テルモセラ・ジャパン Company Profile

High-efficiency magnetron sputtering cathode compatible with RF, DC, and pulse DC, capable of depositing metals and insulators without impurities. It also excels in maintenance. 【Features】 - Compatible with high vacuum - Sizes: Φ2inch, Φ3inch, Φ4inch - Adopts a clamp ring type, no bonding required - Excellent maintenance, allowing for easy target replacement - Abundant options such as shutters, chimney ports, gas injection, high-strength magnets for magnetic materials, etc. - Compatible with various flange sizes 【Main Specifications】 - Compatible with RF, DC, and pulse DC - Target thickness: 1/16" to 1/4" - N-type coaxial connector - Water-cooled: 4ℓ/min, 0.35Mpa Φ6mm tube connection - Case material: SUS304 - Target clamp material: Al or SUS304 - Bellows (*Flexi-head type) material: SUS316 - Insulation material: PEEK/PTFE - Seal material: Viton - High-strength magnet pack: NiFe

Compact, space-saving, and energy-efficient! High-performance ultra-high-temperature experimental furnace for R&D. A small-scale experimental furnace capable of heating small samples up to 2900°C for R&D purposes. It can be used for various sintering experiments, including ultra-high-temperature heating experiments and new material development in the laboratory. ◆ Main Features ◆ - Space-saving - Includes rotary pump and compressor - Interlock: water cut-off alarm, overheating, gas pressure drop ◆ Basic Specifications ◆ - Power supply specifications: AC200V 75A NFB 50/60HZ (C-500) - Max 2900°C (carbon furnace), 2400°C (metal furnace) - Programmable temperature controller, C thermocouple ◆ Options ◆ - Recorder - Turbo molecular pump - Crucible ◆ Main Applications ◆ - New material development - Fuel cells - Others

The MiniLab thin film experimental device allows for the construction of a compact, semi-customized system that eliminates waste by incorporating the optimal components and control modules according to the required film formation methods and materials from a wide range of options. By equipping a modular control unit with a Plug&Play feel, the application range expands, enabling various thin film process experiments. 【MiniLab Thin Film Experimental Device Configuration Modules】 ◎ Manufacturing Range Resistance heating deposition (TE), organic deposition (LTE), electron beam deposition (EB), sputtering (SP), CVD, dry etching 【Small Footprint & Space-Saving】 - Single rack type (026): 590(W) x 590(D) mm - Dual rack type (060): 1200(W) x 590(D) mm - Triple rack type (125): 1770(W) x 755(D) mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation that does not require advanced skills, with maximum consideration for safety. All operations except for internal component adjustments and material exchanges in the chamber are performed via the PC/HMI screen.