A substrate that connects only the necessary interlayers without penetrating the holes in a multilayer substrate.
This is a substrate that connects only the necessary layers without penetrating holes in a multilayer board. As the number of layers in printed circuit boards has increased, the demand for this has grown. It can be manufactured using either blind via holes that connect the outer and inner layers or inner vias that embed through holes in the inner layers. Additionally, it is compatible not only with standard multilayer boards but also with multilayer flexible boards and rigid-flex boards. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ A substrate that connects only the necessary layers without penetrating holes in a multilayer board. ○ Capable of producing inner vias that embed through holes in the inner layers. ○ Capable of producing blind via holes that connect the outer layers to the inner layers. ○ Compatible with standard multilayer boards. ○ Also compatible with multilayer flexible boards and rigid-flex boards. ● For more details, please contact us or refer to the catalog.
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Company information
In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to produce a wide variety of circuit boards in a short time frame through in-house integrated production, thereby meeting these demands. "Better products, faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.
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