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  6. Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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last updated:Nov 07, 2019

アイテス
アイテス
  • Official site

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

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TEMによる電子部品・材料の解析.png

Analysis of electronic components and materials using TEM.

TEMによる電子部品・材料の解析.png
TEMによる電子部品・材料の解析.png
  • Related Link - https://www.ites.co.jp

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basic information

■The defective area identified by emission luminescence will be observed while thinning it using FIB. ■Using a 400kV TEM with high electron transmission power, we can repeatedly perform transmission observation and FIB processing while confining the defective area within the sample thickness to obtain the optimal image. ■The TEM image magnification can be calibrated in advance, allowing for length measurements with an error of less than 2%.

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※It varies depending on the content (expedited response available).

Applications/Examples of results

- TEM observation of specific areas (application to semiconductor failure sites) - Elemental analysis, electron diffraction (EDS, EELS, electron diffraction images) * Analysis of semiconductor products such as TFT failure analysis, MOS FET failure analysis * Structural analysis of LSI

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Failure analysis of power devices

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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Total support service for cross-section grinding, processing, observation, and analysis.

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Observation of the coating layer of eyeglass lenses using a microtome.

Observation of the coating layer of eyeglass lenses using a microtome.

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Announcement of the introduction of Talos F200E

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Specification verification and failure analysis through reliability testing.

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TEM observation of PL emission sites in SiC.

TEM observation of PL emission sites in SiC.

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Announcement of the introduction of Talos F200E

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Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has been improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which integrates multiple frames while correcting for drift.

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アイテス

アイテス

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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