[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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