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Aites utilizes its 40 years of experience in repairing computer system boards to identify and repair faults in electronic devices that are no longer supported, guaranteed, or maintained by the manufacturer. In cases where "the control computer has failed and urgent recovery is needed," there may be a possibility of extending its life through repairs. Please feel free to contact us if you have any requests. 【We address issues such as the following】 ■ The power does not turn on ■ The OS does not boot ■ Display abnormalities ■ Unusual noises ■ Fails to read floppy disks, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAites utilizes its 40 years of experience in repairing computer system boards to identify and repair faults in electronic devices that are no longer supported, guaranteed, or maintained by the manufacturer. In cases such as "the servo motor is not moving," there is a possibility of extending the lifespan through repairs. Please feel free to contact us if you have any requests. [We address issues such as the following] ■ Power does not turn on ■ Motor control error ■ Stops with "E9" error ■ Motor does not rotate, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAites leverages its 40 years of experience in repairing computer system boards to identify and repair faults in electronic devices that are out of manufacturer support, warranty, or maintenance. In cases where "the panel computer is broken and the production equipment cannot be used," there is a possibility of extending its life through repairs. Please feel free to contact us if you have any requests. 【We address issues such as the following】 ■ Power won't turn on ■ Won't boot up ■ Monitor is too dark to see ■ Touch panel is unresponsive ■ Screen is cracked, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAt AITES, we use environmental testing equipment that complies with standard specifications such as JIS, JEDEC, and MIL to conduct reliability evaluation testing for various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAt AITES, we propose and conduct contract analysis menus suitable for the purpose and sample, including the analysis of organic and inorganic substances, foreign matter, and surface analysis. In this department, we perform component analysis of micro foreign substances using advanced sampling techniques, as well as impurity analysis in samples, conducting both qualitative and quantitative analysis of organic and inorganic components. Additionally, we analyze the surface of samples for contamination and oxidation states. 【Service List】 ■ Component analysis of epoxy resin hardeners using Pyrolysis GC/MS ■ Analysis of micro organic foreign substances using Imaging FT-IR ■ Analysis of micro foreign substances using Micro Raman Spectroscopy ■ Ion Chromatography (IC) analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAt Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe hassle of removing PV cables for inspection of CIS thin-film panels has been eliminated. High-speed checks from the panel surface during power generation significantly improve the efficiency of CIS inspections. By simply replacing the sensor unit of the Solamente-iS SI-200, the Solamente CiS Adapter (optional) SC-200 can be attached to the widely used Solamente-iS (SI-200) at solar panel inspection sites, enabling high-speed inspections of CIS thin-film panels. By utilizing the iS panel checker function, which detects power generation current from the panel surface, for CIS panels, economical inspections of CIS panels have become possible. Without removing the PV cables, it is now easy to efficiently identify failures in CIS thin-film panels (such as bypass diode short circuits) in a short amount of time.
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Free membership registrationA new feature of Solamente that detects faulty panels during pre-power transmission inspections and power outage inspections. A new inspection method that links SZ-200 and SI-200. Inspection Method By linking Solamente-Z (SZ-200) and Solamente-iS (SI-200), sensors (SR-200) check the panels along the string circuit. There are faulty panels at the locations where the sensor's response is interrupted.
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Free membership registrationThe Solar Panel Checker Solamente-iS SI-200 is an inspection device that detects cluster failures* by placing a sensor on the surface of panels during power generation. It senses the generated current flowing through the interconnector and displays it in musical notes and LED levels, allowing for instant identification of clusters that are not generating power. (*Cluster failures can occur due to initial defects, aging deterioration, lightning damage, etc.) With just a press of a button, the built-in light sensor automatically adjusts sensitivity. The measurement speed is approximately 5 seconds per panel, making it high-speed. With the super long extension pole (optional), it can reach panels up to 3.6 meters away.
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Free membership registrationThe String Checker Solamente-Z SZ-200 is an inspection device that probes each string P/N terminal of the connection box to detect strings with fault panels. It applies a special detection signal to the string circuit, measures the open circuit voltage and series resistance (impedance), and identifies strings with abnormalities. The SZ-200 achieves fast inspection, is resistant to changes in sunlight, and offers high operability, ensuring reliable results and significantly improving the efficiency of inspection work.
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Free membership registrationAt Aites Co., Ltd., we assist our customers in solving various challenges related to bare wafers and their processing. In response to the increasingly diverse semiconductor needs, we provide expertise and excellent support in the areas of wafer, film deposition processing, and regeneration processing in the front-end field. Additionally, we have started accepting orders for MEMS prototype processing using silicon and fine electroforming. 【Service Contents (Partial)】 ■ Wafer film deposition processing ■ Wafer patterning processing ■ Wafer regeneration processing ■ Sale of bare wafers *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationThe PVX1000+POPLI-μ can perform photoluminescence observation of the fine structure of wafers during the solar cell manufacturing process using a microscope. In the case of PERC, it is possible to evaluate individual Local-BSF based on PL intensity and assess the damage to the passivation layer around the laser contact holes. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the location of defects.
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Free membership registrationThe PVX1000+POPLI-Octa can evaluate wafers during the solar cell manufacturing process using photoluminescence. It is capable of assessing the passivation effects of the PN junction layer after thermal diffusion, the AR layer deposition, surface contamination, as well as the protective effects of the rear insulation layer and the evaluation of Local-BSF. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the locations of defects. By applying reverse bias to the module and observing LEAK points, defects that have caused PID can be easily identified.
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Free membership registration24 million pixel high-definition camera Auto focus Automatic power control Supports bulk measurement of large modules Easy yet high-performance image processing software Achieves a low price of one-third that of conventional models Free sample evaluation demo now available.
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Free membership registrationFree sample evaluation demo now available. POPLI is an advanced PL imaging device that adds a PL imaging unit as an option to the EL image inspection device PVX, achieving clear PL imaging and cost-effectiveness by utilizing the detection capabilities and software of the PVX.
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Free membership registrationWe provide repair and maintenance services for computers used in production equipment, industrial devices, and panel computers (panecons) through our years of experience in computer repair and unique methods. Additionally, we also offer circuit board repair, power supply repair, monitor repair, touch panel repair, and overhauls.
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Free membership registrationUnreliable LCD displays are causing problems in the market. At Aites, we solve our customers' reliability issues by conducting reliability testing design and visual inspections before and after testing, leveraging our extensive experience and state-of-the-art equipment. Furthermore, we provide support from failure mode classification to failure analysis and material analysis.
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Free membership registration■TOF-SIMS Three Analysis Modes - High-resolution mass spectrum - Depth profiling - Surface mapping
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Free membership registration■Special Sampling Techniques for Foreign Substances in Multilayer Films - Foreign substances buried in metal films on substrates Metal film etching ⇒ Transfer to Si wafer ⇒ FT-IR analysis - Foreign substances in multilayer thin films Cutting off the surface layer ⇒ Transfer to Si wafer ⇒ FT-IR analysis Microtome/FIB thinning ⇒ Transfer to Si wafer ⇒ FT-IR analysis
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Free membership registration■Service Overview 1. Micro ATR Method IR data acquisition of foreign substances is possible if they are approximately 5um or larger. 2. Surface Distribution Image Observation of the in-plane distribution of organic substances is possible. 3. Temporal Changes Measurement of the state of organic substances that change on a second-by-second basis is possible.
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Free membership registrationSome overseas manufactured parts and products may initially function without issues, but can cause malfunctions and lead to failures and breakdowns in a short period. Before adopting or using overseas products, please consider AIT's component and product quality evaluation services. ■ Examples of Overseas Component Evaluations - Reliability evaluation during the parts procurement and selection stage - Comparative evaluation between component and product manufacturers - Reliability evaluation when replacing current components with alternative components (cost reduction) ■ Examples of Supported Components - Active components (transistors, diodes, thyristors, etc.) - Passive components (capacitors, resistors, etc.) - LCDs - Circuit boards - Power supplies - Etc.
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Free membership registration■ We will support each specification waveform for JEDEC, JEITA (EIAJ), and AEC through unit replacement. ■ We support both Direct Charge Method (Direct CDM) and Field Induced Method (Field Induced CDM). ■ The contact state confirmation function of the applied pins ensures reliable application. ■ Destruction judgment support is also possible using diode characteristic judgment methods (consultation required).
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Free membership registration■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as ESDA/JEDEC, JEITA, AEC, and IEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and problem resolution.
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Free membership registration■ We support products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We provide testing that complies with major domestic and international standards such as JEDEC, JEITA, and AEC. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with reliability, we assist with failure analysis and root cause investigation to resolve the problem.
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Free membership registration■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High-Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-Section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation
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Free membership registrationA new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
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Free membership registrationThe joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.
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Free membership registrationTEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.
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Free membership registrationWe perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.
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Free membership registrationAites is a solution-oriented company that sincerely addresses customer challenges in cutting-edge industrial fields. We utilize various owned devices to provide optimal solutions. ■ Product Analysis / Defect Analysis / Failure Analysis Morphological observation, electrical characteristic measurement, defect analysis, failure analysis, sample processing ■ Reliability Evaluation Testing Reliability evaluation testing, ESD/latch-up testing, strength testing, optical characteristics ■ Physical Analysis / Chemical Analysis Physical analysis, surface analysis, chemical analysis
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Free membership registration■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.
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Free membership registration■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors
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Free membership registrationWe provide testing services to evaluate the resistance to ESD damage and latch-up damage, which are important for the reliability of semiconductor devices and electronic components that include them. ■ We accommodate products such as IC modules, electronic components, and subsystems with up to 512 pins. ■ We offer tests in accordance with standards such as JEDEC, EIAJ, and ESDA. ■ We propose and conduct tests tailored to our customers' requests and objectives. ■ In the event of any issues with resistance, we assist with failure analysis and problem resolution.
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Free membership registration【Testing, Evaluation, Analysis】 ●Reliability Testing ■Temperature Cycle Testing ■Thermal Shock Testing ■High-Temperature Storage Testing ■Highly Accelerated Life Testing ■Preconditioning ■Hot Oil Testing ■In-situ Continuous Measurement ■Ion Migration Testing ■Electromigration Testing ■Test Consulting ●Evaluation Testing ■Bond Strength Testing: Pull/Shear Testing ■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength ■ESD/Latch Up/CDM Testing ■Electrical Characteristic Measurement ■Salt Spray Testing ●Analysis ■X-ray Transmission Observation ■Ultrasonic Microscope Observation ■Luminescence Analysis (EMS/IR-OBIRCH) ■Scanning Electron Microscope (SEM) ■Transmission Electron Microscope (TEM) ■Surface Contamination Analysis (TOF-SIMS) ■Foreign Material Analysis (FT-IR)
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Free membership registrationIn-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a readout method where samples are taken out from a stress environment at fixed times, failure can only be understood at the timing of the readout, making it impossible to know the exact time of failure occurrence. In-situ measurement allows for accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, these recoverable failures cannot be detected using the readout method, but in-situ measurement allows for the detection of recoverable failures, enabling accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application conditions and measurement data can be confirmed in real-time.
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Free membership registration● Comprehensive technical services covering the entire product life cycle We provide support throughout the entire product life cycle, including raw material evaluation during development necessary for improving the quality of electronic components, reliability testing and result analysis, timely feedback on failure analysis and results to the development and manufacturing sites after shipment, and consulting for quality problem resolution. ● Prompt analysis and reporting of reliability test results For defects in reliability testing, we support accurate and timely identification and analysis of causes through a rich and efficient analysis menu. ● Use only the services you need as much as you need You can freely choose from a range of services, including conducting tests and inspections based on a predetermined evaluation plan, developing evaluation and analysis plans for problem resolution, result analysis, cause investigation, and consultation, according to your needs.
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