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  6. End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

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last updated:Jan 07, 2025

三和電子サーキット
三和電子サーキット
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Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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端面スルーホール基板.PNG

End face electrode substrate "End face through-hole substrate"

端面スルーホール基板.PNG
端面スルーホール基板.PNG
  • Related Link - https://se-circuit.co.jp/products/tanmen/

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End face electrode (end face through hole, burr prevention, soldering measures)

End face electrode (end face through hole, burr prevention, soldering measures)

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三和電子サーキット

三和電子サーキット

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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.

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