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  6. Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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last updated:Jan 13, 2021

アイテス
アイテス
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We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Total support service for cross-section grinding, processing, observation, and analysis.

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  • Related Link - https://www.ites.co.jp

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catalog(69)

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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[Data] Whisker Analysis using EBSD

[Data] Whisker Analysis using EBSD

OTHER
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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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[Case Study] X-ray Fluoroscopy and CT Examination Equipment

[Case Study] X-ray Fluoroscopy and CT Examination Equipment

TECHNICAL
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[Data] Example of load unloading mode and color filter measurement using an ultra-micro hardness tester.

[Data] Example of load unloading mode and color filter measurement using an ultra-micro hardness tester.

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EPMA analysis

EPMA analysis

TECHNICAL
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Sectioning using a microtome

Sectioning using a microtome

TECHNICAL
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[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope)

[Data] Cross-sectional observation of neodymium magnets using a tabletop SEM (scanning electron microscope)

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[Data] Cross-sectional observation of solar cell modules

[Data] Cross-sectional observation of solar cell modules

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Material evaluation using a ultra-micro hardness tester.

Material evaluation using a ultra-micro hardness tester.

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MLCC crack X-ray observation

MLCC crack X-ray observation

TECHNICAL
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Whisker evaluation

Whisker evaluation

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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

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Cross-section polishing service for implementation parts and electronic components.

Cross-section polishing service for implementation parts and electronic components.

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Cross-section polishing (CP) method for cross-sectional observation service.

Cross-section polishing (CP) method for cross-sectional observation service.

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Crystal analysis by EBSD: Intermetallic compounds in solder joints.

Crystal analysis by EBSD: Intermetallic compounds in solder joints.

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

TECHNICAL
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X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study

X-ray fluoroscopy and CT examination device: BGA solder crack analysis case study

TECHNICAL
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X-ray fluoroscopy and CT scanner 'Cheetah EVO'

X-ray fluoroscopy and CT scanner 'Cheetah EVO'

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Cross-beam FIB cross-sectional observation

Cross-beam FIB cross-sectional observation

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[Data] On the bonding interface of Cu wire bonding

[Data] On the bonding interface of Cu wire bonding

TECHNICAL
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Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

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Observation of aluminum welding joints

Observation of aluminum welding joints

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Cross-sectional observation of large samples (expansion valve)

Cross-sectional observation of large samples (expansion valve)

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Differences in appearance due to SEM observation conditions.

Differences in appearance due to SEM observation conditions.

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Seven spectral crystals in EPMA analysis

Seven spectral crystals in EPMA analysis

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Changes due to differences in acceleration voltage during EDX analysis.

Changes due to differences in acceleration voltage during EDX analysis.

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Basic Analytical Methods for Similar but Different Objects

Basic Analytical Methods for Similar but Different Objects

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[Data] Example of EPMA Analysis

[Data] Example of EPMA Analysis

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[Information] Whisker Observation - Tips for Observing Flat Whiskers

[Information] Whisker Observation - Tips for Observing Flat Whiskers

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Cross-sectional observation by SEM: Connector plating

Cross-sectional observation by SEM: Connector plating

TECHNICAL
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Regarding the curing temperature of epoxy resin during sample encapsulation.

Regarding the curing temperature of epoxy resin during sample encapsulation.

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Analysis of the assembly joint of the implementation components

Analysis of the assembly joint of the implementation components

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Evaluation of BGA and CSP solder.

Evaluation of BGA and CSP solder.

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FE-SEM observation (Crystal grain observation of Al wire bonding section)

FE-SEM observation (Crystal grain observation of Al wire bonding section)

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[Data] EPMA Analysis Example 2

[Data] EPMA Analysis Example 2

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[Data] Structural Analysis of MEMS Components

[Data] Structural Analysis of MEMS Components

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Authenticity investigation (comparative observation)

Authenticity investigation (comparative observation)

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X-ray observation of electrolytic capacitors

X-ray observation of electrolytic capacitors

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Observation of diamond clarity

Observation of diamond clarity

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Oblique CT observation of the laminated substrate.

Oblique CT observation of the laminated substrate.

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Measurement of solder crack rate by cross-sectional observation.

Measurement of solder crack rate by cross-sectional observation.

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Observation of the coating film

Observation of the coating film

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LCD Panel Analysis Data Collection

LCD Panel Analysis Data Collection

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Example of EPMA analysis using the guide net map method.

Example of EPMA analysis using the guide net map method.

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The microtome's blade (knife) is its lifeblood.

The microtome's blade (knife) is its lifeblood.

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Ultrasonic Microscope 'SAM'

Ultrasonic Microscope 'SAM'

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[Information] Differentiating Between Optical Microscopes and SEM

[Information] Differentiating Between Optical Microscopes and SEM

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Energy Dispersive X-ray Spectroscopy (EDS)

Energy Dispersive X-ray Spectroscopy (EDS)

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[Analysis Example by EDS] Bonding Interface of Cu Pads

[Analysis Example by EDS] Bonding Interface of Cu Pads

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3D construction by mechanical grinding

3D construction by mechanical grinding

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Introduction to Cross-Section Processing and Observation Methods

Introduction to Cross-Section Processing and Observation Methods

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Surface observation of IC chips implemented on LCD panels.

Surface observation of IC chips implemented on LCD panels.

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Analysis case of switch contact failure

Analysis case of switch contact failure

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Cross-sectional observation of substrate-mounted components.

Cross-sectional observation of substrate-mounted components.

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

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Examples of semiconductor observation by mechanical polishing

Examples of semiconductor observation by mechanical polishing

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Observation of metallic tissue through chemical treatment.

Observation of metallic tissue through chemical treatment.

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CP processing device Arblade5000_ wide area cross-section milling

CP processing device Arblade5000_ wide area cross-section milling

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Example of analysis of compounds at the SAC solder and Ni pad interface.

Example of analysis of compounds at the SAC solder and Ni pad interface.

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Optical film light transmission characteristics

Optical film light transmission characteristics

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Observation of CMOS image sensor cross-section by mechanical polishing.

Observation of CMOS image sensor cross-section by mechanical polishing.

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Appearance observation and measurement services

Appearance observation and measurement services

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Observation of tracking camera cross-section by mechanical polishing.

Observation of tracking camera cross-section by mechanical polishing.

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About the curing temperature of epoxy resin free from hazardous substances.

About the curing temperature of epoxy resin free from hazardous substances.

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Cryogenic ion milling cross-section processing example (rubber products)

Cryogenic ion milling cross-section processing example (rubber products)

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Effects of heat generated during cross-sectional ion milling (CP) processing.

Effects of heat generated during cross-sectional ion milling (CP) processing.

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Example of failure analysis of chip resistors

Example of failure analysis of chip resistors

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News about this product(8)

Optical film light transmission characteristics

  • Other・notification

At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

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Information about the CP processing device Arblade5000_Wide Area Cross-section Milling

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We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the wide processing capability ■ Significantly expands the previously localized observation range ■ Equipped with a cooling temperature adjustment function to control temperature rise due to ion beam irradiation ■ The observable range is approximately 8mm

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Observation of metallic tissue through chemical treatment.

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We will introduce the observation of metal structures through chemical treatment. By performing chemical treatment on metal samples, it is possible to clearly observe the metal structure. Observing the structure can reveal the condition of the sample and the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structure's shape. In our catalog, you can find details on the observation of metal structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests.

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アイテス

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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