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The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.
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TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.
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We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.
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Aites is a solution-oriented company that sincerely addresses customer challenges in cutting-edge industrial fields. We utilize various owned devices to provide optimal solutions. ■ Product Analysis / Defect Analysis / Failure Analysis Morphological observation, electrical characteristic measurement, defect analysis, failure analysis, sample processing ■ Reliability Evaluation Testing Reliability evaluation testing, ESD/latch-up testing, strength testing, optical characteristics ■ Physical Analysis / Chemical Analysis Physical analysis, surface analysis, chemical analysis
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■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.
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■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors
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We provide testing services to evaluate the resistance to ESD damage and latch-up damage, which are important for the reliability of semiconductor devices and electronic components that include them. ■ We accommodate products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We offer tests in accordance with standards such as JEDEC, EIAJ, and ESDA. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with resistance, we assist with failure analysis and problem resolution.
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【Testing, Evaluation, Analysis】 ●Reliability Testing ■Temperature Cycle Testing ■Thermal Shock Testing ■High-Temperature Storage Testing ■Highly Accelerated Life Testing ■Preconditioning ■Hot Oil Testing ■In-situ Continuous Measurement ■Ion Migration Testing ■Electromigration Testing ■Test Consulting ●Evaluation Testing ■Bond Strength Testing: Pull/Shear Testing ■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength ■ESD/Latch Up/CDM Testing ■Electrical Characteristic Measurement ■Salt Spray Testing ●Analysis ■X-ray Transmission Observation ■Ultrasonic Microscope Observation ■Luminescence Analysis (EMS/IR-OBIRCH) ■Scanning Electron Microscope (SEM) ■Transmission Electron Microscope (TEM) ■Surface Contamination Analysis (TOF-SIMS) ■Foreign Material Analysis (FT-IR)
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In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a readout method where samples are taken out from a stress environment at fixed times, failure can only be understood at the timing of the readout, making it impossible to know the exact time of failure occurrence. In-situ measurement allows for accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, these recoverable failures cannot be detected using the readout method, but in-situ measurement allows for the detection of recoverable failures, enabling accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application conditions and measurement data can be confirmed in real-time.
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● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback on failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects in reliability testing, we support accurate and timely identification and analysis of causes through a rich and efficient analysis menu. ● Use only the services you need as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.
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