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  6. Ultra-thin rigid substrate

Ultra-thin rigid substrate

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last updated:Jan 07, 2025

三和電子サーキット
三和電子サーキット
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It is possible to manufacture a double-sided board with a substrate thickness of 0.04t while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a substrate thickness of 0.04t, while still being rigid. This is suitable for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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極薄リジッド基板.PNG

Ultra-thin rigid substrate

極薄リジッド基板.PNG
極薄リジッド基板.PNG
  • Related Link - https://se-circuit.co.jp/

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Substrate Variations <Functional Step Substrate - Ultra-Thin Rigid Substrate>

Substrate Variations <Functional Step Substrate - Ultra-Thin Rigid Substrate>

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Substrate Variations <Flexible Substrates・Thin Plate Bending Substrates>

Substrate Variations <Flexible Substrates・Thin Plate Bending Substrates>

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三和電子サーキット

三和電子サーキット

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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.

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