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  6. [Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

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last updated:Jan 07, 2025

三和電子サーキット
三和電子サーキット
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Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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2校_1007_se-circuit_550_550_2046758.jpg

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

2校_1007_se-circuit_550_550_2046758.jpg
2校_1007_se-circuit_550_550_2046758.jpg
  • Related Link - https://se-circuit.co.jp/

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【Specifications】 Number of layers: Single-sided / Double-sided Board thickness: 0.06 to 0.1 mm Flexural resistance (compliant with JISC5016): - Board thickness 0.06t: 1000 times at R5 - Board thickness 0.1t: 500 times at R5 Minimum bending radius: Can be bent up to 5 times at R1.5 Surface treatment: Heat-resistant preflux, electrolytic and non-electrolytic gold plating External processing: Router compatible *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

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Substrate Variations <Flexible Substrates・Thin Plate Bending Substrates>

Substrate Variations <Flexible Substrates・Thin Plate Bending Substrates>

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Introduction to SEC Special Substrates

Introduction to SEC Special Substrates

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三和電子サーキット

三和電子サーキット

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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.

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