Particle-PLUS Analysis Case Introduction: "RF Magnetron Sputtering Analysis of Dielectric Targets" Simulation Case
This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and more at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.
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basic information
**Features** - The time scheme uses an implicit method, allowing for stable time evolution to be calculated over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the above plasma module, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in devices such as magnetron sputtering systems, enabling rapid evaluation of flux distribution on opposing substrates. *For other functions and details, please feel free to contact us.*
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P4
Applications/Examples of results
【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to achieve high-density plasma - Damage to the chamber walls - Optimization of power using an external circuit model - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and with relatively realistic voltages - Calculations are relatively stable to avoid applying unreasonable voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Temporal Changes of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of the film and damage to the chamber walls - By changing calculation conditions, optimization of high-density plasma generation at low power is possible
Detailed information
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Introduction to Particle-PLUS Analysis Examples RF Magnetron Sputtering of Dielectric Targets
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◇Model Overview Analysis case of RF magnetron sputtering of dielectric targets in an axisymmetric model.
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Neutral gas pressure and static magnetic field - Ar pressure - Magnetic flux density
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Electric potential and electron number density - Electric potential (periodic average) - Electron number density (periodic average)
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Ion energy - Ar+ ion energy - Ar+ ion incident energy flux
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Sputtering and film formation - Number density (color display) and flow rate (arrow display) - Deposition rate on the substrate surface - Erosion rate on the target surface
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Company information
Our company develops and sells a "Maintenance Management System" for managing and operating various plants, factories, and other facilities and assets. Currently, this system is undergoing significant evolution into a system that incorporates IoT technologies, such as sensor information and input from tablet devices, as well as AI technologies like machine learning, featuring functions for failure prediction and automatic scheduling. Additionally, as part of the recent trend of digital transformation (DX), there is a growing movement to digitize and automate manufacturing processes and research and development sites in factories to improve operational efficiency. In line with this trend, our company provides a solution aimed at enhancing efficiency in research and development environments, which is the Laboratory Information Management System (LIMS). This software includes features such as workflow management, data tracking, data management, data analysis, and integration of electronic lab notebooks.
![[Example] "Particle-PLUS" RF Magnetron Sputtering](https://image.www.ipros.com/public/product/image/47f/2000679579/IPROS73831867780680859745.jpeg?w=280&h=280)
![[Example] Particle-PLUS: 3D Counter Target Type Patter](https://image.www.ipros.com/public/product/image/71e/2000679589/IPROS73845666638055592972.png?w=280&h=280)
