Prevent the flow of resin such as sealing resin after component mounting and flux during mounting!
The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole section using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.
![[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!](https://image.www.ipros.com/public/product/image/0dc/2001462290/IPROS13367773706785736448.jpg?w=280&h=280)
