Plasma Analysis Software(3d) - List of Manufacturers, Suppliers, Companies and Products

Plasma Analysis Software Product List

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[Example] Particle-PLUS: 3D Counter Target Type Patter

[Example] Particle-PLUS: 3D Counter Target Type Patter

Introduction of Particle-PLUS Analysis Case: "Opposing Target Type Patter (3D Analysis)" Simulation Case

This is an analysis case of a counter-target sputtering method, which is one of the film formation techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, enabling efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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[Example] Particle-PLUS DC Magnetron Sputter 3D

[Example] Particle-PLUS DC Magnetron Sputter 3D

"Particle-PLUS" specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates at high speeds.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of GEC-CCP Device" 3D Simulation Case

This is a 3D analysis case related to CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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[Example] 'Particle-PLUS' Cylindrical Magnetron Device

[Example] 'Particle-PLUS' Cylindrical Magnetron Device

An example of "Particle-PLUS" analysis of magnetron sputtering using a cylindrical target, which is one method for forming a strong film on the inside of a long cylinder.

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
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[Example] Particle-PLUS Opposing Target Sputter

[Example] Particle-PLUS Opposing Target Sputter

Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations of low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] Particle-PLUS 2 Frequency CCP

[Example] Particle-PLUS 2 Frequency CCP

Introduction of analysis examples using "Particle-PLUS" Particle-PLUS also allows for the calculation of overlapping two-frequency CCP.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] "Particle-PLUS" Counter Target Sputtering

[Example] "Particle-PLUS" Counter Target Sputtering

Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Examples: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case Study

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] "Particle-PLUS" RF Magnetron Sputtering

[Example] "Particle-PLUS" RF Magnetron Sputtering

Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Case

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is difficult. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Case Study] Particle-PLUS: RF Magnetron for Dielectric Targets

[Case Study] Particle-PLUS: RF Magnetron for Dielectric Targets

Particle-PLUS Analysis Case Introduction: "RF Magnetron Sputtering Analysis of Dielectric Targets" Simulation Case

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and more at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Case] 'Particle-PLUS' RF Magnetron Sputtering

[Case] 'Particle-PLUS' RF Magnetron Sputtering

An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of film deposition rates at high speed. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] 'Particle-PLUS' DC Magnetron Sputter

[Example] 'Particle-PLUS' DC Magnetron Sputter

A case study of the DC magnetron sputtering method using process plasma, known as 'Particle-PLUS'.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - It excels in plasma analysis within vacuum chambers, enabling high-speed simulations of film deposition rates and more. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
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  • Other analytical equipment

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when multiple electrodes are present or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
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  • Other analytical equipment

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[Example] Cleaning Process by Particle-PLUS: CCP

[Example] Cleaning Process by Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate etching rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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Semiconductor plasma analysis software 'Particle-PLUS'

Semiconductor plasma analysis software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.

"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is challenging. - Calculation functions for inductive heating for ICP simulations. - Advanced physical model analysis such as CCP and external circuit models. - Capable of simultaneously simulating ICP and CCP. - Supports 2D and 3D, efficiently analyzing even complex models. - As a strength of our in-house developed software, customization to fit customer devices is possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at sales@wavefront.co.jp.

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