In-Situ Continuous Measurement Reliability Evaluation Testing Service

Our company conducts environmental testing using a constant temperature and humidity chamber with a front glass window and a camera, capturing and monitoring the operational status such as screen displays. During environmental testing using equipment like constant temperature and humidity chambers, monitoring the condition of the test subjects using loggers for parameters like voltage, current, resistance, and temperature is widely practiced. However, monitoring the operational status of equipment during testing can be difficult unless the test equipment is equipped with dedicated external outputs. For samples where monitoring with loggers is challenging, we combine a constant temperature and humidity chamber equipped with a front glass window option, a camera, and monitoring software to conduct environmental testing while capturing and monitoring the condition of the test equipment.

We conduct "IOL testing of discrete semiconductors" at our company. Under normal temperature conditions, we repeatedly turn the power ON/OFF, applying stress to the device due to the heat generated by the device itself during power ON. During power OFF (cooling), forced cooling is also performed using a fan. Additionally, before conducting the tests, we use representative samples to make adjustments to reach the test temperature conditions. It is possible to adjust the current/time during heating, as well as the fan capacity/timing during cooling.

We would like to introduce the "strain measurement of thermal shock testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record strain data in real-time during the test. For two types of copper-clad laminates, the strain behavior during thermal shock testing was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.

At Aites Co., Ltd., high-temperature reverse bias testing (HTRB) for evaluating the oxide film and junction of power devices can be applied up to 2000V. By monitoring the leakage current during the test, the degradation status of the device can be understood in real-time. Since the power supply is independent, if one device fails during the test, it does not affect the other devices. Additionally, it is possible to set a defect criterion (current value) and cut off the power supply to the defective device when a defect is determined. 【Specifications and Service Details】 ■ Test Voltage: Up to DC 2000V ■ Applied Current: Up to 14mA ■ Number of Test Devices: Up to 8 (independent power supply) ■ Compatible Modules: TO-247, TO-220, etc. (other packages require consultation regarding connection methods) ■ Measurement Content: Monitoring of leakage current ■ Temperature Range: Up to 200°C (85°C/85% in high temperature and high humidity conditions)