Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
61～75 item / All 380 items
We will propose a polishing machine tailored to your needs!
This is an introduction to the flat grinding system mirror polishing machine from Nappu Industrial Co., Ltd. It provides high-precision mirror polishing for stainless steel, aluminum, glass, and plastic.
![[Contracted Services] Reverse Engineering Plus Case Studies](https://image.www.ipros.com/public/product/image/db6/2000485579/IPROS75961800570631170613.jpeg?w=280&h=280)
We provide the value of "Plus"! We have various achievements, including automatic navigation systems and wireless chargers.
Our contracted service "Reverse Engineering Plus" offers additional value beyond standard disassembly and analysis, including clarification of operating principles, function estimation/principle analysis, and evaluations. For example, in our platform redesign (design contracting), we leverage the diverse technical expertise cultivated by WTI to provide proposals. We have various case studies available. Please feel free to consult with us. 【Providing the value of "Plus"】 ■ Clarification of operating principles ■ Function estimation/principle analysis ■ Evaluation (environment setup/automation) ■ Suggestions for improvements ■ Actual design contracting (modifications/new designs) *For more details, please refer to the PDF materials or feel free to contact us.
![[Data] Shirutoku Report No. 4 #Interface Circuit](https://image.www.ipros.com/public/product/image/35b/2000678175/IPROS97857531509888044634.jpeg?w=280&h=280)
Promote development design! Custom measurement and interface circuits.
★★Shirutoku Report: Useful Information You Can Benefit From★★ This report introduces the use of "interface circuits" that make measurement convenient, which is being developed by the Custom Technology Division. Our company occasionally prepares highly versatile "interface circuits" as originals, and this time we are featuring one of those examples. Proposing solutions to our customers' challenges is a hallmark of our services. If you are interested, we look forward to hearing from you. 【Contents (Excerpt)】 ■ Providing services centered around custom measurement ■ What is an interface circuit? ■ Image of the configuration of an interface circuit (analog isolation circuit board) ■ Production board for the interface circuit (analog isolation circuit board) *For more details, please refer to the PDF document or feel free to contact us.
![[Data] Shirutoku Report No. 18 # Substrate Structure and Package](https://image.www.ipros.com/public/product/image/8bd/2000686744/IPROS58686476474672545015.jpeg?w=280&h=280)
A suitable structural examination is necessary due to the mounted components and wiring density! An explanation of the structure of the substrate.
★★Shirutoku Report: Useful Information You Should Know★★ This report introduces the "Structure of Circuit Boards." It includes topics such as "Classification by Board Structure," "Conductor Materials and Solder Resist," and "The Importance of Initial Considerations in Board Structure." Our company is also capable of supporting circuit board design from initial considerations, including board structure. Please feel free to reach out if you need assistance. 【Contents】 ■ Classification by Board Structure ■ Conductor Materials and Solder Resist ■ The Importance of Initial Considerations in Board Structure ■ About Flexible Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*
![[Data] Shirutoku Report No. 23 #BGA Circuit Board Design](https://image.www.ipros.com/public/product/image/792/2000688120/IPROS73084885984246546542.jpeg?w=280&h=280)
Particularly frequent requests! Circuit board design for small, high-density implementations used in IoT devices and wearable devices!
★★Shirutoku Report: Useful Information You Should Know★★ In WTI's circuit board design, we handle various types of board designs, including large-scale circuit boards, multilayer wiring boards, high-density mounting boards, and flexible printed circuits (FPC). One of the most requested designs is for small, high-density mounting boards used in IoT devices and wearable devices. To reduce the size of products and lower board costs, it is common to adopt BGA packages for microcontrollers and FPGAs. This report discusses 'BGA Board Design.' We encourage you to read it. [Contents] ■ About BGA Board Design *For more details, please refer to the PDF document or feel free to contact us.*
We will create original circuit boards in various shapes according to your wishes.
The basics are domestically produced. They are assembled in domestic factories where heat management during soldering and electrostatic measures are well managed. Since they are assembled in domestic factories, you can be assured. Aging will be done before shipment. However, we will take great care with inspections, packaging, and transportation that involve the risk of human contact.
Cost reduction and weight reduction with a vacuum chuck made of honeycomb panels!
Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous materials and processed products, allowing for cost reduction through lightweight design. It can be manufactured in custom sizes ranging from a minimum of approximately 100mm square to a maximum of about 2000mm x 4000mm. Additionally, it is possible to set multiple suction areas on a single suction panel. We can accommodate everything from custom orders starting from one piece to mass production, so please feel free to contact us. For requests for quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of the case studies from the "Download" section.
![Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm]](https://image.www.ipros.com/public/product/image/597/2000114113/IPROS7865307634577457303.jpg?w=280&h=280)
If it's a honeycomb panel, we can produce custom vacuum chucks at low prices and with short delivery times, starting from just one piece!
Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous and cast products, allowing for cost reduction through lightweight materials. It can process suction holes with a diameter of 30μm, minimizing deformation of the workpiece. Dimensions can be customized freely within 2000mm x 4000mm, and it is also possible to set multiple suction areas on a single vacuum chuck. We can accommodate everything from custom orders for single items to mass production, so please feel free to contact us. For quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of case studies from the "Download" section.
There are many examples of hardware, software, and testing and evaluation!
Our company provides services ranging from embedded board design/development, such as microcontrollers, to firmware, application software development, testing, evaluation, and supply of contracted developed products. In addition to our development achievements in the construction management system "Concrete Filling Watcher," we have also been responsible for the operation panel, motor control board, and firmware design of the "Automatic Pet Feeder." Please feel free to contact us if you have any requests. 【Development Project Examples】 ■ Concrete Filling Watcher (Design and Manufacturing) ■ Automatic Pet Feeder (Board Design and Firmware Design) ■ Supplement Automatic Dispenser (Board Design and Firmware Design) ■ Momentary Disconnection Testing Machine for HDD/SSD Testers (Board Design, Firmware Design, FPGA Design, Structural Design) *For more details, please refer to the related links or feel free to contact us.
Low-cost large-area flexible printed circuit boards! Lightweight and long, they can also be supplied in roll form.
We are etching laminated materials of aluminum foil and film to form circuits. The thickness of the aluminum foil and the type and thickness of the film can be adjusted according to your requirements.
Using carefully selected high-purity alumina.
Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent characteristics.
MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.
Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. By combining the thin film metallization technology that MARUWA has cultivated over many years with the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. Using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.
Solder with excellent heat resistance for plated electrodes! Achieving high reliability, high density, and multifunctional products for various applications!
We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.
Glazed processed substrate
It is a glazed substrate with excellent surface smoothness and durability, coated with an alkali, lead-free amorphous glass on the surface of an alumina substrate. It is used in thermal print heads and other applications.
Aluminum nitride products developed using ceramic materials technology.
Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.
