Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.
We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various interlayer connections through laser or drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and a variety of substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various interlayer connections through laser or drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Accommodates various substrate materials for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.
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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.