High-frequency compatible flexible substrate (MPI specifications)

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太洋テクノレックス 本社　和歌山

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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*

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