substrate Product List and Ranking from 22 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 三和電子サーキット Osaka//others
  2. サクサテクノ Tokyo//Building materials, supplies and fixtures manufacturers
  3. 三協テクノ Gifu//Building materials, supplies and fixtures manufacturers
  4. 4 null/null
  5. 4 null/null
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substrate Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Developable product: Ceramic balls 三協テクノ
  2. End face electrode substrate "Narrow Pitch End Face Through Hole Substrate" 三和電子サーキット
  3. Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm] モリシン工業 本社
  4. Piezoelectric Buzzer (DC) 'ESZ-25C/ESZ-26B' サクサテクノ
  5. 4 [Case Study 3] High-Precision Porous Ceramic Vacuum Chuck

substrate Product List

1～15 item / All 53 items

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Developable product: Ceramic balls

Developable product: Ceramic balls

Ceramicization of natural stone! With abundant experience and unique technology, we offer contract manufacturing at low cost!

We would like to introduce our developable product, "Ceramic Balls." From π-type ceramics, far-infrared rays and negative ions are continuously generated in a stationary state through a special formulation, allowing us to manufacture a variety of ceramics for multiple applications, including drinking water, bathing, circulation systems, and immersion. We also offer contract processing for pressed products, cast products, extruded products, granulated products, and more. Please feel free to contact us when you need assistance. 【Standard Ceramic Ball Lineup (Partial)】 ■ Magceramic Ball (πMag) ■ πMag + Tourmaline Ball ■ IOH Ball ■ COR Ball ■ Ion White-1 *For more details, please refer to the related links or feel free to contact us.

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Diagonal comb-shaped electrode substrate

Diagonal comb-shaped electrode substrate

Limited quantity for shipment! Line & Space 4μm/10.5μm

We would like to introduce the "Diagonal Comb Electrode Substrate" handled by EHC Corporation. This is a test substrate with an ITO pattern that has a 15° tilt, with a line and space of 4μm/10.5μm. It is a limited quantity product. The glass substrate material is EAGLE-XG, and the substrate glass size is 30x35x0.7mm. The electrode material is ITO, and the electrode film thickness is 70nm. 【Specifications】 ■ Glass substrate material: EAGLE-XG ■ Substrate glass size: 30x35x0.7mm ■ Electrode material: ITO ■ Electrode film thickness: 70nm ■ Electrode line width: 4μm ■ Electrode space: 10.5μm *For more details, please download the PDF or feel free to contact us.

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Vacuum chuck (standard type hole diameter φ0.5 and above)

Vacuum chuck (standard type hole diameter φ0.5 and above)

Cost reduction and weight reduction with a vacuum chuck made of honeycomb panels!

Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous materials and processed products, allowing for cost reduction through lightweight design. It can be manufactured in custom sizes ranging from a minimum of approximately 100mm square to a maximum of about 2000mm x 4000mm. Additionally, it is possible to set multiple suction areas on a single suction panel. We can accommodate everything from custom orders starting from one piece to mass production, so please feel free to contact us. For requests for quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of the case studies from the "Download" section.

  • Aluminum alloy door

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Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm]

Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm]

If it's a honeycomb panel, we can produce custom vacuum chucks at low prices and with short delivery times, starting from just one piece!

Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous and cast products, allowing for cost reduction through lightweight materials. It can process suction holes with a diameter of 30μm, minimizing deformation of the workpiece. Dimensions can be customized freely within 2000mm x 4000mm, and it is also possible to set multiple suction areas on a single vacuum chuck. We can accommodate everything from custom orders for single items to mass production, so please feel free to contact us. For quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of case studies from the "Download" section.

  • Aluminum alloy door
  • Interior construction

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Ceramic balls for crushing

Ceramic balls for crushing

Choose the material that suits your purpose! We offer a variety of hard material balls.

Ito Manufacturing Co., Ltd., a manufacturer specializing in general scientific and physical instruments primarily in the field of powder technology, offers "ceramic balls for grinding." The hard material balls include high-purity alumina balls, high-purity alumina beads, alumina balls, zirconia balls, and silicon nitride balls. Please select the material that suits your application. 【Hard Material Balls】 ■ High-purity alumina balls (Al2O3-99.9% or higher) ■ High-purity alumina beads (Al2O3-99.99%) ■ Alumina balls (Al2O3-99.5%) ■ Zirconia balls (ZrO2-95%) ■ Silicon nitride balls (Si2N4-92%) ■ Titanium oxide balls (TiO2-77.7%, Al2O3-17.4%, SiO2-4.6%) ■ Silicon carbide balls (SiC-97% and others) ■ High-purity quartz balls, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that allows you to connect three HAT boards to a Raspberry Pi. You can attach a Raspberry Pi 3 or Raspberry Pi ZERO (WH) to the lower left part of the board, and other HAT boards can be attached elsewhere. There are free through-holes in the lower right part of the board, allowing you to solder and use it like a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C for external connections are provided (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted in the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Back Drill Substrate"

High-speed signal, high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It enables the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Enables the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and other factors. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, and other factors *For more details, please refer to the PDF document or feel free to contact us.

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Functional step board

Functional step board

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Functional Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate. This allows us to provide copper-thick hybrid circuit boards with continuous wiring. By forming unevenness through step formation in part of the circuit, we can enable height adjustment of mounted components and impart functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used only for several bends or during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between other substrates, all suitable for multiple bends. Please feel free to contact us when you need assistance. 【Specifications (Partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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Wear-resistant ceramic double tube silicon nitride

Wear-resistant ceramic double tube silicon nitride

Incredible wear resistance! By using silicon nitride only in the wear parts, it can be implemented at a low cost!

We would like to introduce the "Wear-Resistant Ceramic Double Pipe Silicon Nitride" from Kyushu Ceramics Industry, which we handle. With a unique raw material formulation, sleeve type, and smooth bend design, it excels in wear resistance, extending service life and reducing maintenance. Various molding methods such as pressure casting and CIP allow for the production of a wide variety of small-lot piping. We manufacture in an integrated process from design to ceramic production, canning, and construction, striving to respond quickly to customer requests. 【Features】 - Unique raw material formulation, sleeve type, and smooth bend design - Excellent wear resistance, extending service life and reducing maintenance - Capable of producing a wide variety of small-lot piping using various molding methods such as pressure casting and CIP - Silicon nitride has more than ten times the wear resistance of alumina - By using silicon nitride only in the wear parts, it can be introduced at a low cost *For more details, please refer to the PDF document or feel free to contact us.

  • Piping materials (copper pipes, cast iron pipes)

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