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We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed. Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, raising suspicions that the undercoat layer may be exposed. Next, cross-sectional samples were prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which revealed that the protective film and resistive material appeared to be melted. It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface. It is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive material to melt and resulting in a change in resistance value (leading to an open circuit).

To prevent shock and vibration, low-rebound and vibration-absorbing materials are used in various situations. The indicator of these properties is viscoelasticity. This document presents examples of evaluating the rebound and vibration-absorbing properties of rubber materials through dynamic mechanical analysis (DMA). From the dynamic viscoelasticity concerning temperature, it is possible to predict the vibration-absorbing and rebound properties of materials in their usage environment. From the dynamic viscoelasticity concerning frequency, it can be utilized to predict damping performance against seismic motion, braking performance of tires, and in the low-frequency range, it can be used to predict long-term deformation behavior such as creep.

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM

This is a case study comparing cross-section preparation methods on the surface coating layer of a golf ball, observing the effects of heat from CP processing. There are two layers of coating on the outermost layer of the cover, and a comparison of cross-section preparation methods was conducted using this coating layer. SEM observations of cross-sections prepared using three different methods were performed. While cross-section preparation of soft materials is effectively done using cross-section ion milling (CP), the physical properties may change due to the heat generated during CP processing. In such cases, cross-section preparation using cryo-CP, which mitigates the effects of processing heat through cooling, is effective. 【Cross-section preparation methods】 ■ Mechanical polishing ■ CP ■ Cryo CP (-50°C)

This document introduces examples of visualizing the internal state of capsules in three dimensions and obtaining elemental information data through EDX analysis of powders. In the X-ray CT analysis, it was observed that there were slight air gaps inside the capsule, and it was visually confirmed that the particle size was not uniform, with some larger particles included. In the SEM-EDX analysis, elemental analysis was conducted on any particles contained within. At an acceleration voltage of 15 kV, carbon (C), oxygen (O), calcium (Ca), chlorine (Cl), iron (Fe), phosphorus (P), and sodium (Na) were detected. [Analysis Details] ■ X-ray CT Analysis: X-ray transmission observation of the capsule ■ SEM-EDX Analysis: Elemental analysis of any particles contained within

We would like to introduce the dynamic viscoelastic measurement of CFRP conducted by our company using the bending mode. When performing dynamic viscoelastic measurements using DMA, CFRP is generally highly elastic, and it is considered that measurements using the bending mode are suitable for its applications. While any mode of measurement can be conducted as long as the size requirements are met, it is ideal to select appropriate conditions based on the material's shape, elastic modulus, and the purpose of the measurement. If you have any subjects for which you would like to measure dynamic viscoelasticity, please feel free to consult us. 【Measurement Modes】 ■ Tensile ■ Compression ■ Bending (two-point/one-point/three-point) ■ Shear

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has been improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which integrates multiple frames while correcting for drift.

We would like to introduce the "Tensile Property Evaluation Using a Strain Gauge for High-Extension Flexible Materials" that we offer. Tensile tests on NR rubber were conducted using both contact-type (suitable for high-extension and soft materials) and non-contact type (video-based) strain gauges, and the results were compared. To accurately determine strain in tensile tests, it is necessary to select an appropriate strain gauge and testing conditions based on the target material and measurement objectives. We will provide suggestions tailored to your consultation needs. 【Comparison of Strain Gauges】 ■ Contact-type (suitable for high-extension and soft materials) - Suitable for materials with large extensions - Not suitable for brittle or easily deformable materials - Cannot be used in a constant temperature chamber ■ Non-contact type - No restrictions on materials

At Aites Co., Ltd., we conduct "Poisson's ratio measurement." Poisson's ratio is the ratio of longitudinal to lateral strain that occurs when a load is applied to an object, and it is necessary for strength calculations of materials. In the downloadable materials, we introduce the results of attaching strain gauges to test specimens, applying tensile loads using a universal testing machine, and examining the longitudinal and lateral strains obtained from the strain gauges. Please feel free to download and take a look. [Measurement Examples] ■ Measurement using strain gauges ■ Measurement using video extensometers

It is a measuring instrument that can non-contact measure surface shapes such as concavities, undulations, and surface roughness. We will introduce "Heating Deformation Observation" using a 3D shape measuring machine. First, we acquire a 3D texture image at room temperature, and then we acquire a 3D texture image in a heated state. By overlaying the texture images before and after heating and checking the differential texture image and cross-sectional profile, it can be seen that the substrate in the heated state has higher ends and a lower center compared to the room temperature state. 【Features】 ■ It is possible to visualize and confirm shape changes during heating. ■ Profiles can be created according to your preferences, such as temperature rise speed, waiting time, and temperature settings.

We will introduce a case where cross-sections were created and observed for the adhesive parts of pull-back car tires, categorized by method. Upon conducting SEM observations of the created cross-sections, fillers present within the rubber were confirmed. It was found that the dispersion state of the fillers, both large and small, and the appearance of the adhesive interface were not clear with liquid nitrogen fracturing or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for a clear observation of the dispersion state of the fillers contained in the rubber and the appearance of the adhesive interface with the plastic substrate. 【Cross-section Preparation Methods】 ■ Liquid Nitrogen Fracturing (-196℃) ■ Mechanical Polishing ■ Cryo CP (-150℃)

In our company, we conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, when heat generation prevention treatment is applied, even with a large amount of resin, we were able to keep the heat generation during curing within 30°C. 【Measurement Results】 ■ Without heat generation prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat generation prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C.

Our company conducts "rubber thermal aging tests" that help evaluate the properties of materials in actual usage environments. Using a method compliant with JIS K6257 (Method for determining thermal aging characteristics of vulcanized rubber and thermoplastic rubber), rubber test pieces are suspended in a gear oven to produce specimens with varying heat treatment times. Additionally, tensile tests are performed on heated natural rubber (NR) to investigate changes in mechanical properties, while hardness is measured simultaneously. Changes in the properties of the rubber are also examined, confirming that rubber elasticity is lost and the material becomes harder with heating. [Property Evaluation] ■ Heating Temperature: 120℃ Tensile Test: Universal Testing Machine ■ Hardness Measurement: Micro Rubber Durometer

Our company's "component analysis of organic substances" often utilizes FT-IR and GC/MS. In FT-IR measurements, it is possible to analyze the main components of organic substances by comparing them with the IR spectra of known substances. Additionally, if you want to analyze not only the main components of unknown substances but also trace amounts of organic substances such as additives, we recommend conducting GC/MS measurements. 【Features】 <FT-IR Measurement> ■ Can analyze the main components of organic substances ■ Can also analyze some inorganic substances

We would like to introduce the "substrate deformation observation" using a 3D shape measurement device. By applying pressure to the PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement device (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure

We would like to introduce "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above. Although it cannot be clearly seen in the X-ray image, the lens is embedded in the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is unnecessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. ■ There is no color filter layer since color information is unnecessary for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode.

At Aites Co., Ltd., we conduct "NMR analysis of liquid crystal compounds." NMR is an analytical method that reveals the connections between atoms that make up a molecule, and it is used alongside mass spectrometry and infrared spectroscopy for determining the structure of compounds. In the downloadable materials, we highlight the 1H NMR, 13C NMR, and DEPT measurements of 4-butoxy-4'-cyanobiphenyl (CAS number 52709-87-2), which is used as a liquid crystal component, and introduce the information obtained from NMR. Please feel free to download and take a look. 【Measurement Examples】 ■ 1H NMR measurement ■ 13C NMR measurement and DEPT measurement ■ Other NMR measurement techniques

We would like to introduce our "Appearance Observation and Measurement Service." We are equipped with a variety of devices to meet your needs, including appearance observation before and after reliability testing, solder joint observation, as well as dimensional and surface roughness measurements of various components. You can also leave the pre-observation processing to us. Our company has IPC-A-610 certified IPC specialists on staff. We provide assistance and consultation for observations in accordance with international standards, addressing various concerns related to observations. 【Equipment】 ■VHX-X1 ■VHX-5000 ■VR-6200 ■VK-X200

At our company, we created cross-sections of the CMOS image sensor components associated with VR goggles manufactured by Company A through mechanical polishing while keeping the components in their original state, and conducted structural observations of the CMOS sensor components. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, one mounted on a circuit board and the other not mounted. In the mounted module, a slight delay in temperature change was observed, which correspondingly resulted in a slower change in strain. This is believed to be due to the delayed transfer of heat to the module when it is mounted. [Test Overview] ■ Strain Gauge Used - Foil strain gauge for composite materials: Suitable linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles

At AITES Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We assist with observations in accordance with international standards, offer consultations, and address various concerns related to observations. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult us when needed. 【Service Contents】 ■ Reliability Testing ■ Solder Joint Observation ■ Whisker Observation ■ Cross-Sectional Observation

Aites will be exhibiting at the Mate2025 31st Symposium on "Micro Joining and Mounting Technologies in Electronics" held at Pacifico Yokohama Conference Center. We will be introducing our advanced analysis technology services, so please stop by. We sincerely look forward to your visit.