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  6. Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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last updated:Oct 23, 2024

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It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. 【Overview】 <Elemental Analysis by EDX> ■ Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. <Crystallographic Orientation Analysis by EBSD> ■ By combining it with elemental analysis using EDX, it is possible to estimate the composition. ■ In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

    Analysis and prediction system
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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

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[Analysis Example by EBSD] Chip

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[Example of Analysis by EBSD] Screw

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[Example of analysis using EBSD] Via

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[Example of analysis using EBSD] High melting point solder

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[Analysis Example Using EBSD] Steel Plate

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Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints.

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EBSD analysis

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Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

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[Data] Whisker Analysis using EBSD

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[Analysis Example by EBSD] Crab Claw

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Example of analysis of compounds at the SAC solder and Ni pad interface.

Example of analysis of compounds at the SAC solder and Ni pad interface.

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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