Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
76～90 item / All 379 items
Silicon nitride products developed using ceramic materials technology.
Silicon nitride products developed using ceramic material technology are used in power semiconductor substrates and other applications due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.
We will strive to meet our customers' needs for high quality and high precision!
Since its establishment, Pascon has been offering various services related to printed circuit boards, focusing on printed circuit board design, procurement of electronic components, assembly, and the production of inspection fixtures. We will continue to strive to meet our customers' needs for high quality and high precision, so we appreciate your continued support. 【Business Activities】 ■ Printed circuit board design using CAD ■ Circuit diagram input using CAD ■ Board manufacturing (single-sided to multi-layer, flexible, etc.) ■ Development and sales of inspection equipment and assembly machines, software development ■ Production of inspection equipment, fixtures, etc. *For more details, please refer to the PDF materials or feel free to contact us.
![[Case Study] Improving the Loss Rate of Expensive Materials](https://image.www.ipros.com/public/product/image/79f/2000722530/IPROS34972412142306715289.png?w=280&h=280)
Further cost cuts for mass production! We will strive to solve problems with a broad perspective!
In the case of fine substrates that are chip-processed into products, even a portion of the outer circumference becoming unusable due to the holder results in loss. For expensive materials like crystal substrates, even a few sheets of loss cannot be overlooked. In response to clients' demands for cost-cutting, it was necessary to review the coating process. Our company has been solving customer challenges through film formation design and the provision of optical components, but for this matter, we advanced the review of the substrate holding method. By improving the deposition axis and creating a method to secure from the top and sides, we made it possible to coat the entire surface of the substrate. As a result, there are no longer any areas without film adhesion, allowing us to turn all materials into products without waste, leading to significant cost reductions. 【Case Overview】 ■ Challenge: Eliminate material loss caused by non-adhesion due to vacuum deposition ■ Solution: Improved production methods to enable coating over the entire substrate ■ Future Outlook: Strive to solve challenges with a broader perspective beyond film formation design *For more details, please refer to the PDF document or feel free to contact us.
We provide a one-stop service for optimal electronic equipment contract manufacturing in collaboration with partner companies with distinctive features.
Our company offers "circuit board design, manufacturing, and assembly services." We accept comprehensive orders from the design of printed circuit boards to board manufacturing and assembly (mounting). By collaborating with specialized companies for board manufacturing and assembly, we can deliver completed products to our customers, thereby achieving a reduction in labor hours and shortening delivery times. 【Features】 ■ Quick delivery ■ Re-manufacturing from raw printed circuit boards ■ High quality for peace of mind *For more details, please refer to the PDF document or feel free to contact us.
High quality, high performance! Delivery of high multilayer printed circuit boards in as little as 2 days.
At Fuji Print Industry Co., Ltd., we have achieved short delivery times for multilayer printed circuit boards. High-difficulty boards that require severe precision and intricacy are our specialty. The technical skills cultivated through cutting-edge board manufacturing are embodied in all of our products. We deliver high-quality, high-performance multilayer printed circuit boards with more than 10 layers in as little as 2 days. 【Product Lineup】 - Single-sided printed circuit boards - Double-sided printed circuit boards - Multilayer printed wiring boards For more details, please contact us or download the catalog.
We provide inspection equipment to maintain high quality! We aim to improve quality and reduce defect rates.
The Toa Electronics Group "Suntech Toyoake Factory" obtained certification for the international standard for quality management systems, ISO 9001, from the certification body "ASR Co., Ltd." on December 19, 2006. We are advancing the automation and in-house production of our manufacturing equipment with the aim of establishing a system that can consistently produce "high-quality" products, regardless of the skills of the operators. To maintain high quality, we inspect printed circuit boards using 2D and 3D automatic visual inspection machines. Additionally, we utilize CCD cameras and our proprietary centralized management system to capture images of the presence of components, positional deviations, differences in types, and variations in color and shape of components, thereby establishing a system for quality judgment. [Features] ■ Commitment to quality / ISO 9001 certification ■ In-house production of jigs to improve production efficiency ■ Inspection system to maintain high quality *For more details, please refer to the PDF document or feel free to contact us.
Choose the material that suits your purpose! We offer a variety of hard material balls.
Ito Manufacturing Co., Ltd., a manufacturer specializing in general scientific and physical instruments primarily in the field of powder technology, offers "ceramic balls for grinding." The hard material balls include high-purity alumina balls, high-purity alumina beads, alumina balls, zirconia balls, and silicon nitride balls. Please select the material that suits your application. 【Hard Material Balls】 ■ High-purity alumina balls (Al2O3-99.9% or higher) ■ High-purity alumina beads (Al2O3-99.99%) ■ Alumina balls (Al2O3-99.5%) ■ Zirconia balls (ZrO2-95%) ■ Silicon nitride balls (Si2N4-92%) ■ Titanium oxide balls (TiO2-77.7%, Al2O3-17.4%, SiO2-4.6%) ■ Silicon carbide balls (SiC-97% and others) ■ High-purity quartz balls, etc. *For more details, please refer to the PDF document or feel free to contact us.
We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT of devices through the integration of "control boards" and "smartphone applications." ■Example: Control, information acquisition, and analysis system for meters, switches, and sensors → Development of communication control boards such as Wi-Fi, control viewing applications, and big data servers. 1. Communication prioritized between machines and devices. Data is sent to smartphones via a Wi-Fi module using serial communication. 2. Accumulation and computation of machine information, as well as display of machine information. Broadly perform data transfer to the server, data reception, and information display. 3. Accumulation of information transferred from the application. Transmission of various service information. 4. Management of data sent from the server. It is possible to provide an introduction to operational status. ★In addition, we have numerous achievements in in-house development and contract development! ★For more details, please refer to the case materials available for download in the "PDF Download" section below.
We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Development of communication control boards for controlling machine meters, switches, sensors, etc., and for Wi-Fi integration with smartphones, as well as engine information applications. 1. Communication control of meters, switches, sensors, etc., in machines and devices via boards Data transmission to smartphones through a Wi-Fi module using serial communication. 2. Various information can be processed on the smartphone app: - Accumulation and calculation of engine information (e.g., parts lifespan and failure prediction) - Display of engine information (e.g., meters) - Display of fault diagnosis (diagnostic) information - Data transfer to the server (engine information) - Data reception from the server and information display. 3. Data management and operational status introduction in offices and other locations are made possible. ★ We also have numerous achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.
We provide consistent in-house support for substrate and software development! For IoT development, please consult KYOWA Engineering Laboratory.
At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System - Check operational status in real-time via a web browser or dedicated app - Monitor the number of units operating in real-time and the total number of units operating in a day - Access permissions can be granted only to administrators - Screen display items can be customized according to customer needs ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.
Ideal for LED lighting products with high temperatures. Significantly reduces lifespan deterioration due to reasons other than the LED chip.
We offer a variety of materials, including aluminum and copper, in different thicknesses, allowing for the production of metal base substrates with various specifications. LEDs are characterized by their energy efficiency, brightness, and long lifespan; however, one drawback is that their lifespan can be reduced for reasons other than the LED chip itself due to heat generation, which can be problematic. A metal base substrate is designed to dissipate the heat generated by the LED during operation. By using a substrate made of metals with good thermal conductivity, such as aluminum or copper, we can effectively dissipate the heat generated by the LED. For more details, please contact us or download the catalog.
Standard materials: Galapagos substrate, paper phenol, composite.
We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.
A flexible substrate with a total thickness of 100μ is possible with the thinnest material. Halogen-free options are also available.
Like one-sided flexible circuits, we have a variety of materials in stock. The thinnest option allows for flexible substrates with a total thickness of 100μ, and of course, halogen-free options are also available. For more details, please contact us or refer to our catalog.
