Mitsubishi Materials Corporation Company Profile

Mitsubishi Materials Corporation has developed one of the world's largest square-shaped silicon substrates, the "Square Silicon Substrate," which achieves high flatness and low surface roughness. Next-generation semiconductor packages utilizing chiplet technology, which has been gaining attention in recent years, are being scaled up to approximately 100mm square. In the manufacturing process of semiconductor packages, using conventional φ300mm silicon wafers as carrier substrates for placing semiconductor chips in Wafer-Level Packages (WLP) presents a challenge, as the small area and circular shape of the wafers make it difficult to efficiently fit packages onto the wafer substrate. To address this challenge, our company has developed a large-area square-shaped "Square Silicon Substrate" by combining the casting technology for large silicon ingots that our group has cultivated over the years with our unique processing technology. The "Square Silicon Substrate" contributes to improving productivity in the semiconductor field by being utilized as a carrier substrate in semiconductor manufacturing processes and as an interposer material for semiconductor packages.

Our company will be exhibiting at the "New Functional Materials Exhibition 2020" held at Tokyo Big Sight (Koto Ward, Tokyo) from January 29 (Wednesday) to January 31 (Friday), 2020. We will showcase our unique high UV transparency black pigment NITRBLACK, as well as silver-coated powder and columnar crystal silicon. If you visit this exhibition, please be sure to stop by our booth. ■ Exhibited Products ・High UV transparency black pigment NITRBLACK UB-1 ・Silver-coated powder ・Columnar crystal silicon

Mitsubishi Materials Corporation will exhibit at the "12th Automotive World - Advanced Automotive Technology Exhibition" held at Tokyo Big Sight from January 15 (Wednesday) to January 17 (Friday), 2020. This exhibition consists of six exhibitions, and our company will participate in the "6th Automotive Parts & Processing EXPO." We will showcase materials for next-generation lithium-ion battery packs using high-performance new materials and technologies, ultra-thin temperature sensors with high thermal response characteristics, and fire-resistant resins and cooling thermal paste that contribute to the safety and lightweight design of next-generation vehicles. If you visit this exhibition, please be sure to stop by our booth.