Using thick copper foil of 105μm or more! We provide substrates that enhance high current and heat dissipation.
We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We provide substrates that enhance high current capacity and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards ・Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards ・Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.
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![High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"](https://image.www.ipros.com/public/catalog/image/01/d07/317138/IPROS2918469235876260107.jpeg?w=120&h=170)
Company information
Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.