Crystal analysis by EBSD: Intermetallic compounds in solder joints

We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the grain boundary rotation angles, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown through histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the grain boundary rotation angles) *For more details, please refer to the PDF document or feel free to contact us.

Electrical Equipment TestingOther analytical equipment