[Example] Particle-PLUS: 3D Counter Target Type Patter

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Particle-PLUS

last updated：Feb 03, 2022

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Introduction of Particle-PLUS Analysis Case: "Opposing Target Type Patter (3D Analysis)" Simulation Case

This is an analysis case of a counter-target sputtering method, which is one of the film formation techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, enabling efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

Related Link - http://www.wavefront.co.jp/CAE/particle-plus/

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basic information

**Features** - The time scheme uses an implicit method, allowing for stable time evolution calculations over a large time step Δt compared to conventional methods. - The collision reaction model between neutral gas and electrons and ions employs the Monte Carlo Scattering method, enabling accurate and rapid calculations of complex reaction processes. - The neutral gas module determines the initial neutral gas distribution used in the plasma module above, allowing for quick evaluation of gas flow using the DSMC method. - The sputtered particle module calculates the behavior of atoms sputtered from the target in plasma and neutral gas environments, such as the flux distribution on opposing substrates, which can be evaluated in a short time. *For other functions and details, please feel free to contact us.*

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Applications/Examples of results

【Dual Frequency Capacitive Coupled Plasma】 - Optimization of voltage and other parameters to achieve high-density plasma - Damage to chamber walls - Optimization of power using external circuit models - It is possible to apply voltages to the electrode plates that align with real devices - The waveform of the applied voltage can be simulated smoothly and with relatively realistic voltages - Calculations are relatively stable to avoid applying excessive voltages 【DC Magnetron Sputtering】 - Uniformity of erosion dependent on magnetic field distribution - Adsorption distribution of sputtered materials on the substrate 【Pulsed Voltage Magnetron Sputtering】 - Optimization of the application time of pulsed voltage to efficiently sputter materials 【Ion Implantation】 - The influence of the substrate on the erosion distribution 【Time Evolution of Applied Voltage on Electrode Plates】 - It is possible to observe physical quantities that are difficult to measure experimentally, such as electron density and ion velocity distribution - By investigating electron density and ion velocity distribution, it is possible to examine the uniformity of films and damage to chamber walls - It is possible to optimize the generation of high-density plasma at low power by changing calculation conditions