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  6. Thin film circuit board thin film metallization

Thin film circuit board thin film metallization

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last updated:Feb 20, 2024

MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター
MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター
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MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. By combining the thin film metallization technology that MARUWA has cultivated over many years with the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. Using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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thin-fnd_01_ja.jpg

Thin film circuit board thin film metallization

thin-fnd_01_ja.jpg
thin-fnd_01_ja.jpg
  • Related Link - https://www.maruwa-g.com/products/ceramic/Metaliza…

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basic information

【Specifications】 ○Material: Alumina 99.5% ○Thickness: 0.1mm to 1.5mm / 4mil to 60mil ○Work size: 50.8mm□ (2inch□), 2inch × 4inch□, 3inch ●For more details, please refer to our website or catalog, or contact us.

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Applications/Examples of results

【Applications】 Circuit boards for optical communication-related applications, circuit boards for high-frequency applications. ● For more details, please refer to the catalog or contact us.

Detailed information

  • thin-fnd_02_ja.gif

    Standard Specifications Item Minimum Dimension A Conductor Dimension 0.01 mm B Pattern Spacing 0.01 mm C Resistor Dimension (Width) 0.05 mm D Resistor Dimension (Length) 0.05 mm E Substrate Width - Pattern Spacing 0.05 mm F Pattern - Hole Spacing 0.1 mm G Through Hole - Pattern Spacing 0.1 mm H Through Hole 1.5t mm (t = Board Thickness) I Through Hole Spacing 0.25 mm

  • thin-metallize_01_ja.gif

    Types of thin film formation

Company information

MARUWA

MARUWA 本社,東京支店,関西支店,東北営業所,北信越営業所,九州北営業所,R&Dセンター

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The name MARUWA embodies the meaning of "everyone working together in harmony." The logo of MARUWA uses blue, which is said to represent hope, and expresses the "harmony, connections, and bonds between people," which is the origin of the company name. Our company values people. We believe that a company can only achieve continuous growth and development by cherishing and utilizing the strengths and individuality of each person. It is unacceptable to suppress or distort these qualities for the sake of the company. We hope that our growth and development will contribute to the happiness of not only our employees but also the local community and many others, and we are committed to our daily business activities with all our efforts. In recent years, the importance of preserving the natural environment on this planet we live in has been emphasized from various perspectives. We feel very fortunate that the opportunities for our ceramic products to be used for environmental conservation are increasing, and the demands and expectations for these products and new innovations are becoming stronger.

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