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  6. PyroMini USB - USB-connected compact infrared temperature sensor

PyroMini USB - USB-connected compact infrared temperature sensor

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PyroMini USB - USB-connected small infrared temperature sensor

last updated:Oct 12, 2024

テルモセラ・ジャパン
テルモセラ・ジャパン
  • Official site

USB-connected compact infrared temperature sensor, no power supply needed, powered by USB bus power from a PC, parameter settings and data management with the included dedicated software.

【Overview】 Install the standard accessory "Calexsoft," and then simply connect it to a Windows PC via a USB cable. You can easily set measurement parameters, conduct measurements, and analyze/export results in CSV format on your PC with a plug-and-play feel. USB output operates solely on USB bus power when connected to a PC, requiring no additional power supply. This expands its application range in various industrial fields and research laboratory experiments. 【Features】 ◎ USB data logging ◎ Wide range: -20°C to +1000°C ◎ Excellent basic performance: accuracy ±1%, reproducibility ±0.5%, 125 msec fast response ◎ Emissivity adjustment range: 0.2 to 1.0 ◎ Measurement wavelength range: 8 to 14 μm ◎ Compact size Φ18mm x 45mm

    Facility Management System
PMU_iPROS_550.jpg

PyroMini USB - USB-connected compact infrared temperature sensor

PMU_iPROS_550.jpg
PMU_iPROS_550.jpg
  • Related Link - https://www.thermocera.com/products/irtemperature/…

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basic information

【Other Specifications】 ◉ Viewing Angle: ・PMU21: 2:1 ・PMU201: 20:1 ◉ Measurement Wavelength Range: 8-14um ◉ Emissivity Adjustment Range: 0.2 to 1.0 ◉ Power Supply: Not required (bus-powered via USB from PC) ◉ Main Unit Dimensions: Φ18mm (diameter) x 45mm (length) ◉ Weight: Approximately 85g ◉ USB Cable 1.5m (*not extendable) 【Options】 ◉ Main Unit Mounting Bracket (fixed type, angle type) ◉ Water Cooling Jacket ◉ Air Purge Jacket

Price range

P2

Delivery Time

P4

Applications/Examples of results

Various industrial machinery and factory equipment (food, construction, paper, printing, rubber, tire, power equipment)

Detailed information

  • PMU_iPROS_550.jpg

    PyroMini USB (USB connection type) USB-connected small infrared temperature sensor USB-connected small infrared temperature sensor Data logging on PC and data management with dedicated software is possible No power supply needed; operates on USB bus power connected to Windows PC

  • FBS_iPROS_550.jpg

    FBS_Fixed Bracket Fixed Bracket for PyroMini USB

  • ABL_iPROS_550px.jpg

    ABS Angle Adjustment Fixed Bracket for securing PyroMini USB main unit

  • AP_iPROS_550px.jpg

    APS Air Purge Kit Air Purge Jacket for PyroMini USB 1/8 BSP(P) Fitting = G1/8 (1/8 inch parallel male thread) 0.5 to 1.5 L/min

  • 温度グラフ表示画面.jpg

    Calexconfig Dedicated Software Temperature Graph Display Screen

  • 放射率設定画面.jpg

    Calexconfig Dedicated Software Emissivity Setting Screen

  • 温度表示画面.jpg

    Calexconfig Dedicated Software Temperature Display Screen

  • 設定メインメニュー.jpg

    Calexconfig Dedicated Software Settings Main Menu Screen

Line up(2)

Model number overview
PMU21 (Viewing Angle 2:1) -20℃ to 1000℃ Emissivity 0.2 to 1.0 variable
PMU201 (Viewing Angle 20:1) -20℃ to 1000℃ Emissivity 0.2 to 1.0 variable

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PyroMini USB - USB-connected small infrared temperature sensor

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Thin Film Experimental Device - "PRODUCTS GUIDE 2022"

★★Thermosera Japan_Thin Film Experiment Equipment_"PRODUCTS GUIDE 2022"★★

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Introducing various experimental devices for research and development in semiconductors, electronic devices, fuel cells, displays, and thin film experiments. We present a range of thin film experimental devices and components for the research and development field. 【nano Benchtop Series】 Desktop type, high performance! The nano Benchtop series thin film experimental devices Compact size housing high-functionality and high-spec thin film equipment. 【MiniLab Flexible Thin Film Experimental Device】 A "flexible experimental device" that combines various device configurations and necessary components according to specified requirements. ● Featured Devices - nanoPVD-S10A desktop magnetron sputtering device - nanoPVD-T15A desktop organic film and metal film deposition device - nanoCVD graphene synthesis device - ANNEAL desktop wafer annealing device - MiniLab series flexible thin film experimental device - MiniLab-GB glove box type thin film experimental device - Other components

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MiniLab-026

★☆★☆ MiniLab Series Flexible Thin Film Experimental Device ★☆★☆

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The MiniLab thin film experimental device allows for the construction of a compact, semi-customized system that eliminates waste by incorporating the optimal components and control modules according to the required film formation methods and materials from a wide range of options. By equipping a modular control unit with a Plug&Play feel, the application range expands, enabling various thin film process experiments. 【MiniLab Thin Film Experimental Device Configuration Modules】 ◎ Manufacturing Range Resistance heating deposition (TE), organic deposition (LTE), electron beam deposition (EB), sputtering (SP), CVD, dry etching 【Small Footprint & Space-Saving】 - Single rack type (026): 590(W) x 590(D) mm - Dual rack type (060): 1200(W) x 590(D) mm - Triple rack type (125): 1770(W) x 755(D) mm 【Excellent Operability & Intuitive Operation Screen】 Windows PC or 7” touch panel. Easy operation that does not require advanced skills, with maximum consideration for safety. All operations except for internal component adjustments and material exchanges in the chamber are performed via the PC/HMI screen.

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Product image of ANNEAL wafer annealing equipment.

Wafer Annealing Equipment [ANNEAL] Max 1000℃ APC Automatic Pressure Control MFC x3 System Compatible with Φ4 to 6 inch Substrates

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Max 1000℃, MFC up to 3 systems, APC pressure control, compatible with substrates from 4" to a maximum of 6", high vacuum annealing device (<5 × 10^-7 mbar) [ANNEAL] is a research and development annealing device capable of high-temperature heat treatment of substrates such as wafers in a stable process atmosphere. It allows high-temperature processing up to 1000℃ through a heating stage installed in a high vacuum water-cooled SUS chamber. A heat shield is installed inside the chamber to ensure safety with interlocks. The mass flow controller can be expanded to a maximum of 3 systems, enabling firing operations at precisely adjusted process gas pressures (APC automatic process control system option). Additionally, there are many options available, including a front view port, dry scroll pump, special substrate holder, and additional thermocouples. The heating stage inside the chamber has three variations depending on the process gas atmosphere and treatment temperature: - Halogen lamp heater: Max 500℃ - C/C composite heater: Max 1000℃ (only in vacuum or inert gas) - SiC coating heater: Max 1000℃ (in vacuum, inert gas, O2)

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TCF-C500 Ultra High Temperature Small Experimental Furnace Image

☆★☆ [TCF-C500 Ultra High Temperature Small Experimental Furnace] Max 2900℃ ☆★☆

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Compact, space-saving, and energy-efficient! High-performance ultra-high-temperature experimental furnace for R&D. A small-scale experimental furnace capable of heating small samples up to 2900°C for R&D purposes. It can be used for various sintering experiments, including ultra-high-temperature heating experiments and new material development in the laboratory. ◆ Main Features ◆ - Space-saving - Includes rotary pump and compressor - Interlock: water cut-off alarm, overheating, gas pressure drop ◆ Basic Specifications ◆ - Power supply specifications: AC200V 75A NFB 50/60HZ (C-500) - Max 2900°C (carbon furnace), 2400°C (metal furnace) - Programmable temperature controller, C thermocouple ◆ Options ◆ - Recorder - Turbo molecular pump - Crucible ◆ Main Applications ◆ - New material development - Fuel cells - Others

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テルモセラ・ジャパン

テルモセラ・ジャパン

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【Endless possibility_thermal engineering...】 Our company sells vacuum thin film equipment for semiconductor and electronic device fundamental research, ultra-high temperature heaters for CVD substrate heating, experimental furnaces, temperature measurement equipment, and more. To meet the endless demand for "heat," which is indispensable in any era, and to respond to various requests in the field of fundamental technology development, we aim to introduce the latest equipment and contribute to research and development in Japan.

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