It provides a detailed explanation of various wire bonding techniques, results, and discussions!
This document presents the bonding interface of Cu wire bonding in semiconductor packages. It provides a detailed explanation of samples and methods, various wire bonding techniques, results, and discussions, accompanied by figures and photographs. [Contents] ■ Introduction ■ Samples and Methods ■ Various Wire Bonding Techniques ■ Results and Discussion ■ Conclusion ■ References *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Published Content (Excerpt)】 ■Results and Discussion - Observation of the bonding area - Selection of cross-section preparation method - Distribution of coated Pd - Observation of Cu grains using EBSD - Cu-Al joint interface - Observation of Al joint surface after opening etching *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（9）
Download All Catalogs![[Data] Ion Migration Evaluation Test](https://image.www.ipros.com/public/catalog/image/01/9c8/485728/IPROS73208184248663868551.jpeg?w=120&h=170)
![[Data] Examples of Defects and Analysis of Solar Cells](https://image.www.ipros.com/public/catalog/image/01/897/485737/IPROS08603660121166544367.jpeg?w=120&h=170)
![[Cheetah EVO Case Study] Observation of IC Type Coils](https://image.www.ipros.com/public/catalog/image/01/40e/478427/IPROS43080621970966399269.jpeg?w=120&h=170)
![[Cheetah EVO Case Study] Observation of Inductor Coils (Orthogonal CT Observation)](https://image.www.ipros.com/public/catalog/image/01/d94/478426/IPROS11705774122712488334.jpeg?w=120&h=170)
![[Data] On the bonding interface of Cu wire bonding](https://image.www.ipros.com/public/catalog/image/01/358/499323/IPROS43174235351248870533.jpeg?w=120&h=170)
Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
![[Rental] KBX-P51 Earphone Microphone Set](https://image.www.ipros.com/public/product/image/254366/IPROS3118389738089034423.jpg?w=280&h=280)