【MiniLab】 Evaporation/Sputtering Dual Chamber System

Two thin film experimental devices are connected with a load lock mechanism. Different deposition devices (sputtering - evaporation, etc.) are seamlessly connected via the load lock. Thanks to Moorfield's unique load lock system, connections to the process chamber on the left, right, and rear are also possible (see photo below).
1. MiniLab-E080A (Evaporation Device)
- EB evaporation: 7cc crucible x 6
- Resistance heating evaporation x 2
- Organic evaporation limit x 2
2. MiniLab-S060A (Sputtering Device)
- Φ2" Magnetron cathode x 4 for simultaneous sputtering
- Compatible with both DC and RF power supplies
3. Load Lock Chamber
- Plasma etching stage
In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique "soft etching" technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of sensitive materials like Teflon. (*This can also be installed in the main chamber stage.)


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Due to its modular design, it is possible to assemble a dedicated machine tailored to your desired film type and process. A flexible, compact experimental device that can accommodate various applications.