substrate Product List and Ranking from 104 Manufacturers, Suppliers and Companies | IPROS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. ケイツー Osaka//others
  3. 三和電子サーキット Osaka//others
  4. 4 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  5. 5 アイエムテック Osaka//Interior Design
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substrate Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. JL Irregular Insert Series S Insert ジャパンライフ
  3. Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE) ケイツー
  4. 4 Vacuum chuck (standard type hole diameter φ0.5 and above) モリシン工業 本社
  5. 5 LED signal light circuit board unit 'MR1505-100AR' 150φ red アイエムテック

substrate Product List

91～120 item / All 377 items

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a substrate with resin embedded in the through holes and pads placed on top of it.

This is a circuit board designed to secure mounting space for components by embedding resin into through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

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Benefits of K2: Reducing initial costs of flexible circuit boards.

Benefits of K2: Reducing initial costs of flexible circuit boards.

Mold cost 0 yen! Cut initial costs to manufacture flexible substrates cheaply and quickly!

At K2, we do not create molds or Thomson molds (Victoria type) for small lot production of flexible printed circuits, allowing us to respond to generally time-consuming flexible circuit manufacturing with short lead times. Since there are no costs for creating molds, we can significantly reduce the initial costs, making our prices attractive. Additionally, this method allows for individual correction of each circuit board, which is a benefit for high quality. 【Features】 ■ No mold costs for flexible printed circuits ■ Short lead times ■ High quality *For more details, please refer to the PDF document or feel free to contact us.

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Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

We can manufacture special circuit boards that align with your design philosophy! We also accommodate high-difficulty designs and specifications.

Our company possesses a series of equipment necessary for substrate manufacturing, including plating process equipment and manufacturing lines for build-up substrates. We can also consistently produce special substrates that require advanced processing technology and precision, and we can provide them in a short delivery time. Additionally, our specialized staff will thoroughly respond to inquiries after delivery, such as requests for environmental surveys or questions after substrate manufacturing. 【Features】 ■ Flexible response to detailed customer requests ■ Detailed data checks contribute to reducing delivery times and costs ■ Short delivery times possible through in-house integrated production and thorough delivery management *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Have you ever been turned down for special substrate manufacturing?

Have you ever been turned down for special substrate manufacturing?

Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of special substrates.

Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, including advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we are able to accumulate a broad knowledge and expertise regarding substrates by inheriting past experiences, allowing us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Same manufacturing line as trial production! With a 100% equipment utilization rate, short delivery times for medium lot production are possible.

Our company is equipped with large-capacity facilities as a prototype manufacturer, allowing us to produce not only small lots but also medium-lot prototypes and medium-volume production with short lead times. Thanks to the 100% operational rate of our large-capacity equipment, we can respond without any issues to sudden requests, even when the quantities are large. We have secured sufficient inventory even during periods when material procurement was difficult, ensuring there are no delays in delivery. 【Features】 - Capable of producing small lots as well as medium-lot prototypes and medium-volume production with short lead times - 100% equipment operational rate - Sufficient inventory secured, with no delays in delivery - Initial costs do not become excessively high - Capable of handling special substrates such as flexible and rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

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Are you having trouble with substrate manufacturing and component mounting?

Are you having trouble with substrate manufacturing and component mounting?

We respond to various requests! We can handle everything from circuit board design to component assembly in one go.

We value conversations with our customers and design simple and easy-to-understand printed circuit boards. We have experience in various types of board design, including power supply, analog, and high-frequency boards, and we respond to various requests for component mounting based on quantity and requirements. Our assembly factories also have areas of expertise, so we partner with over 10 factories and coordinate according to the specific needs of each project. We can accommodate requests for ultra-short delivery times in conjunction with board manufacturing. 【Board Design】 ■PADS ■Quadcept ■CR8000 ■CR5000 *For more details, please refer to the PDF materials or feel free to contact us.

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We won't lose! Leave it to us for quick turnaround on build-up substrates.

We won't lose! Leave it to us for quick turnaround on build-up substrates.

High quality and quick delivery are possible! If you have any concerns, please feel free to consult with us!

K2 has all the necessary equipment for circuit board manufacturing in-house. Since we can complete all processes without relying on outsourcing, we are able to respond to short delivery times. Additionally, our factory operates on Saturdays, allowing us to count Saturdays as manufacturing days. "We don't accommodate ultra-short delivery times," "We were turned down for consultations on special circuit board manufacturing," "We have concerns about the quality of the circuit boards." We will solve these issues using K2's unique know-how. 【What K2 can do】 ◆ Number of layers We have numerous manufacturing achievements from 1 to 4 layers. ◆ Capable of manufacturing with various materials and specifications We also handle complex specifications such as high-frequency build-up boards and build-up rigid-flex boards. *Depending on the specifications, we can manufacture in as little as one week. For more details, please download our catalog or feel free to contact us.

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NEXTERION(R)『PreScora』

NEXTERION(R)『PreScora』

An innovative solution that provides high-performance diagnostic consumables compatible with custom formats.

"PreScora" enables the production of highly customized coated and pre-cut substrates for demanding applications through our unique laser processing. In addition to standard formats in life sciences, such as SBS-compliant microplates and microscope slides, we can also process custom formats. Furthermore, the coating process is conducted in a clean room compliant with ISO Class 5 standards, allowing for the manufacturing of high-performance consumables with extremely high quality. [Features] ■ Our unique laser processing ■ For demanding applications ■ Capable of producing coated and pre-cut substrates ■ Supports various formats ■ Capable of marking logos, barcodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Plate glass and mirrors
  • Processing Technology
  • Glass blocks and crystallized glass
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NEXTERION® "Amino Silane Coating"

NEXTERION® "Amino Silane Coating"

Manufactured in a clean room compliant with ISO Class 5 standards! Physical and functional quality control.

"Amino silane coating" is a coating that binds to the surface through the ion attachment of amine groups formed on the surface and negatively charged phosphate groups of the DNA backbone. By using very short amino silanes, it achieves high signal sensitivity and very low background noise signals compared to conventional amino silane-coated substrates. Additionally, it is manufactured using standardized processes in an ISO Class 5 cleanroom environment, applying a strict quality control system. 【Features】 ■ Our optimized proprietary thin film formation process ■ Excellent reproducibility both within and between lots ■ Physical and functional quality control ■ Manufactured in a cleanroom compliant with ISO Class 5 standards ■ Related processes prepared to meet the needs of diagnostic companies *For more details, please refer to the PDF materials or feel free to contact us.

  • Plate glass and mirrors
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NEXTERION(R) "Epoxy Silane Coating"

NEXTERION(R) "Epoxy Silane Coating"

A circuit board that supports both standard and custom formats, easy to handle!

"Epoxy silane coating" is the most common surface chemistry technology and is widely used in diagnostic applications. A multifunctional epoxy silane layer is formed on the substrate, which covalently bonds with most types of biomolecules, including amino-modified or non-amino-modified DNA, RNA, and proteins. Additionally, a uniform epoxy silane layer is formed on a defect-free surface, allowing for highly efficient covalent bonding and significantly reducing background levels. 【Features】 ■ Widely used in diagnostic applications ■ Covalently bonds with most types of biomolecules ■ Easy-to-handle substrates ■ Various protocols for different applications are published ■ Compatible with both standard and custom formats *For more details, please refer to the PDF materials or feel free to contact us.

  • Plate glass and mirrors
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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter wave wiring circuit boards.

We provide a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology through patent information, offering an overview of the advanced patent environment. 【Related Materials】 ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

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PHILIPS UV-C Upper Air Sterilizer *Documentation with case studies available

PHILIPS UV-C Upper Air Sterilizer *Documentation with case studies available

Utilizing ultraviolet light, inactivates 99% of the novel coronavirus attached to surfaces in just 6 seconds! PHILIPS 'UV-C Upper Air Sterilizer'

This is a UV-C sterilization device installed on ceilings and walls that sterilizes indoor air and can be used continuously in places where people are present. It utilizes natural air convection to cover the entire indoor space and is designed to eliminate maintenance efforts by not requiring electric fans or similar devices. When installed near air conditioning vents or doors, it can further promote the circulation of upper air and enhance sterilization efficiency. In indoor spaces with a ceiling height of 2.5 to 4.0 meters, a general guideline is to install one unit for every 50 square meters. *Note* This product directly irradiates UV-C into the air, and to use it safely, adequate light distribution planning and installation considerations are necessary. Therefore, installation is generally carried out by Signify-certified installation partners. Our company is a Signify-certified installation partner and primary distributor, so please feel free to contact us. *PHILIPS is a global lighting brand developed, manufactured, and sold by Signify.*

  • Special lighting
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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that allows you to connect three HAT boards to a Raspberry Pi. You can attach a Raspberry Pi 3 or Raspberry Pi ZERO (WH) to the lower left part of the board, and other HAT boards can be attached elsewhere. There are free through-holes in the lower right part of the board, allowing you to solder and use it like a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C for external connections are provided (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted in the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias is also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports fine pattern formation and high-density wiring compatible with small-diameter vias *For more details, please refer to the PDF document or feel free to contact us.

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Printed Circuit Board "Fluororesin Substrate"

Printed Circuit Board "Fluororesin Substrate"

High-density wiring compatible with thin plates, fine pattern formation, and small-diameter vias is also possible!

"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. [Features] ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the back side with built-in copper coins! It is possible to reduce heat generation across the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. [Features] - Efficiently dissipates heat to the backside by incorporating copper coins - Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Thick copper substrate"

High thermal conductivity substrate "Thick copper substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance high current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We provide substrates that enhance high current capacity and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards ・Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards ・Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high heat dissipation substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Product Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Back Drill Substrate"

High-speed signal, high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It enables the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Enables the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and other factors. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, and other factors *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of supporting high-frequency characteristics according to usage applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■General FR-4 material ■PPE material ■LCP material ■Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder falling from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder from falling off the edges caused by friction with guide rails during substrate transport. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of resin such as sealing resin after component mounting and flux during mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole section using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the spaces between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. [Applications] ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Functional step board

Functional step board

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Functional Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate. This allows us to provide copper-thick hybrid circuit boards with continuous wiring. By forming unevenness through step formation in part of the circuit, we can enable height adjustment of mounted components and impart functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a substrate thickness of 0.04t, while still being rigid. This is suitable for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used only for several bends or during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between other substrates, all suitable for multiple bends. Please feel free to contact us when you need assistance. 【Specifications (Partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

"5% weight reduction temperature is 534℃!" This is an adhesive-free stainless steel/polyimide substrate suitable for high-temperature planar heating heater applications.

Kawamura Industries provides stainless steel/polyimide materials by leveraging the know-how of polyimide coating technology developed over many years on stainless steel foil. **Features of Kawamura Industries' 'SUS/Polyimide Material'** - Excellent heat resistance due to being adhesive-free → 5% weight loss temperature (534°C) - High adhesion strength achieved through unique polyimide technology → Stainless steel/polyimide adhesion strength (2.4 kN/m) - Wide range of thickness options → Stainless steel thickness (15, 18, 20, 30, 50 μm) → Polyimide thickness (selectable between 5-25 μm) *For examples of properties, please refer to the PDF document or feel free to contact us.*

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