Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance as an alternative plating process.
For printed circuit boards. An alternative plating process with excellent corrosion resistance using electroless Ni-P/replaceable Au plating.
The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd coating between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.
- Company:三協 本社工場
- Price:Other