Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.
【Testing, Evaluation, Analysis】 ●Reliability Testing ■Temperature Cycle Testing ■Thermal Shock Testing ■High-Temperature Storage Testing ■Highly Accelerated Life Testing ■Preconditioning ■Hot Oil Testing ■In-situ Continuous Measurement ■Ion Migration Testing ■Electromigration Testing ■Test Consulting ●Evaluation Testing ■Bond Strength Testing: Pull/Shear Testing ■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength ■ESD/Latch Up/CDM Testing ■Electrical Characteristic Measurement ■Salt Spray Testing ●Analysis ■X-ray Transmission Observation ■Ultrasonic Microscope Observation ■Luminescence Analysis (EMS/IR-OBIRCH) ■Scanning Electron Microscope (SEM) ■Transmission Electron Microscope (TEM) ■Surface Contamination Analysis (TOF-SIMS) ■Foreign Material Analysis (FT-IR)
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basic information
We provide a total solution from sample preparation of a series of processes for semiconductor products to reliability evaluation testing and failure analysis. You can utilize the necessary services as much as you need. A total solution means we support you from sample preparation to evaluation and analysis, addressing the difficulties in developing and evaluating components, devices, and materials related to semiconductor products (such as when evaluation samples cannot be prepared, evaluation methods are unclear, or there is no prior data). 【Sample Preparation】 ● Wafer Process ■ Arrangement of general-purpose TEG ■ Dicing ■ Chip sorting ■ Visual inspection ■ Packaging (chip trays, embossed taping) ● Packaging Process ■ Die bonding ■ Wire bonding ■ Flip chip mounting ■ Bump bonding ■ Package assembly
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Applications/Examples of results
■ IC chip implementation We will carry out sample production from the wafer process to implementation. ■ Reliability evaluation testing Example of In-Situ continuous monitoring... We conduct analysis and failure analysis from various reliability tests.
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Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.