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三和電子サーキット

addressOsaka/Higashisumiyoshi-ku, Osaka-shi/3-28-1 Sōzu
phone06-4301-1531
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last updated:Dec 03, 2024
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  • Company information
  • Products/Services(38)
  • catalog(15)
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三和電子サーキット Company Profile

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.

Business Activities

【Design】 Pattern design, CAD design, SI analysis, PI analysis 【Products】Printed circuit boards (PCBs) Single-sided boards, double-sided boards, multilayer boards, build-up boards, IVH boards Device boards, flexible boards, aluminum base boards, aluminum boards Heat dissipation boards, copper inlay boards (copper coin boards), back drill boards High-frequency boards, fluororesin boards, impedance control boards Ultra-thin printed circuit boards, edge-plated through-hole boards 【Assembly】 Prototype assembly support

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Products/Services (38)

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending! product image
[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!
Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates. product image
Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates.
CAD design and prototype implementation product image
CAD design and prototype implementation
Thin plate bending substrate product image
Thin plate bending substrate

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catalog(15)

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Introduction to SEC Special Substrates

Introduction to SEC Special Substrates

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Introduction to SEC Special Substrates

Introduction to SEC Special Substrates

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End face electrode (end face through hole, burr prevention, soldering measures)

End face electrode (end face through hole, burr prevention, soldering measures)

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Heat-dissipating substrate variation

Heat-dissipating substrate variation

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Detailed information

Company name 三和電子サーキット
Contact addresspostalcode 546-0041 Osaka/ Higashisumiyoshi-ku, Osaka-shi/ 3-28-1 SōzuView on map TEL:06-4301-1531 FAX:06-4301-1537
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