Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.
We would like to introduce our "Side Coated Substrate." Powder falling from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder from falling off the edges caused by friction with guide rails during substrate transport. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.