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  6. PyroMini Small High-Performance Infrared Temperature Sensor

PyroMini Small High-Performance Infrared Temperature Sensor

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[PyroMini] Compact High-Performance Infrared Temperature Sensor

last updated:Oct 12, 2024

テルモセラ・ジャパン
テルモセラ・ジャパン
  • Official site

Easy setup with a high-performance touch panel converter, data logging, and data storage on a microSD card. PM2.2 measurements can also be taken on glossy metal surfaces.

**Overview** With a highly visible high-brightness touch panel display, parameters such as temperature range, emissivity, and sampling rate can be intuitively operated and set. Long-term data storage and management are possible with a microSD card. (*There is also an option for a converter without a display.) The compact sensor head measures φ18mm x 45mm, allowing for temperature measurements in tight spaces. It employs sensors and cables with excellent noise resistance, making it suitable for integration into moving devices such as robotic arms. The PM2.2 model uses a short wavelength of 2.2um, capable of measuring high temperatures (Max 2000℃) and glossy metallic surfaces. **Features** ◎ Wide range: -20 to 1000℃ (PM), 100 to 2000℃ (PM2.2) ◎ Excellent basic performance: Accuracy ±1%, Repeatability ±0.5%, 240msec fast response ◎ Measurement wavelength range: 8 to 14μm (PM), 2.0 to 2.2μm (PM2.2) ◎ Compact Φ18mm x 45mm

    Facility Management System
PM_iPROS_550.jpg

PyroMini Small High-Performance Infrared Temperature Sensor

PM_iPROS_550.jpg
PM_iPROS_550.jpg
  • Related Link - https://www.thermocera.com/products/irtemperature/…

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basic information

【Other Specifications】 ◉ PM Model Viewing Angles: ・PM-21: 2:1 ・PM-151: 15:1 ・PM-201: 20:1 ・PM-301: 30:1 ・PM-CF: φ5mm@100mm ・PM2.2-151: 15:1 ・PM2.2-251: 25:1 ・PM2.2-751: 75:1 ・PM2.2-CF: φ7.5mm@500mm ◉ Temperature Range: ・PM Model: -20℃ to 1000℃ ・PM2.2 Model: 100 to 2000℃ ◉ Measurement Wavelength Range: ・PM: 8-14um ・PM2.2: 2.0 to 2.2um ◉ Emissivity: ・PM: 0.2 to 1.0 ・PM2.2: 0.1 to 1.0 ◉ Power Supply: 24VDC ◉ Sensor Dimensions: Φ18mm (diameter) x 45mm (length) 【Options】 ◉ Body Mounting Bracket (fixed type, angle type) ◉ Water Cooling Jacket ◉ Air Purge Jacket ◉ Dual Laser Aiming Device

Price range

P2

Delivery Time

P4

Applications/Examples of results

Various industrial machinery and factory equipment (food, construction, paper, printing, rubber, tire, power equipment)

Detailed information

  • PM_iPROS_550.jpg

    PyroMini small high-performance infrared temperature sensor Converter with high-functionality and high-brightness touch panel screen Data storage with microSD card

  • FBS_iPROS_550.jpg

    FBS_Fixed Bracket Fixed Bracket for PyroMini USB

  • ABL_iPROS_550px.jpg

    ABS Angle Adjustment Fixed Bracket for securing PyroMini USB main unit

  • AP_iPROS_550px.jpg

    APS Air Purge Kit Air Purge Jacket for PyroMini USB 1/8 BSP(P) Fitting = G1/8 (1/8 inch parallel male thread) 0.5 to 1.5 L/min

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Thin Film Experimental Device - "PRODUCTS GUIDE 2022"

★★Thermosera Japan_Thin Film Experiment Equipment_"PRODUCTS GUIDE 2022"★★

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Introducing various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments. We present a range of thin film experimental devices and components for the research and development field. 【nano Benchtop Series】 Desktop type, high performance! The nano Benchtop series thin film experimental devices Compact size housing high-functionality and high-spec thin film equipment. 【MiniLab Flexible Thin Film Experimental Device】 A "flexible experimental device" that combines various device configurations and necessary components according to specified requirements. ● Featured Devices - nanoPVD-S10A desktop magnetron sputtering device - nanoPVD-T15A desktop organic film and metal film deposition device - nanoCVD graphene synthesis device - ANNEAL desktop wafer annealing device - MiniLab series flexible thin film experimental device - MiniLab-GB glove box type thin film experimental device - Other components

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MiniLab-026

★☆★☆ MiniLab Series Flexible Thin Film Experimental Device ★☆★☆

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The MiniLab thin film experimental device allows for the construction of a compact, semi-customized system that eliminates waste by incorporating the optimal components and control modules according to the required film formation methods and materials from a wide range of options. By equipping a modular control unit with a Plug&Play feel, the application range expands, enabling various thin film process experiments. 【MiniLab Thin Film Experimental Device Configuration Modules】 ◎ Manufacturing Range Resistance heating deposition (TE), organic deposition (LTE), electron beam deposition (EB), sputtering (SP), CVD, dry etching 【Small Footprint & Space-Saving】 - Single rack type (026): 590(W) x 590(D) mm - Dual rack type (060): 1200(W) x 590(D) mm - Triple rack type (125): 1770(W) x 755(D) mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation that does not require advanced skills, with maximum consideration for safety. All operations except for internal component adjustments and material exchanges in the chamber are performed via the PC/HMI screen.

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Product image of ANNEAL wafer annealing equipment.

Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates

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Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10^-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ through a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety with interlocks. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations at precisely adjusted process gas pressures (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (only in vacuum or inert gas) - SiC coating heater: Max 1000℃ (in vacuum, inert gas, O2)

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TCF-C500 Ultra High Temperature Small Experimental Furnace Image

☆★☆ [TCF-C500 Ultra High Temperature Small Experimental Furnace] Max 2900℃ ☆★☆

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Compact, space-saving, and energy-efficient! High-performance ultra-high-temperature experimental furnace for R&D. A small-scale experimental furnace capable of heating small samples up to 2900°C for R&D purposes. It can be used for various sintering experiments, including ultra-high-temperature heating experiments and new material development in the laboratory. ◆ Main Features ◆ - Space-saving - Includes rotary pump and compressor - Interlock: water cut-off alarm, overheating, gas pressure drop ◆ Basic Specifications ◆ - Power supply specifications: AC200V 75A NFB 50/60HZ (C-500) - Max 2900°C (carbon furnace), 2400°C (metal furnace) - Programmable temperature controller, C thermocouple ◆ Options ◆ - Recorder - Turbo molecular pump - Crucible ◆ Main Applications ◆ - New material development - Fuel cells - Others

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テルモセラ・ジャパン

テルモセラ・ジャパン

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【Endless possibility_thermal engineering...】 Our company sells vacuum thin film equipment for semiconductor and electronic device fundamental research, ultra-high temperature heaters for CVD substrate heating, experimental furnaces, temperature measurement equipment, and more. To meet the endless demand for "heat," which is indispensable in any era, and to respond to various requests in the field of fundamental technology development, we aim to introduce the latest equipment and contribute to research and development in Japan.

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