Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
241～270 item / All 379 items
The sequencer board of KAIKEN that leads the era.
A control board for machine embedding aimed at a wide range of applications. It is designed to minimize wiring for conventional control devices and is equipped with highly versatile I/O to keep it compact.
The ability to develop projects that provide captivating visuals and content for people.
Since starting the design of printed circuit boards (PCBs) in 1947 (Showa 22), we have been responding to requests with technology accumulated over more than half a century. Furthermore, in addition to design and production, we also develop software such as control programs for amusement equipment, and create high-value-added products by producing content such as videos and sounds using the latest 3DCG software.
Possible to produce high laser absorption metal powder with finely dispersed ceramic on the surface, and metal/ceramic composite material having complex shape!
Metal and ceramic repel each other when mixing due to their positive surface charge. So since they are dispersed away, the composite can not be formed. The conventional technology uses a binder composed mainly of polyvinyl alcohol to glue metal and ceramic. This is then sintered in order to make a composite powder. However, the binder reduces the functionality due to compositional change (specifically, mechanical property deterioration, optical absorbance decrease, etc.) and handling during production is difficult. This invention is able to easily make ceramic / metal composite by using carbon nanotube (CNT). Application of various powder to bulk material is expected, such as sintered material and composite material by 3D printer. It is also possible to create a pure composite of metal / CNT, and this technology is expected to improve the antioxidation property of the base metal material.
Manufacturing Li4Ti5O12-carbon composite by using microwave at low cost!
Ceramics – carbon composite having multi-function is developed in the recent years. However, the composite is heated at high temperature for a long time during the manufacturing process so the particles are sintering between them and the Li4Ti5O12 nano particles able to generate high power cannot be obtained. Moreover, the synthesis method is complex and uses expensive raw materials so the manufacturing cost is high. This invention can provide oxide ceramics – carbon composite and its manufacturing process with reduced cost. This invention manufacturing process is to mix raw material of oxide ceramics made by LiO2 and TiO2 with carbon and fire with microwave in order to create Li4Ti5O12 carbon composite. As result, Li4Ti5O12 crystalline particle which is an oxide ceramics having particle diameter lower than 250nm; and oxide ceramics – carbon composite having above mentionned carbon bond on the crystal plane (111) and (200) of the oxide ceramics – carbon composite were obtained.
![IoT-enabled devices with control platform and smartphone app! [Distribution of system case study materials]](https://image.www.ipros.com/public/product/image/983/2000354374/IPROS7721001701572451820.jpg?w=280&h=280)
Examples of sensor measurement systems using Bluetooth and Wi-Fi! In-house integrated support for circuit board and software development!
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." By connecting control boards with communication functions to devices, we enable the transmission of device data to smartphones. The data collected from the devices can be sent to a server using the smartphone's internet communication capabilities, allowing for data viewing and management on servers or PC terminals. [Key Points of Our IoT Development] ★ We handle board and software development consistently in-house. ★ Leveraging our experience in MAC development, we specialize in iOS application development. - Sensor measurement systems using Bluetooth/Wi-Fi - Development of communication control boards - Development of dedicated control/viewing applications - Data transfer to cloud servers, etc. ◇ We also have numerous achievements in in-house and contract development! Please feel free to consult with us! ◇ ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Development of control boards for measuring sensors and Bluetooth integration with tablets (iPads) for measurement applications. 1. Measure the load capacity of transport vehicles using measuring sensors. 2. Share information from the measurement application via Bluetooth through the communication control board. 3. In offices, capture and aggregate vehicle numbers, loading dates, locations, and quantities. Information on work status and movement can be viewed in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT transformation of devices through the integration of "control boards" and "smartphone applications." ■ Example: Production Line Automation Features 1. Automatic recognition and transfer of item information using barcodes, etc. 2. Counting production volume using count sensors. 3. Information sharing with each site and factory through an IoT gateway. 【Real-time Aggregation System Using Cloud Server】 ■ Item Information Transfer: Automatically aggregates item information recognized from barcodes to the cloud server. ■ Automation and Real-time Aggregation of Production Volume: Count sensors are installed on packaging band machines and conveyors, enabling automatic aggregation and real-time understanding at each site. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Production Line Work Record System 1. Record the work details for factories 1 to 3 individually on each tablet. 2. Save all work records to a single cloud for centralized management of multiple lines. 3. Information from each line can be monitored in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System Enables management of real-time operational status of each factory from PCs at various locations. 1. Record and manage the operational status of each factory on their respective PCs. 2. Collect records from each factory via the cloud for centralized management. 3. As a security measure, restrict access to devices that can access the cloud, preventing information leakage. ★ We also have numerous achievements in both in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
Introduction of examples such as load measurement sensor Bluetooth control systems and remote monitoring systems for gas facilities.
In our IoT development, we realize the IoTization of devices through "control boards" and "smartphone applications." Furthermore, it is possible to manage information using the cloud, link vehicle information, and integrate health management and advisory services. Based on specific examples, we will provide a detailed introduction to the mechanisms in place and how they can be utilized. *Details of the examples can be viewed through the related links. For more information, please feel free to contact us.
Galapoe substrate and composite are standard. Other special materials such as BT resin are also regularly stocked.
We standardly use FR-4 (glass epoxy substrate) and CEM-3 (composite), but we also keep special materials such as BT resin in stock. We offer a wide range of thicknesses from 0.06 mm to 3.2 mm. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.
Supports from 4 layers to 24 layers. Also compatible with special substrates such as through-hole resin filling.
We can accommodate from 4 layers to 24 layers. Additionally, we can handle special substrates such as impedance control and through-hole resin filling. We operate three vacuum press machines, allowing for quick turnaround even in mass production. We can ship in as little as 2 working days. For more details, please contact us or refer to our catalog.
By using thin materials, a flexible substrate with a total thickness of 50μ can be achieved.
Single-sided flexible printed circuit boards are available in various material thicknesses. By using thin materials, it is possible to achieve a total thickness of 50μ for the thinnest flexible boards. We can also accommodate fine pattern substrates using thin copper foil materials, as well as halogen-free options. For more details, please contact us or refer to our catalog.
Production is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.
We can manufacture from 3 to 8 layers. Typically, with multilayer flex circuits, as the number of layers increases, the thickness also increases, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.
Production possible from 2 layers to 8 layers. Prototyping of rigid-flex PCBs is available with short lead times and low prices.
We can manufacture from 2 layers to 8 layers. When it comes to rigid-flex PCBs, it often requires creating molds, making it very expensive even for prototypes, and the production time can be significantly long. At K2 Co., Ltd., we combine our experience as a rigid PCB manufacturer with our experience as a flexible PCB manufacturer to offer rapid prototyping of rigid-flex PCBs at low prices. We can flexibly accommodate complex shapes and special layer configurations, so please feel free to consult with us. For more details, please contact us or refer to our catalog.
A substrate that connects only the necessary interlayers without penetrating the holes in a multilayer substrate.
This is a substrate that connects only the necessary layers without penetrating holes in a multilayer board. As the number of layers in printed circuit boards has increased, the demand for this has grown. It can be manufactured using either blind via holes that connect the outer and inner layers or inner vias that embed through holes in the inner layers. Additionally, it is compatible not only with standard multilayer boards but also with multilayer flexible boards and rigid-flex boards. For more details, please contact us or refer to the catalog.
![New Comprehensive Catalog from a Specialized Substrate Manufacturer [*Low-Cost Solutions for Special Substrates!*]](https://image.www.ipros.com/public/product/image/dbe/2000197055/IPROS6442627502211844957.GIF?w=280&h=280)
A comprehensive catalog filled with hints for achieving ultra-short delivery times for special substrates is available for free!
At K2, we have all the manufacturing equipment necessary for circuit board production fully in-house, and by operating that equipment at 100%, we achieve shorter lead times and lower costs for special circuit boards and medium-lot products that are difficult for prototype manufacturers to handle. 1. They don't respond to ultra-short lead times... 2. The initial costs for flexible boards are too high... 3. I was turned down when consulting about special circuit board manufacturing... 4. They don't respond to short lead times for medium-lot production... 5. There are concerns about the quality of the circuit boards... We will solve these five issues faced by the circuit board manufacturing industry using our unique know-how. 【Case Studies】 ■ Resin filling (Pad on Via hole) specification ⇒ Instead of the usual 3 extra days required for outsourcing, we can handle it in 1 day! ■ Double-sided flexible circuit boards ⇒ Achieved shorter lead times and reduced initial costs by using laser processing instead of molds for shape processing! ■ 4-layer rigid-flex circuit boards (without reinforcement) ⇒ Normally 7 days, expedited response in 6 days! *For more details, please contact us or download our catalog to view.
First, please consult with us! We offer low-cost and quick turnaround solutions for special substrates such as rigid and flexible boards.
K2 has all the manufacturing equipment necessary for circuit board production fully equipped in-house, achieving 100% operation to realize shorter delivery times and lower costs for special circuit boards and medium-lot products that are difficult for prototype manufacturers to handle. 1. They don't respond to ultra-short delivery times... 2. The initial costs for flexible boards are too high... 3. I was turned down when consulting about special circuit board manufacturing... 4. They don't respond to short delivery times for medium-lot production... 5. There are concerns about the quality of the circuit boards... We solve these five issues faced by the circuit board manufacturing industry with our unique know-how. *Currently offering free samples of special circuit boards to a limited number of 10 companies! For more details, please download the catalog from the form below or contact us.* [Case Studies] ■ Double-sided flexible circuit board ⇒ Achieved shorter delivery times and reduced initial costs by using laser processing instead of molds for shape processing! ■ 4-layer rigid-flex circuit board (without reinforcement plate) ⇒ Normally 7 days, express response in 6 days!
Equipped with the necessary facilities for substrate manufacturing, we offer integrated production in-house. "All types of substrates" delivered in a short lead time.
Our company possesses a wide range of equipment necessary for circuit board manufacturing, including "copper plating," "gold plating," "impedance measuring instruments," "impedance simulation software," and "resin filling machines." We can produce all types of circuit boards in-house and achieve "same-day delivery" through thorough deadline management. 【Features】 ■ Capable of handling medium lot sizes ■ Significant reduction in delivery times for flexible circuit boards ■ Quick response for repeat orders ■ Capable of accommodating special circuit boards *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Free express delivery! We can respond to short delivery times through in-house integrated production and thorough deadline management.
Our company is fully equipped with all the necessary facilities for substrate manufacturing, including copper plating and gold plating, allowing us to respond to short delivery times through in-house integrated production. Furthermore, with our unique in-house production management system, we ensure thorough deadline management, eliminating any gaps in the process, and all products are completed on time. Additionally, as a prototype substrate manufacturer, we have a large production line capacity, enabling us to complete medium lot products in a short time frame as well. [Reasons for Achieving Short Delivery Times] ■ All equipment is in-house ■ Operations on Saturdays ■ Quick repeat orders *For more details, please refer to the PDF document or feel free to contact us.
Significant cost reductions are possible in small lot manufacturing of flexible printed circuit boards! We also support medium lot manufacturing.
Our company has achieved coverlay processing and contour processing of flexible substrates using our unique know-how with lasers. As a result, we can significantly shorten the manufacturing lead time for flexible substrates and reduce initial costs substantially through "no mold cost." It is also possible to perform corrections for each substrate, ensuring very high processing precision. [Overview] ■ Significant cost reduction through laser processing ■ Supports medium lot production of flexible substrates *For more details, please refer to the PDF document or feel free to contact us.
We prevent troubles before they occur with our manufacturing know-how through in-house integrated production!
Our company has all manufacturing lines in-house, and our experienced staff is well-versed in each piece of equipment. Good quality is essential to achieve short delivery times and special substrates. By conducting daily inspections and maintenance on each piece of equipment, we can prevent problems before they occur. Additionally, thorough intermediate inspections such as pattern inspections using AOI (Automated Optical Inspection) and continuity checks using flying checkers allow us to detect issues early in the process, preventing defective products from being released and avoiding delays in delivery. 【Quality Improvement Equipment】 ■ DI (Direct Imaging) ■ AOI (Automated Optical Inspection) ■ Flying Checker *For more details, please refer to the PDF document or feel free to contact us.
It provides the host computer with the accurate time without any time lag.
Microsemi's Truetime TTM-635 and Spectracom's Bancomm bc635VME board are compatible with the above two discontinued products. Please refer to the catalog for details.
"The future is in your hands" - We customize bio-compatible consumables and circuit boards.
"NEXTERION(R)" is a brand of clean substrates and coated substrates used in research, diagnostics, and various other life science fields. With over 15 years of experience in microarray and lab-on-a-chip solutions, we offer a wide range of standard products and functional coatings for DNA, protein, and cell applications. Additionally, to meet the needs for custom products, we develop unique shapes, materials, coatings, and marking technologies. 【Features】 ■ Brand of clean substrates and coated substrates ■ For DNA, protein, and cell applications ■ Wide range of standard products and functional coatings ■ Custom product needs accommodated ■ Development of unique shapes, materials, coatings, and marking technologies *For more details, please refer to the PDF document or feel free to contact us.
Air sterilization with UV-C ultraviolet light! The PHILIPS 'UV-C Indoor Air Sterilizer' is a safe and reliable product! The latest solution for droplet infection prevention!
Air is drawn in from the intake vent at the bottom of the unit, and UV-C light is emitted from the internal ultraviolet lamp. The sterilized clean air is expelled from the exhaust vent at the top of the unit. Since UV-C does not leak outside, it can be used safely even in crowded places. It is recommended for large spaces such as stores, facilities, classrooms, offices, and lobbies! ■ No installation required! Simply plug it into an outlet and it's ready to use. ■ Excellent safety features - Ozone-free - Error display when the lamp is not lit - Operation stop mechanism when the intake vent is open (to prevent unexpected UV-C exposure) ■ High design quality - Simple and stylish design ■ User-friendly control panel - Timer settings: 30 minutes / 60 minutes / 120 minutes / continuous operation - Remaining time display - Three-speed fan settings available ■ Top-tier processing capability for UV-C air sterilizers Airflow processing capacity: 550m³/h UV-C radiation amount: 18Wx4=72W ■ Maintenance-free ■ UV-C (ultraviolet C wave) resistant design - Plastic housing with excellent UV-C resistance - Internal sterilization unit with a metal structure
You can save I/O pins! Up to 4 VL53L0X laser distance sensors can be connected.
The "I2C_4SENSOR board" is a shield board that connects to the Arduino Uno (R3) to read values from the VL53L0X laser distance sensor. Since the VL53L0X laser distance sensor communicates via I2C, it allows for saving I/O pins. Up to four VL53L0X laser distance sensors can be connected. 【Features】 ■ Connects to Arduino Uno to read values from the VL53L0X laser distance sensor ■ Saves I/O pins ■ Up to four VL53L0X laser distance sensors can be connected *For more details, please refer to the PDF document or feel free to contact us.
We will take on and respond to all kinds of special substrates.
Sanwa Electronic Circuit Co., Ltd. was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently produced printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004 and have since embarked on a new journey as Sanwa Electronic Circuit Co., Ltd. This integration has consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory, resulting in a rich variety of product specifications and a flexible production system capable of accommodating all lot sizes. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.
We can accommodate substrate board thicknesses starting from 0.04mm! We respond widely to our customers' needs.
The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond broadly to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.
The substrate mainly uses FR-4 and CEM-3 materials! We provide circuit boards tailored to your needs.
A "double-sided board" is a printed circuit board that forms circuits on both sides of the substrate and connects the circuits on both sides through plated through-holes. Our company offers various types of substrates tailored to applications, including high-density boards for miniaturization and increased component placement flexibility, thin boards, COH boards, edge-plated through-hole boards, and thick copper boards for high current applications. We can also accommodate requests for short delivery times, primarily using FR-4 and CEM-3 materials. 【Features】 - Mainly uses FR-4 and CEM-3 materials - Can accommodate requests for materials that support high heat resistance, etc. - Can respond to requests for short delivery times *For more details, please refer to the PDF materials or feel free to contact us.
We respond to requests for short delivery times! We provide circuit boards tailored to various applications.
A "single-sided board" is a printed circuit board that has circuits formed on only one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards that enhance miniaturization and component mounting density, as well as power boards that support high current. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The substrate mainly uses FR-4, CEM-3, and FR-1 materials. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.
