Total Support Service for Reliability

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, capturing and monitoring the operational status such as screen displays. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects using loggers for parameters like voltage, current, resistance, and temperature is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber equipped with a front glass window option, a camera, and monitoring software to conduct environmental testing while capturing and monitoring the condition of the test equipment.

We conduct "IOL testing of discrete semiconductors" at our company. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to the heat generated by the device itself during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating, as well as the fan capacity/timing during cooling.

We would like to introduce the "strain measurement of thermal shock testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record strain data in real-time during the test. For two types of copper-clad laminates, the strain behavior during thermal shock testing was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.

Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process. We replicate moisture absorption prior to mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting. Additionally, as part of the post-test inspection, we perform inspections similar to the initial measurements, and if necessary, we also conduct analyses such as cross-sectional observation of defective parts. For more detailed information, please refer to the related products and catalogs.