Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates.

In the IoT era, we propose the use of copper inlay boards and metal-based substrates for heat dissipation solutions, as well as ultra-thin boards to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related problems with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the amount of heat generated by components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate various shapes. 【Products We Handle】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for the attachment of heat dissipation sheets to create double-sided boards. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be bent into shape. - The use of flexible resin and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

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