This is a substrate with resin embedded in the through holes and pads placed on top of it.
This is a circuit board designed to secure mounting space for components by embedding resin into through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Secures space for component mounting ○ A substrate that embeds resin in through-holes and provides pads on top ○ Increasing demand due to the narrowing pitch of components such as BGA and CSP ○ Embeds resin and metal paste through vacuum printing ○ Successfully developed various substrates based on past experience and achievements ● For more details, please contact us or refer to the catalog.
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Company information
In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to produce a wide variety of circuit boards in a short time frame through in-house integrated production, thereby meeting these demands. "Better products, faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.
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