Example of analysis of compounds at the interface between SAC solder and Ni pads.

It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. 【Overview】 <Elemental Analysis by EDX> ■ Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. <Crystallographic Orientation Analysis by EBSD> ■ By combining it with elemental analysis using EDX, it is possible to estimate the composition. ■ In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

• Analysis and prediction system

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.

We will introduce an example of analysis of chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, suggesting the presence of many crystals. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

We will introduce an example of analysis using EBSD for screws (Cu2Zn).

The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal orientations. In this case, it was found that there is a significant orientation difference in the valleys of the screw, suggesting that there is a high level of residual stress. Additionally, it was observed that small crystal grains are distributed on the surface of the screw. [Summary] ■ Analysis Method - Observation of crystal structure using EBSD ■ Results - It was found that there is a significant orientation difference in the valleys of the screw. - It is inferred that there is a high level of residual stress. - It was also observed that small crystal grains are distributed on the surface of the screw. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

I will introduce an example of analysis using EBSD for pipes (austenite).

Aites Co., Ltd. conducts analysis of pipes using EBSD. With the EBSD method, it is possible to confirm the distribution of crystal sizes and the orientation. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■ Confirmation of crystal size distribution and orientation ■ Visualization of features that appear in the graph *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

The EBSD method allows for the estimation of crystal size distribution and residual stress.

We will introduce an example of analysis using EBSD for vias (Cu) formed in laminated substrates. The EBSD method allows for the estimation of crystal size distribution and residual stress. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■Observation of crystal structure using EBSD ・IPF map ・GROD map ・Crystal grain distribution map *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

Observe the crystal structure with EBSD! Data can be obtained for each metal.

We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). The EBSD method allows for the estimation of grain distribution and residual stress. Additionally, there are methods that can simultaneously analyze metals with different crystal structures, enabling data acquisition for each metal. 【Features】 ■ Ability to estimate grain distribution and residual stress ■ Methods available for simultaneous analysis of metals with different crystal structures, allowing for data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.

We will introduce an example of analysis using EBSD for steel (Fe). Using histograms of gradients and corresponding crystal grain distribution maps, IPF maps, and crystal grain distributions, we observe the crystal structure with EBSD. The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal directions, and by highlighting on the map, we can visualize the features that appear in the graphs. [Overview] ■ Observation of crystal structure using EBSD - IPF map - Crystal grain distribution map - Crystal grain distribution *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.

Here is an example of BGA (Ball Grid Array) analysis. For observation using a microscope, both optical microscopy and SEM are employed. In crystal analysis using the EBSD method, we utilize Phase maps, Sn Grain maps, Sn IPF maps, and Sn GROD maps, which allow for the inference of crystal states and residual stresses. [Overview] ■ Crystal analysis using the EBSD method - Phase map - Sn Grain map - Sn IPF map - Sn GROD map *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the grain boundary rotation angles, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown through histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the grain boundary rotation angles) *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials such as metals and ceramics, which are crystalline, are thought to be composed of numerous crystal lattices like cubes, and this analysis method examines the orientation of these lattices (crystal orientation). Various maps are used, including the IQ map (Image Quality Map), IPF map, GROD map, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as crystal grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a Cu plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the half-life of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, crystal grain distribution, and stress-strain *For more details, please refer to the PDF materials or feel free to contact us.

• Electrical Equipment Testing
• Other analytical equipment

We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the backscattered electron diffraction patterns generated by electron beam irradiation and maps it. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. For example, when the sample is tilted significantly in an SEM and the electron beam is irradiated, if the sample is crystalline, electron beam diffraction occurs within the sample. By indexing that pattern, it becomes possible to determine the crystal orientation at that point. By observing the differences in crystal orientation, it is possible to infer the residual stress within the crystal grains. **Features** - Obtains and maps orientation information of individual crystals - Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain - Allows inference of residual stress within crystal grains by observing differences in crystal orientation *For more details, please refer to the PDF document or feel free to contact us.*

• Electrical Equipment Testing
• Other analytical equipment

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!

This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We invite you to read it. 【Published Case Studies】 ■Observation/Cross-section preparation ■Analysis using EBSD *For more details, please refer to the PDF document or feel free to contact us.

• others

Here is an example of an analysis regarding the broken part of a crab claw that was damaged due to long-term use!

We conducted observations, elemental analysis, and EBSD analysis on the fracture area of the crab hook that was damaged due to long-term use. The elemental analysis using EDX showed that the mapping analysis revealed the distribution of Sb at the grain boundaries of the Pb crystals. Additionally, the EBSD method allowed us to confirm the orientation and misorientation of the crystal grains. [Analysis Summary] ■ Elemental Analysis by EDX - The mapping analysis revealed the distribution of Sb at the grain boundaries of the Pb crystals. ■ Analysis by EBSD - The EBSD method enabled us to confirm the orientation and misorientation of the crystal grains. *For more details, please refer to the PDF document or feel free to contact us.

• others

We will introduce an analysis example confirming that the welded area has a large distribution of grain crystals.

As an example of EBSD, we conducted an analysis of the cross-section of an aluminum welding joint from the cross-sectional direction, and we would like to introduce it. For a sample where an aluminum plate was spot-welded to an aluminum case, we prepared a cross-section of the weld and performed EBSD analysis. In the distribution of grain sizes, it was confirmed that the weld area has a larger number of large grains compared to the base material. [Analysis Overview] ■ Visualization of Grain Structure - It can be seen that the shape and size of the grains in the weld area differ from those in the base material. ■ Distribution of Grain Sizes - It is confirmed that the weld area has a greater distribution of large grains compared to the base material. *For more details, please refer to the PDF document or feel free to contact us.

• others

The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.

Here is a case study of a silicon wafer analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50 μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

• Electrical Equipment Testing
• Other analytical equipment

Visualizing the differences between two samples based on differences in crystal structure! Introducing a case study of EBSD analysis.

Here is a case study comparing two types of brass with similar elemental compositions. When spectral analysis was conducted using SEM-EDX, it was found that brass primarily consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. Additionally, an EBSD analysis was performed to check the phase map, revealing that a portion of sample 1 exhibited a β phase with a different crystal structure. 【Case Overview】 <Comparison of Two Brass Materials through Elemental Analysis> ■ Analysis Method: SEM-EDX Analysis ■ Results - Spectral analysis indicated that brass primarily consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. - Surface analysis was conducted for elements Cu and Zn, and no bias in the in-plane distribution was observed. *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection

Based on practical experience in support companies and business companies, SBS Marketing Co., Ltd. provides consulting services related to marketing, sales promotion, and customer acquisition mainly in the BtoB (business-to-business) sector. On September 23, 2025 (Tuesday), they published a page titled "Easier to Optimize the Allocation of Management Resources!? 'Product Portfolio Management (PPM)'". 'Product Portfolio Management' allows for the optimal allocation of management resources by evaluating one's business along two axes: "market growth potential" and "market share," and classifying it into four quadrants. The page explains the benefits that can be realized by utilizing it, the two axes and four quadrants that make it up, and the associated risks. (Page Overview: Excerpts) ■ What is 'Product Portfolio Management'? ■ What can be achieved through 'PPM'? ■ Components of 'PPM' (vertical and horizontal axes) ■ Components of 'PPM' (four quadrants) ■ Two risks associated with 'PPM' (DL content only) ▼ For more details, please visit this page. https://sbsmarketing.co.jp/blog/ppm-2025-09/

An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

The facility operating the nurse call system has made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Full and empty management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, achieving efficient parking lot operations. ■ For large parking lots, the "floor management method" and "block management method," which focus on cost reduction, are recommended. Sensors are installed at regular intervals to count the number of vehicles passing through. This method offers the advantage of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 ■ For smaller scale operations, the "space management method," which installs sensors in each parking space to display availability with high accuracy, is recommended. By ensuring accurate full and empty displays, it helps prevent unnecessary entry of new vehicles and enables safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from Wednesday, October 1 to Friday, October 3, 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies on solving issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wed) - October 3 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK