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Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, capturing and monitoring the operational status such as screen displays. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects using loggers for parameters like voltage, current, resistance, and temperature is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber equipped with a front glass window option, a camera, and monitoring software to conduct environmental testing while capturing and monitoring the condition of the test equipment.

In the methods for cross-section preparation in semiconductor structural observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanical polishing, which requires technical skill, is decreasing. However, it is still not to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is comparable to FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing methods according to the observation purpose and the composition and structure of the samples.