We can accommodate substrate board thicknesses starting from 0.04mm! We respond widely to our customers' needs.
The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond broadly to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.
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【Surface Treatment】 ■Electrolytic Thin Gold Plating (Hard and Soft) ■Electrolytic Bonding Gold Plating ■Electroless Flash Gold Plating ■Electroless Bonding Gold Plating ■Electrolytic Bonding Silver Plating ■Two-color Gold and Silver Plating ■Electroless Ni-Pd-Au Plating ■Direct Gold Plating ■Electroless Tin-Silver Alloy Plating *For more details, please refer to the PDF document or feel free to contact us.
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Sanwa Electronic Circuit manufactures printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, wireless devices, ETC and onboard equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies in the circuit board sector, we integrated these companies in 2004 and launched anew as Sanwa Electronic Circuit Co., Ltd. with a divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a specialized company in printed circuit boards for over half a century, advancing alongside the evolution of printed circuit boards. We sincerely appreciate your continued support and patronage.