi Province, China, and we offer products at a lower price range than domestic products under our quality control. Additionally, we accommodate re-inspections at domestic inspection companies according to customer needs. 【Products】 ■ Single-sided printed circuit boards ■ Double-sided through-hole boards ■ Multi-layer printed circuit boards (2L-20L) ■ HID (1+N+1/2+N+2/3+N+3/Any Layer) ■ Flexible boards ■ Rigid-flex boards *For more details, please feel free to contact us.

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Printed Circuit Board Business: Mounting Capability and Precision

Printed Circuit Board Business: Mounting Capability and Precision

The maximum size is 250mm × 330mm, and it supports a thickness of 0.5mm to 3.0mm!

At Yoho Electronics, we focus on circuit board assembly and respond to our customers' diverse requests (short delivery times, low costs, small quantities of various types, and mass production). For surface mount technology (SMT) assembly, we achieve a precision with chip sizes of 0402, lead spacing of 0.3mm, and adjacent pitch of 0.1mm. The compatible chips include BGA, QFN, SOP, QFP, and LED, among others. The maximum size we accommodate is 250mm x 330mm, with board thickness ranging from 0.5mm to 3.0mm. 【Assembly Capability and Precision】 <Surface Mount Technology (SMT) Assembly> ■ Precision - Chip Size: 0402 - Lead Spacing: 0.3mm - Adjacent Pitch: 0.1mm ■ Compatible Chips: BGA, QFN, SOP, QFP, LED, etc. ■ Compatible Sizes - Maximum Size: 250mm x 330mm - Board Thickness: 0.5mm to 3.0mm *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Color Filter Substrates

Introduction to Color Filter Substrates

Capable of supporting colorization for EL and electronic paper! Flexible glass color filter substrate.

Kiso Komamicro Co., Ltd. began mass production of color filters (CF) for liquid crystal displays (LCD) in 1993, following the completion of the Micro Technology Research Institute and Kiso Komagata Factory. In 2000, in response to the colorization of mobile phones, we adapted to mass production of reflective CF. Additionally, we can mass-produce aimic-CF, a highly precise and fully barrier-capable flexible glass CF. Aimic-CF features glass that is made as thin as possible, bonded with a film as a support, allowing it to accommodate curved surfaces. We are also capable of partial mass production and prototyping of thin film metal patterning, such as ITO. 【Color Filter Substrate】 ■ Color filters for liquid crystal displays ■ Flexible glass (aimic) color filters ■ Color filters on films such as PET and PEN (under development) ■ Thin film patterning technology *For more details, please refer to our catalog or feel free to contact us.

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FPC - Flexible Printed Circuit Board (Flexible Substrate)

FPC - Flexible Printed Circuit Board (Flexible Substrate)

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

Please leave the production from small-scale prototypes (for research and development purposes) to mass production to us. "FPC (Flexible Printed Circuit Board)" is a type of printed circuit board that is based on flexible and thin insulating materials such as polyimide, allowing for flexible bending. Taiyo Industry has the experience and track record to manufacture FPCs tailored to various needs. They are used in digital cameras, smartphones, laptops, robots, automobiles, car navigation systems, medical devices, aerospace, and more. Additionally, our company also supports halogen-free types, and please feel free to consult us about combinations of various types and thicknesses. 【Features】 - A type of printed circuit board - Good flexibility with materials like polyimide - Based on thin insulating materials - Flexibly bendable - Halogen-free types are also available *For more details, please refer to the PDF materials or feel free to contact us.

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High-frequency compatible FPC (fluorine composite material specification) flexible printed circuit board

High-frequency compatible FPC (fluorine composite material specification) flexible printed circuit board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (Fluorine Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluorine composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss, enabling stable high-speed, large-capacity communication. ● FPC high-frequency analysis service (optional) It can be used in various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortDeliveryTime #MassProduction

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Bump FPC

Bump FPC

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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MR cylindrical mirror polishing machine retrofit and overhaul (mirror grinding machine)

MR cylindrical mirror polishing machine retrofit and overhaul (mirror grinding machine)

[TAIYO] The MR cylindrical mirror polishing machine that has been in use for a long time can be renewed, and additional features can be added!

The cylindrical mirror polishing machine made by Mirak is highly durable and has been proven for long-term operation, but timely overhauls and retrofits are possible. Existing users are encouraged to consult with us. 【About the MR Cylindrical Mirror Polishing Machine】 We would like to introduce representative models of the MR cylindrical mirror polishing machine made by Mirak. The main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for various material rolling (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless rolls * Carbide and ceramic rubber rolls We will provide detailed specifications of the products based on your requests. Please feel free to contact us first.

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Electrostatic Visualization Monitor [Portable Type]

Electrostatic Visualization Monitor [Portable Type]

Static electricity visible! Real-time monitoring of static electricity that cannot be confirmed with the naked eye!

■ For measuring the charge distribution on material surfaces and electrolytic copper! ■ For monitoring the charge of products on the manufacturing line and workers!

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Electrostatic Visualization Monitor [Bar Type Fixed Installation]

Electrostatic Visualization Monitor [Bar Type Fixed Installation]

Static electricity visible! Real-time monitoring of static electricity that cannot be confirmed with the naked eye!

■Simultaneously measure a wide range of static electricity, such as film and LCD! Bar-type non-contact static electricity visualization system! ■Monitor static electricity that cannot be seen with the naked eye in real-time.

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Classic one-plate type! Stable electrical testing with motor drive!

Classic one-plate type! Stable electrical testing with motor drive!

The basic form of the electrical inspection system! It is used for electrical inspection of various substrates. (Rigid substrates, FPC, PCB, continuity testing, insulation testing, four-terminal testing)

This is a standard electric testing system of the one-plate type. With over 35 years of proven track record, the reliable TY-CHECKER series! (Continuity, insulation, four-terminal, micro-short, spark testing) Please feel free to consult us about various specifications. 【Features】 ■ Maximum inspection size: 550×340mm ■ Equipped with a micrometer adjustment mechanism for the lower jig. ■ Designed with safety considerations for both the working side and the back side. #CircuitBoardInspection #PowerOnTesting #ElectricalTesting #Open #Short #FourTerminal #Inspection

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  • Substrate

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[Presentation of Materials] Until FPC is Completed... (PowerPoint Version)

[Presentation of Materials] Until FPC is Completed... (PowerPoint Version)

【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

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  • Piping and electrical wiring materials
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Pressure Sensor Evaluation Kit [Thin, Flexible, Lightweight]

Pressure Sensor Evaluation Kit [Thin, Flexible, Lightweight]

Let's detect pressure and center of gravity! Here is an introduction to surface pressure sensors.

We have prepared the following kit: - A pressure sensor with 128 arranged cells for load detection - A control board for processing the sensor signals - A PC application for displaying data signals (PC not included) < Sensor Specifications > - Sensor size: 50*35mm (sensor part only) - Method: Pressure-sensitive resistive film type - Cell size: 2×3mm - Number of cells: 128 cells (16×8) The above sensor can be customized. Each customized sensor is applied in various fields such as robotics, medical care, sports training equipment, toys, games, and ergonomic research.

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